671-1 Model Download Search Results
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5227671-1
TE Connectivity
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1 | Body Features: Body Plating Material Nickel | Body Material Zinc | Configuration Features: Number of Positions 1 | PCB Mount Orientation Vertical | Number of Coaxial Contacts 1 | Contact Features: RF Connector Center Contact Material Phosphor Bronze | RF Connector Center Contact Plating Thickness 5080 MICIN | RF Connector Center Contact Underplating Material Nickel | RF Connector Center Contact Plating Material Tin | Dimensions: Profile Height from PCB 1.375 INCH | RF Connector Mated Outer Diameter (Approxi | Other | 5227671-1 |
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236-711
Wago
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1 | Stackable PCB terminal block; 2.5 mm²; Pin spacing 5/5.08 mm; 1-pole; CAGE CLAMP®; commoning option | Other | 236-711 |
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505567-1181
Molex
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1 | Headers & Wire Housings MicroLockPlus 1.25MM RA HDR 11P BLK GLD | Other | 505567-1181 |
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TMS320C6711DGDP250
Texas Instruments
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1 | Texas Instruments TMS320C6711DGDP250, 32bit Digital Signal Processor 250MHz 72 kB EPROM 272-Pin BGA | BGA | TMS320C6711DGDP250 |
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M27/367-11
API Delevan
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1 | FIXED IND 1.5UH 4.45A 20 MOHM | Inductors Precision Moulded | M27/367-11 |
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LT6711A
Analog Devices
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1 | LONTIUM SEMICONDUCTORCORPORATION | Quad Flat No-Lead | LT6711A |
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AZ7671-1A-12D
Zettler Group
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1 | 10A SPDT SUBMINIATURE POWER RELAY Coil Resistance ± 10% 320 Nominal Coil VDC 12 , Must Operate VDC 9.0 | Other | AZ7671-1A-12D |
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AZ7671-1C-12DE
Zettler Group
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1 | General Purpose Relay SPDT (1 Form C) 12VDC Coil Through Hole | Other | AZ7671-1C-12DE |
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69167-110
Amphenol Communications Solutions
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1 | PV®Wire-to-Board Connector System, 2 Wall Shrouded vertical header - Through Hole - Single row - 10 Positions, 2.54mm (0.100in) pitch. | Header, Shrouded - Straight PTH Box | 69167-110 |
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MAX96711GTJ/V+
Analog Devices
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1 | 14-Bit GMSL Serializer with High Immunity/Bandwidth Mode and Coax/STP Cable Drive | Quad Flat No-Lead | MAX96711GTJ/V+ |
3
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09654696711
HARTING
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1 | D-Sub THR/SMC 37pin male straight, stamped, with board locks, M3, PL2 | Other | 09654696711 |
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TPS826711SIPR
Texas Instruments
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1 | 600mA Fully Integrated, Low Noise Step-Down Converter Module in MicroSiP™ Package | Other | TPS826711SIPR |
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67-11/GHC-AT2V1/2T
Everlight
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1 | Standard LEDs - SMD Brillant Green | Other | 67-11/GHC-AT2V1/2T |
3
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BGA2867,115
NXP
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1 | NXP - BGA2867,115 - MMIC RF AMP, 2.2GHZ, 26.4DB, SOT-363-6 | SOT23 (6-Pin) | BGA2867,115 |
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86093967113H55ELF
Amphenol Communications Solutions
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1 | DIN Headers & Receptacles, Backplane Connector, Header, Right Angle, Through Hole, Style C, 96 ways, Class II, with Harpoons | Other | 86093967113H55ELF |
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5055671131
Molex
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1 | 1.25mm Pitch, Micro-Lock Plus PCB Header, Single Row, Right-Angle, Surface Mount, 0.38µm Gold Plating, Positive Lock, 11 Circuits, Black | Other | 5055671131 |
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5055671171
Molex
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1 | 1.25mm Pitch, Micro-Lock Plus PCB Header, Single Row, Right-Angle, Surface Mount, Tin-Bismuth Plating, Positive Lock, 11 Circuits, Black | Other | 5055671171 |
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6711-RC
Bourns
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1 | FIXED IND 50UH 9.5A 12 MOHM TH | Other | 6711-RC |
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67-11-T1C-GV2W2F-2T
Everlight
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1 | 67-11-T1C-GV2W2F-2T | LED Moulded | 67-11-T1C-GV2W2F-2T |
2
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6711-0-00-15-00-00-03-0
Mill-Max
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1 | Circuit Board Hardware - PCB Nail Head Pin TH Sldr MT in .043 hole | Other | 6711-0-00-15-00-00-03-0 |
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TMS32C6711DZDPA167
Texas Instruments
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1 | Floating-Point Digital Signal Processors | BGA | TMS32C6711DZDPA167 |
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TLE6711GL
Infineon
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1 | Voltage Regulators - Switching Regulators Multifunctional Volt Regulator & Watchdog | Small Outline Packages | TLE6711GL |
3
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PIC12C671-10I/P
Microchip
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1 | 8-Bit CMOS Microcontroller | Dual-In-Line Packages | PIC12C671-10I/P |
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1-1986711-5
TE Connectivity
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1 | 15 Position Wire to Board Terminal Block Horizontal with Board 0.197" (5.00mm) Through Hole | Other | 1-1986711-5 |
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MAL211671109E3
Vishay
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1 | Aluminum Electrolytic Capacitors - Radial Leaded 50V 10uF 20% | Capacitor, Polarized Radial Diameter | MAL211671109E3 |
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