757-9 Model Download Search Results
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757-9
Winchester Interconnect
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1 | PCB Terminal | 757-9 |
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757-9
Litton Industries
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1 | PCB Terminal | 757-9 |
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AD7579JPZ
Analog Devices
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1 | AD7579JPZ, 10 bit ADC Differential,, Parallel, 28-Pin PLCC | Plastic Leaded Chip Carrier | AD7579JPZ |
3
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LFTCXO075792
IQD
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1 | TCXO Oscillators IQXT-220-1 Clipped Sine +/-0.28ppm -40 to 85C 3.3V 3.2 x 2.5 x 1.0 | Other | LFTCXO075792 |
2
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LFTCXO075793
IQD
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1 | 12.8 MHz TCXO Clipped Sine Wave Oscillator 3.3V 4-SMD, No Lead | Other | LFTCXO075793 |
3
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1375795-1
TE Connectivity
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1 | 104 Position, 2.54 mm [.1 in] Centerline, AMPMODU PC/104, PC/104 Connectors | Other | 1375795-1 |
3
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LFTCXO075792CUTT
IQD
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1 | TCXO Oscillators 10.0MHz .28ppm 3.3V -40C +85C | Other | LFTCXO075792CUTT |
3
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CSD17579Q5AT
Texas Instruments
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1 | CSD17579Q5A 30-V N-Channel NexFET™ Power MOSFET | Other | CSD17579Q5AT |
3
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MAX17579ATC+T
Analog Devices
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1 | 4.5V to 60V, 300mA High-Efficiency, Synchronous, Inverting Output DC-DC Converters 12 TDFN-EP 3mm x 3mm | Small Outline No-lead | MAX17579ATC+T |
3
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CSD17579Q3A
Texas Instruments
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1 | CSD17579Q3A 30 V N-Channel NexFET™ Power MOSFET | Other | CSD17579Q3A |
3
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1-87579-2
TE Connectivity
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1 | CONN HEADER R/A 30POS 2.54MM | Other | 1-87579-2 |
3
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AD7579JNZ
Analog Devices
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1 | Analog Devices AD7579JNZ, 10 bit Parallel ADC,, 24-Pin PDIP | Dual-In-Line Packages | AD7579JNZ |
3
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75791-0001
Molex
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1 | AMC B+ EXTD HEIGHT VERS 170 CKT TIN/002 | Other | 75791-0001 |
3
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1-1437579-0
TE Connectivity
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1 | Slide Switches SLIDE SWITCH P/C | Other | 1-1437579-0 |
3
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1975790000
Weidmüller
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1 | PCB connector (board connection), 160 V, 17.5 A, Pitch in mm: 3.81, Number of poles: 10, THT/THR solder connection, Box | Other | 1975790000 |
3
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1375795-4
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Positions 104 | Stacking Configuration Stack Through | Number of Loaded Positions 104 | Contact Features: Contact Mating Area Plating Material Gold | Contact Current Rating (Max) 3 AMP | Contact Base Material Phosphor Bronze | Electrical Characteristics: Dielectric Withstanding Voltage (Max) 500 VAC | Insulation Resistance 1000 MEGO | Housing Features: Centerline (Pitch) .1 INCH | Housing Material Nylon - GF | Centerline (Pitch) | Other | 1375795-4 |
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1375799-4
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Stacking Configuration Stack Through | Number of Positions 120 | Number of Loaded Positions 120 | Contact Features: Contact Base Material Phosphor Bronze | Contact Current Rating (Max) 3 AMP | Contact Mating Area Plating Material Gold | Electrical Characteristics: Dielectric Withstanding Voltage (Max) 500 VAC | Insulation Resistance 1000 MEGO | Housing Features: Centerline (Pitch) .079 INCH | Housing Material Nylon - GF | Centerline (Pitch | Other | 1375799-4 |
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MAX17579ATC+
Analog Devices
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1 | Switching Voltage Regulators 4.5V to 60V, 1A High-Efficiency, Synchronous, Inverting Output DC-DC Converter with Internal Compensation | Small Outline No-lead | MAX17579ATC+ |
3
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1375795-5
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Positions 104 | Number of Loaded Positions 102 | Stacking Configuration Stack Through | Contact Features: Contact Mating Area Plating Material Gold | Contact Base Material Phosphor Bronze | Contact Current Rating (Max) 3 AMP | Electrical Characteristics: Dielectric Withstanding Voltage (Max) 500 VAC | Insulation Resistance 1000 MEGO | Housing Features: Centerline (Pitch) 2.54 MM | Centerline (Pitch) .1 INCH | Housing Material Nyl | Other | 1375795-5 |
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CSD17579Q5A
Texas Instruments
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1 | CSD17579Q5A 30-V N-Channel NexFET™ Power MOSFET | Other | CSD17579Q5A |
3
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1827579
Phoenix Contact
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1 | CC 2,5/18-GF-5,08-LR P26THR - PCB headers, nominal cross section: 2.5 mm2, color: black, nominal current: 12 A, rated voltage (III/2): 320 V, contact surface: Sn, contact connection type: Pin, number of potentials: 18, number of rows: 1, number of positions: 18, number of connections: 18, product range: CC 2,5/..-GF-LR, pitch: 5.08 mm, mounting: THR soldering / wave soldering, pin layout: Linear pinning, solder pin [P]: 2.6 mm, number of solder pins per potential: 1, plug-in system: COMBICON MSTB | Other | 1827579 |
3
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1375795-2
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Loaded Positions 104 | Stacking Configuration Stack Through | Number of Positions 104 | Contact Features: Contact Current Rating (Max) 3 AMP | Contact Mating Area Plating Material Gold | Contact Base Material Phosphor Bronze | Electrical Characteristics: Insulation Resistance 1000 MEGO | Dielectric Withstanding Voltage (Max) 500 VAC | Housing Features: Centerline (Pitch) .1 INCH | Housing Material Nylon - GF | Centerline (Pitch) | Other | 1375795-2 |
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757-95
Litton Industries
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1 | PCB Terminal | 757-95 |
0
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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757-95
Winchester Interconnect
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1 | PCB Terminal | 757-95 |
0
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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757-95-12
Litton Industries
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1 | PCB Terminal | 757-95-12 |
0
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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