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5580202001F
Dialight
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1 | 558 LED PMI 0.155-0.158" Green, Tintd, Diff, 5 VDC, Straight Leads | Other | 5580202001F |
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TPS65580PWP
Texas Instruments
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1 | 4.5 to 18V Input, 2.5A/1.5A/1.5A Triple Sync. Step-Down Converter w/ Advanced D-CAP2™ | Small Outline Packages | TPS65580PWP |
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TL5580IDR
Texas Instruments
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1 | Dual 12MHz, low-noise wide-bandwidth precision amplifier | Small Outline Packages | TL5580IDR |
3
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PIC16C558-04/SO
Microchip
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1 | IC, Processor, Controller, 4MHz, EPROM, SMT, PIC16C558-04/SO | Small Outline Packages | PIC16C558-04/SO |
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1155580000
Weidmüller
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1 | PCB connector (board connection), 320 V, 24 A, Pitch in mm: 5.08, Number of poles: 2, THT solder connection, Box | Other | 1155580000 |
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XC9276D5580R-G
Torex
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1 | Ultra-Low Quiescent Current, Synchronous Step-Down PFM DC/DC Converter with Output voltage selectable function, WLP-6-03 | Other | XC9276D5580R-G |
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203558-0807
Molex
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1 | Headers & Wire Housings PicoClasp Hdr SMT SR RA 8CKT W/PL Au0.38 | Other | 203558-0807 |
3
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5580201003F
Dialight
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1 | LED Panel Indicator Green Diffused 40° 2.1V 25mA Wire Leads - 6" (152.40mm) | Other | 5580201003F |
3
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TL5580AID
Texas Instruments
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1 | TEXAS INSTRUMENTS - TL5580AID - Operational Amplifier, Dual, 2 Amplifier, 12 MHz, 5 V/µs, ± 2V to ± 16V, SOIC, 8 Pins | Small Outline Packages | TL5580AID |
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TL5580AIP
Texas Instruments
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1 | Dual 12MHz, improved offset, low-noise wide-bandwidth precision amplifier | Dual-In-Line Packages | TL5580AIP |
3
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CMF5580K000BHEB
Vishay
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1 | 80 kOhms ±0.1% 0.5W, 1/2W Through Hole Resistor Axial Flame Retardant Coating, Moisture Resistant, Safety Metal Film | Resistors, Axial Diameter Horizontal Mounting | CMF5580K000BHEB |
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2035580907
Molex
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1 | 1.00mm Pitch, Pico-Clasp PCB Header, Single Row, Right-Angle, Surface Mount, 0.38µm Gold Plated, Inner Positive Lock, 9 Circuits, Natural | Other | 2035580907 |
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0455580003
Molex
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1 | Mini-Fit Jr. Header, Dual Row, Right-Angle, 6 Circuits, PA Polyamide Nylon 6/6 94V-0, Tin (Sn) Plating, without Drain Holes | Other | 0455580003 |
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74435580680
Würth Elektronik
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1 | WE-HCI SMT Flat Wire High Current Inductor Size 2212; L = 6.8 µH ±20%; IR = 28.5 A; Isat = 31.0 A; RDC = 2.10 mΩ | Other | 74435580680 |
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76165-5807
Molex
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1 | High Speed / Modular Connectors Impact BP 3x8 GR Sn Impact BP 3x8 GR Sn | Other | 76165-5807 |
3
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203558-0907
Molex
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1 | Headers & Wire Housings PicoClasp Hdr SMT SR RA 9CKT W/PL Au0.38 | Other | 203558-0907 |
3
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ROS-5580-119+
Mini-Circuits
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1 | Frequency Doubling 5440 to 5580 MHz | Other | ROS-5580-119+ |
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1755804
Phoenix Contact
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1 | MSTBVA 2,5/ 9-G-5,08 - PCB headers, nominal cross section: 2.5 mm2, color: green, nominal current: 12 A, rated voltage (III/2): 320 V, contact surface: Sn, contact connection type: Pin, number of potentials: 9, number of rows: 1, number of positions: 9, number of connections: 9, product range: MSTBVA 2,5/..-G, pitch: 5.08 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 3.9 mm, number of solder pins per potential: 1, plug-in system: COMBICON MSTB 2,5, Pin connector patter | Other | 1755804 |
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BUK6Y55-80PX
Nexperia
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1 | 80 V, P-channel Trench MOSFET | Other | BUK6Y55-80PX |
3
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SIT3808AC-D2-33EE-5.655800
SiTime
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1 | 1 MHz to 80 MHz High Performance MEMS VCXO, 7 x 5mm, 6-Pin Package | Other | SIT3808AC-D2-33EE-5.655800 |
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2035580507
Molex
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1 | 1.00mm Pitch, Pico-Clasp PCB Header, Single Row, Right-Angle, Surface Mount, 0.38µm Gold Plated, Friction Lock, 5 Circuits, Natural | Other | 2035580507 |
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1875580000
Weidmüller
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1 | PCB terminal, 320 V, 17.5 A, Pitch in mm: 5.08, 1.5 mm², Number of poles: 8, PUSH IN with actuator, THT/THR solder connection, 180°, Tape | Other | 1875580000 |
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5580101001F
Dialight
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1 | LED Panel Indicator Red Diffused 1.8 – 3.3 V DC, 20mA, Intensity 8.7,-25 °C to +85 °C | Other | 5580101001F |
3
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5558065-1
TE Connectivity
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1 | Body Features: Connector Profile Low | Modular Jack Latch Orientation Standard - Latch Down | Configuration Features: Number of Positions 10 | PCB Mount Orientation Right Angle | Number of Loaded Positions 10 | Port Configuration Single Port | Connector Contact Density Standard | Port Matrix Configuration 1 x 1 | Status Light Type Not Illuminated | Contact Features: Contact Mating Area Plating Material Thickness 1.27 MICM | PCB Contact Termination Area Plating Material Tin | Contact Underplating Material Ni | Other | 5558065-1 |
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PIC16C558-04/P
Microchip
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1 | 8-Bit CMOS Microcontrollers | Dual-In-Line Packages | PIC16C558-04/P |
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