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PCA9698DGG,518
NXP
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1 | Interface - I/O Expanders 40BT I2C FM+TPGPIO IN-RS-PU OE | Small Outline Packages | PCA9698DGG,518 |
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PCA9698DGG,512
NXP
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1 | NXP PCA9698DGG,512, 40-channel I/O Expander 1MHz, 56-Pin TSSOP | Small Outline Packages | PCA9698DGG,512 |
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796980-5
TE Connectivity
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1 | Body Features: Product Orientation Vertical | Primary Product Color Green | Configuration Features: Stacking Configuration Side Stackable | Number of Rows 1 | Number of Positions 5 | Contact Features: Contact Base Material Copper Alloy | Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 15 AMP | Electrical Characteristics: Operating Voltage 300 VAC | Housing Features: Centerline (Pitch) 7.62 MM | Centerline (Pitch) .3 INCH | Housing Material PA 66 | Mechanical Attachment: Connector Mou | Other | 796980-5 |
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1969878
Phoenix Contact
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1 | IPC 16/ 4-GU-10,16 - PCB headers, nominal cross section: 16 mm2, color: green, nominal current: 76 A, rated voltage (III/2): 1000 V, contact surface: Ag, contact connection type: Socket, number of potentials: 4, number of rows: 1, number of positions: 4, number of connections: 4, product range: IPC 16/..-GU, pitch: 10.16 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 4 mm, number of solder pins per potential: 3, plug-in system: COMBICON PC 16, Pin connector pattern alig | Other | 1969878 |
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1969806-1
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Positions 4 | Number of Power Positions 4 | Number of Rows 1 | Contact Features: Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Current Rating (Max) 12 AMP | Contact Type Socket | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Tin | Electrical Characteristics: | Other | 1969806-1 |
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PCA9698DGG
NXP
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1 | Dispositifs d'extension E/S 40 I2C 1 MHz 56-TSSOP, I2C, 2,3V ~ 5,5V, -40°C ~ 85°C | Small Outline Packages | PCA9698DGG |
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PCA9698BS,118
NXP
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1 | Interface - I/O Expanders I2C I/O EXPANDER GP | Quad Flat No-Lead | PCA9698BS,118 |
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1969807
Phoenix Contact
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1 | IPCV 16/ 5-GF-10,16 - PCB headers, nominal cross section: 16 mm2, color: green, nominal current: 76 A, rated voltage (III/2): 1000 V, contact surface: Ag, contact connection type: Socket, number of potentials: 5, number of rows: 1, number of positions: 5, number of connections: 5, product range: IPCV 16/..-GF, pitch: 10.16 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 4 mm, number of solder pins per potential: 3, plug-in system: COMBICON PC 16, Pin connector pattern al | Other | 1969807 |
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5-796985-4
TE Connectivity
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1 | Body Features: Product Orientation Vertical | Primary Product Color Black | Barrier Strip Style Dual Barrier | Configuration Features: Number of Rows 1 | Number of Positions 10 | Number of Levels 1 | Contact Features: Contact Current Rating (Max) 20 AMP | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | Contact Base Material Copper Alloy | Dimensions: Product Length 112.75 MM | Product Length 4.439 INCH | Wire Size .3 – 3 MMSQ | Wire Size 22 – 12 AWG | Electrical | Other | 5-796985-4 |
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1969836
Phoenix Contact
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1 | IPCV 16/ 8-GF-10,16 - PCB headers, nominal cross section: 16 mm2, color: green, nominal current: 76 A, rated voltage (III/2): 1000 V, contact surface: Ag, contact connection type: Socket, number of potentials: 8, number of rows: 1, number of positions: 8, number of connections: 8, product range: IPCV 16/..-GF, pitch: 10.16 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 4 mm, number of solder pins per potential: 3, plug-in system: COMBICON PC 16, Pin connector pattern al | Other | 1969836 |
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1969894
Phoenix Contact
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1 | IPC 16/ 6-GU-10,16 - PCB headers, nominal cross section: 16 mm2, color: green, nominal current: 76 A, rated voltage (III/2): 1000 V, contact surface: Ag, contact connection type: Socket, number of potentials: 6, number of rows: 1, number of positions: 6, number of connections: 6, product range: IPC 16/..-GU, pitch: 10.16 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 4 mm, number of solder pins per potential: 3, plug-in system: COMBICON PC 16, Pin connector pattern alig | Other | 1969894 |
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PCA9698BS
NXP
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1 | 40-bit Fm+ I2C-bus advanced I/O port with RESET, OE and INT, 2.3V ~ 5.5V, -40°C ~ 85°C | Quad Flat No-Lead | PCA9698BS |
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796980-2
TE Connectivity
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1 | Body Features: Product Orientation Vertical | Primary Product Color Green | Configuration Features: Number of Rows 1 | Number of Positions 2 | Stacking Configuration Side Stackable | Contact Features: Contact Base Material Copper Alloy | Contact Current Rating (Max) 15 AMP | Contact Mating Area Plating Material Tin | Electrical Characteristics: Operating Voltage 300 VAC | Housing Features: Centerline (Pitch) 7.62 MM | Centerline (Pitch) .3 INCH | Housing Material PA 66 | Mechanical Attachment: Connector Mou | Other | 796980-2 |
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1969849
Phoenix Contact
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1 | IPCV 16/ 9-GF-10,16 - PCB headers, nominal cross section: 16 mm2, color: green, nominal current: 76 A, rated voltage (III/2): 1000 V, contact surface: Ag, contact connection type: Socket, number of potentials: 9, number of rows: 1, number of positions: 9, number of connections: 9, product range: IPCV 16/..-GF, pitch: 10.16 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 4 mm, number of solder pins per potential: 3, plug-in system: COMBICON PC 16, Pin connector pattern al | Other | 1969849 |
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1969811-1
TE Connectivity
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1 | PCB Mount Header, Vertical, Wire-to-Board, 6 Position, 6.35 mm [.25 in] Centerline, Fully Shrouded, Pre-Tin, Universal MATE-N-LOK | Other | 1969811-1 |
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1969813-1
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Positions 6 | Number of Power Positions 6 | Number of Rows 1 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Mating Area Plating Material Tin | Contact Type Socket | Contact Current Rating (Max) 12 AMP | Electrical Characteristics: | Other | 1969813-1 |
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1339698
Phoenix Contact
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1 | D31H 2,2/ 3-H-3,81-X - PCB headers, color: black, nominal current: 8 A, rated voltage (III/2): 160 V, contact surface: Sn, contact connection type: Pin, number of rows: 1, number of positions: 3, product range: D31H 2,2/..-H, pitch: 3.81 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 3.8 mm, number of solder pins per potential: 1, plug-in system: CONNEXIS D, Pin connector pattern alignment: Standard, locking: Snap-in locking, mounting method: Engagement nose, type of packaging: pa | Other | 1339698 |
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796985-8
TE Connectivity
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1 | 4 Position Barrier Strip, Dual Barrier, Printed Circuit Pin Bottom Termination, Wire-to-Board, 9.53 mm [.375 in] Centerline, 1 Row, 300 V / 600 V | Other | 796985-8 |
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1969803-1
TE Connectivity
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1 | Configuration Features: Number of Positions 3 | Number of Rows 1 | Number of Power Positions 3 | PCB Mount Orientation Vertical | Contact Features: Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Type Pin | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Mating Area Plating Material Tin | Contact Layout Inline | Contact Current Rating (Max) 12 AMP | PCB Contact Termination Area Plating Material Pre-Tin | Housin | Other | 1969803-1 |
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1969823
Phoenix Contact
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1 | IPCV 16/ 7-GF-10,16 - PCB headers, nominal cross section: 16 mm2, color: green, nominal current: 76 A, rated voltage (III/2): 1000 V, contact surface: Ag, contact connection type: Socket, number of potentials: 7, number of rows: 1, number of positions: 7, number of connections: 7, product range: IPCV 16/..-GF, pitch: 10.16 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 4 mm, number of solder pins per potential: 3, plug-in system: COMBICON PC 16, Pin connector pattern al | Other | 1969823 |
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10169698-70000RLF
Amphenol Communications Solutions
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1 | BergStak® 0.635mm, 140position, Receptacle,3mm stack height | Other | 10169698-70000RLF |
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1969810
Phoenix Contact
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1 | IPCV 16/ 6-GF-10,16 - PCB headers, nominal cross section: 16 mm2, color: green, nominal current: 76 A, rated voltage (III/2): 1000 V, contact surface: Ag, contact connection type: Socket, number of potentials: 6, number of rows: 1, number of positions: 6, number of connections: 6, product range: IPCV 16/..-GF, pitch: 10.16 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 4 mm, number of solder pins per potential: 3, plug-in system: COMBICON PC 16, Pin connector pattern al | Other | 1969810 |
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1969865
Phoenix Contact
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1 | IPC 16/ 3-GU-10,16 - PCB headers, nominal cross section: 16 mm2, color: green, nominal current: 76 A, rated voltage (III/2): 1000 V, contact surface: Ag, contact connection type: Socket, number of potentials: 3, number of rows: 1, number of positions: 3, number of connections: 3, product range: IPC 16/..-GU, pitch: 10.16 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 4 mm, number of solder pins per potential: 3, plug-in system: COMBICON PC 16, Pin connector pattern alig | Other | 1969865 |
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1969830-1
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 6 | Number of Rows 1 | Number of Power Positions 6 | Contact Features: Contact Type Socket | Contact Current Rating (Max) 19 AMP | PCB Contact Termination Area Plating Material Pre-Tin | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Electrical Characteristics: | Other | 1969830-1 |
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1969808-1
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Positions 5 | Number of Power Positions 5 | PCB Mount Orientation Right Angle | Contact Features: Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 12 AMP | PCB Contact Termination Area Plating Material Tin | Contact Type Pin | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Electrical Characteristics: Ope | Other | 1969808-1 |
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