8-173 Model Download Search Results
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8-173
Cinch Connectivity Solutions
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1 | Barrier Strip Terminal Block, 15A, 1 Deck(s) | 8-173 |
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8-1734516-0
TE Connectivity
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1 | Board to Board & Mezzanine Connectors RCPT 2MM 30P VRT SMT 30AU" W/O LOCK | Other | 8-1734516-0 |
3
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8-1734774-1
TE Connectivity
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1 | PCI EXP 2.3L 64 POS BLK 15u" | Other | 8-1734774-1 |
3
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45984-8173
Molex
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1 | 1.27mm, 12.00mm Pitch, EXTreme LPHPower Receptacle Header, Right-Angle, 8 Power Contacts, 36 Signal Contacts, Select Gold (Au) Plating, for 1.57mm Thick PC Board | Other | 45984-8173 |
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HCPL-817-300E
Avago Technologies
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1 | Current Transfer Ratio(CTR: min. 50% at IF = 5 mA, VCE = 5V) High input-output isolation voltage (Viso = 5000 Vrms) Response time(tr: typ., 4 µs at VCE = 2V, IC = 2 mA, RL = 100Ω) Compact dual-inline package UL approved CSA approved IEC/EN/DIN EN 60747-5-5 approved | Small Outline Packages | HCPL-817-300E |
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MKT1817310405
Vishay
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1 | MKT 10NF 110% 400VDC PITCH 5MM | Other | MKT1817310405 |
3
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FOD8173S
onsemi
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1 | UL1577, 5,000 VACRMS for 1 Minute; FOD817: 50-600%; DIN EN/IEC60747-5-5; FOD817A: 80-160%; FOD817B: 130-260%; FOD814A: 50-150%; Current Transfer Ratio in Selected Groups:; Minimum BVCEO of 70 V Guaranteed; FOD817C: 200-400%; FOD817D: 300-600%; FOD814: 20-300%; AC Input Response (FOD814); Safety and Regulatory Approvals | Other | FOD8173S |
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281739-2
TE Connectivity
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1 | PCB Mount Header, Vertical, Wire-to-Board, 4 Position, 2.54 mm [.1 in] Centerline, Partially Shrouded, Tin (Sn), AMPMODU HE 13/HE 14 | Other | 281739-2 |
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45985-8173
Molex
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1 | EXTreme LPHPower Header, Right-Angle, 8 Power Contacts, 36 Signal Contacts, Select Gold (Au) Plating, for 1.57mm Thick PC Board | Other | 45985-8173 |
3
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FOD8173
onsemi
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1 | 20 kV/µs Minimum CMTI; 20 Mbit/sec Date Rate (NRZ) 55ns max. Propagation Delay 20ns max. Pulse Width Distortion; 3.3 V and 5 V CMOS Compatibility; Specifications Guaranteed Over 3 V to 5.5 V supply voltage and −40 to 100°C extended industrial temperature range; UL1577, 5,000 VACRMS for 1 min. DIN−EN/IEC60747−5−5, 1,140 V peak working insulation voltage for FOD8173T; FOD8173T − 8 mm Creepage and Clearance Distance, and 0.4 mm insulation distance | Small Outline Packages | FOD8173 |
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1081738
Phoenix Contact
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1 | MKDSO 1,5/ 5-L-3,5 YE - Printed circuit board terminal, nominal current: 8 A, rated voltage (III/2): 160 V, nominal cross section: 1.5 mm2, number of potentials: 5, number of rows: 1, number of positions per row: 5, product range: MKDSO 1,5/..-L, pitch: 3.5 mm, connection method: Screw connection with tension sleeve, mounting: Wave soldering, conductor/PCB connection direction: 0 °, color: yellow, Pin layout: Linear pinning, Solder pin [P]: 2.3 mm, number of solder pins per potential: 1, type of | Other | 1081738 |
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1081739
Phoenix Contact
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1 | MKDSO 1,5/ 5-R-3,5 YE - Printed circuit board terminal, nominal current: 8 A, rated voltage (III/2): 160 V, nominal cross section: 1.5 mm2, number of potentials: 5, number of rows: 1, number of positions per row: 5, product range: MKDSO 1,5/..-R, pitch: 3.5 mm, connection method: Screw connection with tension sleeve, mounting: Wave soldering, conductor/PCB connection direction: 0 °, color: yellow, Pin layout: Linear pinning, Solder pin [P]: 2.3 mm, number of solder pins per potential: 1, type of | Other | 1081739 |
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FOD8173T
onsemi
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1 | 20 kV/µs Minimum CMTI; 20 Mbit/sec Date Rate (NRZ) 55ns max. Propagation Delay 20ns max. Pulse Width Distortion; 3.3 V and 5 V CMOS Compatibility; Specifications Guaranteed Over 3 V to 5.5 V supply voltage and −40 to 100°C extended industrial temperature range; UL1577, 5,000 VACRMS for 1 min. DIN−EN/IEC60747−5−5, 1,140 V peak working insulation voltage for FOD8173T; FOD8173T − 8 mm Creepage and Clearance Distance, and 0.4 mm insulation distance | Small Outline Packages | FOD8173T |
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281739-4
TE Connectivity
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1 | 8way 2 row straight HE14 shrouded header | Header, Shrouded - Straight PTH Box | 281739-4 |
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1868173
Phoenix Contact
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1 | MKDSFW 1,5/ 7-3,5 - Printed circuit board terminal, nominal current: 12 A, rated voltage (III/2): 160 V, nominal cross section: 1.5 mm2, number of potentials: 7, number of rows: 1, number of positions per row: 7, product range: MKDSFW 1,5, pitch: 3.5 mm, connection method: Screw connection with tension sleeve, screw head form: L Slotted, mounting: Wave soldering, conductor/PCB connection direction: 90 °, color: green, Pin layout: Linear pinning, Solder pin [P]: 3.5 mm, number of solder pins per p | Other | 1868173 |
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FOD817300
onsemi
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1 | UL1577, 5,000 VACRMS for 1 Minute; FOD817: 50-600%; DIN EN/IEC60747-5-5; FOD817A: 80-160%; FOD817B: 130-260%; FOD814A: 50-150%; Current Transfer Ratio in Selected Groups:; Minimum BVCEO of 70 V Guaranteed; FOD817C: 200-400%; FOD817D: 300-600%; FOD814: 20-300%; AC Input Response (FOD814); Safety and Regulatory Approvals | Dual-In-Line Packages | FOD817300 |
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1-1971817-3
TE Connectivity
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1 | 3P,RAST 2.5 Tab Header,Ex- Locking,THV | Other | 1-1971817-3 |
3
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9-1971817-3
TE Connectivity
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1 | Headers & Wire Housings 3P RAST 2.5 Tab Hdr Ex- Lock T/H Vrt-tin | Other | 9-1971817-3 |
3
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HCPL-817-30CE
Avago Technologies
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1 | Transistor Output Optocouplers 5000 Vrms 50mA | Small Outline Packages | HCPL-817-30CE |
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281739-3
TE Connectivity
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1 | 6way 2 row straight HE14 shrouded header | Header, Shrouded - Straight PTH Box | 281739-3 |
3
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HCPL-817-36BE
Avago Technologies
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1 | Optoisolator Transistor Output 5000Vrms 1 Channel 4-SMD | Small Outline Packages | HCPL-817-36BE |
2
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HCPL-817-36AE
Avago Technologies
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1 | Transistor Output Optocouplers 5000 Vrms 50mA | Small Outline Packages | HCPL-817-36AE |
3
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281739-8
TE Connectivity
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1 | 16way 2row straight HE14 shrouded header | Header, Shrouded - Straight PTH Box | 281739-8 |
3
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HCPL-817-36DE
Avago Technologies
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1 | Phototransistor Optocoupler High-Density Mounting Type | Small Outline Packages | HCPL-817-36DE |
3
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1758173
Phoenix Contact
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1 | MSTBV 2,5/18-G-5,08 - PCB headers, nominal cross section: 2.5 mm2, color: green, nominal current: 12 A, rated voltage (III/2): 320 V, contact surface: Sn, contact connection type: Pin, number of potentials: 18, number of rows: 1, number of positions: 18, number of connections: 18, product range: MSTBV 2,5/..-G, pitch: 5.08 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 3.9 mm, number of solder pins per potential: 1, plug-in system: COMBICON MSTB 2,5, Pin connector patte | Other | 1758173 |
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