73403 Model Download Search Results
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73403-5112
Molex
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1 | RF Connectors / Coaxial Connectors SMB JACK FAKRA RA TH KEY C 50OHM BLU | Other | 73403-5112 |
3
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73403-5123
Molex
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1 | RF Connectors / Coaxial Connectors FAKRA SMB JACK RA TH RUHOLE KEY OPT N | Other | 73403-5123 |
3
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73403-5120
Molex
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1 | RF Connectors / Coaxial Connectors | Other | 73403-5120 |
3
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73403-6090
Molex
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1 | Molex 50 Ohms, FAKRA SMB Jack, Right Angle, Through Hole, Zinc Alloy/Brass Body, Pin in Paste, with Latch Up, Tape and Reel, Keying Option Z, Water Blue | Other | 73403-6090 |
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1734037-6
TE Connectivity
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1 | Board to Board & Mezzanine Connectors 050 RCPT 60pos 30 Au | Other | 1734037-6 |
3
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1734035-1
TE Connectivity
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1 | Body Features: Shell Plating Material Nickel | Offset 0 MM | Connector Profile Mini | Configuration Features: Number of Ports 1 | Number of Positions 5 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Contact Current Rating (Max) 1 AMP | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | Dimensions: PCB Thickness (Recommended) .062 INCH | PCB Thickness (Recommended) 1.57 MM | Housing Features: Cent | Other | 1734035-1 |
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1734035-4
TE Connectivity
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1 | Body Features: Connector Profile Mini | Offset 0 MM | Shell Plating Material Nickel | Configuration Features: Number of Ports 1 | Number of Positions 5 | Contact Features: Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness .76 MICM | Contact Current Rating (Max) 1 AMP | Dimensions: PCB Thickness (Recommended) .062 INCH | PCB Thickness (Recommended) 1.57 MM | Housing Features: Hous | Other | 1734035-4 |
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1-1734037-0
TE Connectivity
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1 | Champ 050 series 100pos,Au over PdNi | Other | 1-1734037-0 |
3
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232-734/031-000
Wago
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1 | THT female header; straight; Pin spacing 7.5 mm; 4-pole; clamping collar; 0.6 x 1.0 mm solder pin | Other | 232-734/031-000 |
3
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1-1734035-1
TE Connectivity
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1 | USB Connectors 5P MINI TYPE B RECPT SMT W/O POSTS | Other | 1-1734035-1 |
3
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HM73-403R3LFTR13
TT Electronics
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1 | Power Inductors - SMD 0.3uH 20% SHLD LOW PRFL SM IND | Other | HM73-403R3LFTR13 |
3
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1734037-5
TE Connectivity
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1 | Board to Board & Mezzanine Connectors R.A. RECPT 50P Series I hi-temp | Other | 1734037-5 |
3
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1734035-2
TE Connectivity
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1 | Body Features: Offset 0 MM | Connector Profile Mini | Shell Plating Material Nickel | Configuration Features: Number of Ports 1 | Number of Positions 5 | Contact Features: Contact Mating Area Plating Material Gold Flash over Palladium Nickel | Contact Current Rating (Max) 1 AMP | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 29.92 MICIN | Dimensions: PCB Thickness (Recommended) 1.57 MM | PCB Thickness (Recommended) .062 INCH | Housing Features: Cent | Other | 1734035-2 |
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1734037-4
TE Connectivity
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1 | Body Features: PCB Retention Feature Material Brass | Connector Profile Standard | PCB Retention Feature Plating Material Tin | Configuration Features: Number of Positions 40 | Stackable No | PCB Mount Orientation Right Angle | Contact Features: Mating Tab Width .03 INCH | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | Contact Mating Area Plating Material Gold Flash | PCB Contact Termination Area Plating Material Thickness 149.9997 MICIN | Contact Type Socket | Contact Mating Area Plati | Other | 1734037-4 |
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232-734/039-000
Wago
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1 | THT female header; straight; Pin spacing 7.5 mm; 4-pole; Locking lever; 0.6 x 1.0 mm solder pin | Other | 232-734/039-000 |
3
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1-1734035-2
TE Connectivity
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1 | Conn Mini USB 2.0 Type B RCP 5 POS 0.8mm Solder RA SMD 5 Terminal 1 Port T/R | Other | 1-1734035-2 |
3
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1734035-3
TE Connectivity
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1 | Body Features: Offset 0 MM | Connector Profile Mini | Shell Plating Material Nickel | Configuration Features: Number of Positions 5 | Number of Ports 1 | Contact Features: Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | Contact Current Rating (Max) 1 AMP | Contact Mating Area Plating Material Thickness .76 MICM | Dimensions: PCB Thickness (Recommended) 1.57 MM | PCB Thickness (Recommended) .062 INCH | Housing Features: Hous | Other | 1734035-3 |
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1-1734037-6
TE Connectivity
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1 | PCB Mount Receptacle, Right Angle, Board-to-Board, 160 Position,1.27 mm [.05 in] Centerline, Gold Flash, Through Hole - Solder, CHAMP .050 Series I | Other | 1-1734037-6 |
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1734037-1
TE Connectivity
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1 | Body Features: PCB Retention Feature Material Brass | Primary Product Color Black | Connector Profile Standard | PCB Retention Feature Plating Material Tin | Configuration Features: PCB Mount Orientation Right Angle | Number of Positions 80 | Stackable No | Contact Features: Mating Tab Width .75 MM | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | Contact Mating Area Plating Material Gold Flash | Contact Layout Matrix | Mating Tab Width .03 INCH | Contact Type Socket | Mating Tab Thickne | Other | 1734037-1 |
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73403-5744
Molex
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1 | RF SMB Connector, | 73403-5744 |
1
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73403-6813
Molex
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1 | RF SMB/SSMB Connector, | 73403-6813 |
1
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73403-6805
Molex
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1 | RF SMB/SSMB Connector, | 73403-6805 |
1
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73403-6812
Molex
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1 | RF SMB/SSMB Connector, | 73403-6812 |
1
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73403-5743
Molex
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1 | RF Connectors / Coaxial Connectors FAKRA SMB PLG 50HMS KY D BORDX VIOL | 73403-5743 |
1
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73403-5752
Molex
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1 | RF SMB Connector | 73403-5752 |
1
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