982-3 Model Download Search Results
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ENW-89823A5KF
Panasonic
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1 | Bluetooth Modules (802.15.1) PAN1326C2, TI Based BT Dual Mode HCI MOD | Other | ENW-89823A5KF |
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2198233-3
TE Connectivity
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1 | Body Features: Heat Sink Height 9.1 MM | Heat Sink Height .358 INCH | Heat Sink Height Class Networking Short | Heat Sink Style Pin | Configuration Features: Port Matrix Configuration 1 x 4 | Number of Ports 4 | Lightpipe Style Reduced Length | Dimensions: PCB Thickness (Recommended) .089 INCH | PCB Thickness (Recommended) 2.25 MM | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Cage Material Nickel Silver | Operation/Application: Circuit Application Signal | Heat Sink Compatible Yes | Other | 2198233-3 |
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SLY109823G
Fischer Elektronik GmbH & Co. KG
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1 | Single Row, Male, Pitch 2mm, THT, 23 Position | Other | SLY109823G |
3
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172298-2312
Molex
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1 | Ultra-Fit Vertical Header, 3.50mm Pitch, Dual Row, 12 Circuits, with Kinked Pins, Glow-Wire Capable | Other | 172298-2312 |
3
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L9823
STMicroelectronics
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1 | Octal low-side driver for bulb, resistive and inductive loads with serial input control, output protection and diagnostic | Small Outline Packages | L9823 |
3
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2198232-4
TE Connectivity
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1 | SFP+, Cage Assembly, Signal, Operating Temperature Range -55 – 105 °C [-67 – 221 °F], Data Rate (Max) 16 Gb/s, 2 Ports | Other | 2198232-4 |
3
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PA4349.823ANLT
Yageo Group
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1 | Fixed Inductors 82uH 12A 13mm 20% SMT | Inductor Moulded | PA4349.823ANLT |
3
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SLY109823Z
Fischer Elektronik GmbH & Co. KG
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1 | Single Row, Male, Pitch 2mm, THT, 23 Position | Other | SLY109823Z |
3
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L9823013TR
STMicroelectronics
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1 | Octal low-side driver for bulb, resistive and inductive loads with serial input control, output protection and diagnostic | Small Outline Packages | L9823013TR |
3
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2198230-4
TE Connectivity
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1 | Body Features: Heat Sink Height 13.5 MM | Heat Sink Height Class Networking Tall | Heat Sink Style Pin | Heat Sink Height .531 INCH | Configuration Features: Port Matrix Configuration 1 x 2 | Number of Ports 2 | Dimensions: PCB Thickness (Recommended) .089 INCH | PCB Thickness (Recommended) 2.25 MM | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Cage Material Nickel Silver | Operation/Application: Circuit Application Signal | Pluggable I/O Applications SFP+ Enhanced | Heat Sink Comp | Other | 2198230-4 |
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502598-2393
Molex
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1 | FFC & FPC Connectors 0.3 FPC Bck Flip Hsg 23CktEmbsTpPkg | Other | 502598-2393 |
3
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ES9823PRO
ESS Technology
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1 | +128dB DNR per channel-117dB THD+N per channel Unprecedented dynamic range with ultra-low noise and distortionHigh Sample Rates Support for sample rates up to and including 768kHz & DSD512MQA FOQUS Architecture (ES9823MPRO) Integrated Stereo FOQUS by MQA Labs® architectureIntegrated Audio Signal Processor (ASP2)2nd generation ASP2 that can handle custom algorithms including multi-band PEQ,MIXER functions and pre-emphasis filtersMulti-Chip Mixing Allow for the use of 2 devices to extend the d | Quad Flat No-Lead | ES9823PRO |
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2198232-3
TE Connectivity
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1 | SFP+, Cage Assembly, Signal, Operating Temperature Range -55 – 105 °C [-67 – 221 °F], Data Rate (Max) 16 Gb/s, 2 Ports | Other | 2198232-3 |
3
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1709823
Phoenix Contact
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1 | MSTBA 2,5/ 3-G-5,08 RD - PCB headers, nominal cross section: 2.5 mm2, color: red, nominal current: 12 A, rated voltage (III/2): 320 V, contact surface: Sn, contact connection type: Pin, number of potentials: 3, number of rows: 1, number of positions: 3, number of connections: 3, product range: MSTBA 2,5/..-G, pitch: 5.08 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 3.23 mm, number of solder pins per potential: 1, plug-in system: COMBICON MSTB 2,5, Pin connector patter | Other | 1709823 |
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SLY109823S
Fischer Elektronik GmbH & Co. KG
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1 | Single Row, Male, Pitch 2mm, THT, 23 Position | Other | SLY109823S |
3
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E-L9823
STMicroelectronics
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1 | Octal low-side driver for bulb, resistive and inductive loads with serial input control, output protection and diagnostic | Small Outline Packages | E-L9823 |
3
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SiT8008BCL12-33S-78.598230
SiTime
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1 | Low Power Programmable Oscillator | Other | SiT8008BCL12-33S-78.598230 |
3
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ENW89823A4KF
Panasonic
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1 | Panasonic ENW89823A4KF Bluetooth Chip 4.2 | Other | ENW89823A4KF |
3
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ENW-89823A2KF
Panasonic
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1 | PANASONIC ELECTRONIC COMPONENTS - ENW-89823A2KF - RF MOD, TXRX, BLUETOOTH, PAN1326-HCI-85 | Other | ENW-89823A2KF |
3
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AD9823KRUZ
Analog Devices
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1 | Data Acquisition ADCs/DACs - Specialised Correlated Double Sampler | Small Outline Packages | AD9823KRUZ |
3
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172298-2304
Molex
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1 | Ultra-Fit Vertical Header, 3.50mm Pitch, Dual Row, 4 Circuits, with Kinked Pins, Glow-Wire Capable | Other | 172298-2304 |
3
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5025982393
Molex
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1 | 0.30mm Pitch Easy-On Back Flip FPC Connector, Right-Angle, Surface Mount, Dual Contact Style, 1.15mm Mated Height, 23 Circuits | Other | 5025982393 |
3
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172298-2306
Molex
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1 | Ultra-Fit Vertical Header, 3.50mm Pitch, Dual Row, 6 Circuits, with Kinked Pins, Glow-Wire Capable | Other | 172298-2306 |
3
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SiT8008BCL12-33E-78.598230
SiTime
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1 | Low Power Programmable Oscillator | Other | SiT8008BCL12-33E-78.598230 |
3
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2198230-3
TE Connectivity
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1 | Body Features: Heat Sink Height .358 INCH | Heat Sink Height Class Networking Short | Heat Sink Height 9.1 MM | Heat Sink Style Pin | Configuration Features: Number of Ports 2 | Port Matrix Configuration 1 x 2 | Dimensions: PCB Thickness (Recommended) 2.25 MM | PCB Thickness (Recommended) .089 INCH | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Cage Material Nickel Silver | Operation/Application: Circuit Application Signal | Heat Sink Compatible Yes | Pluggable I/O Applications SFP | Other | 2198230-3 |
3
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