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HV860K7-G
Microchip
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1 | Display Drivers & Controllers EL LAMP DRIVER | Quad Flat No-Lead | HV860K7-G |
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SEK102M035ST
Cornell Dubilier
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1 | Aluminum Electrolytic Capacitors - Leaded ALUM EL 35V 1000UF | Capacitor, Polarized Radial Diameter | SEK102M035ST |
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STM32G474RET6U
STMicroelectronics
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1 | MAINSTREAM ARM CORTEX-M4 CORE WI | Quad Flat Packages | STM32G474RET6U |
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SNJ54LS595J
Texas Instruments
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1 | 54LS595 8-BIT SHIFT REGISTERS WI | Ceramic Dual-In-Line Packages | SNJ54LS595J |
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NCP451AFCT2G
onsemi
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1 | Power Switch ICs - Power Distribution 3A LOW RON LOAD SWITCH WI | BGA | NCP451AFCT2G |
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MIC4832YMM
Microchip
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1 | LED Lighting Drivers 220Vpp Low Noise EL Driver | Small Outline Packages | MIC4832YMM |
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2MA-02
TE Connectivity
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1 | Fixed Terminal Blocks 2 POS 5.08MM TERMI-BLOK TOP WI | Other | 2MA-02 |
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T59EL476M050C0055
Vishay
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1 | Tantalum Capacitors - Polymer 47uF 20% 50V Case EL 55 Max. ESR | Other | T59EL476M050C0055 |
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3011-C70201H-MM0KL0V1AB2737-2T-AM
Everlight
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1 | EL MICRO SIDE VIEW LED, PLCC 2 package, 1150 mcd @ 20mA | Other | 3011-C70201H-MM0KL0V1AB2737-2T-AM |
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2908472
Phoenix Contact
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1 | PCB terminal block, nominal current: 24 A, rated voltage (III/2): 400 V, nominal cross section: 2.5 mm??, number of potentials: 4, number of rows: 1, number of positions per row: 4, product range: MKDSO 2,5/..-R, pitch: 5 mm, connection method: Screw connection with tension sleeve, mounting: Wave soldering, conductor/PCB connection direction: 0 ??, color: light grey, Pin layout: Linear pinning, Solder pin [P]: 3.5 mm, number of solder pins per potential: 1, type of packaging: packed in cardboard. Product wi | Other | 2908472 |
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CPF0402B1K96E
TE Connectivity
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1 | Configuration Features: Number of Resistors 1 | Dimensions: Product Width .5 MM | Product Height .3 MM | Product Height .012 INCH | Product Length 1 MM | Product Width .02 INCH | Product Length .039 INCH | Electrical Characteristics: Resistance Value 1.96K OHM | Operating Voltage 25 V | Power Rating .063 WATT | Passive Component Tolerance .1 PCT | Resistance Class 1kΩ – 1MΩ | Packaging Features: Packaging Method Reel | Product Type Features: Resistor Type Precision Resistor | Package Size Code 0402 | El | Resistor Chip | CPF0402B1K96E |
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CPF0603B182RE
TE Connectivity
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1 | Configuration Features: Number of Resistors 1 | Dimensions: Product Width .8 MM | Product Length .061 INCH | Product Height .018 INCH | Product Length 1.55 MM | Product Height .45 MM | Product Width .031 INCH | Electrical Characteristics: Power Rating .063 WATT | Resistance Class Up to 1kΩ | Operating Voltage 50 V | Passive Component Tolerance .1 PCT | Resistance Value 182 OHM | Packaging Features: Packaging Method Reel | Product Type Features: Package Size Code 0603 | Resistor Type Precision Resistor | El | Resistor Chip | CPF0603B182RE |
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CPF0603B267RE
TE Connectivity
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1 | Configuration Features: Number of Resistors 1 | Dimensions: Product Width .031 INCH | Product Length .061 INCH | Product Height .018 INCH | Product Length 1.55 MM | Product Width .8 MM | Product Height .45 MM | Electrical Characteristics: Resistance Value 267 OHM | Resistance Class Up to 1kΩ | Power Rating .063 WATT | Passive Component Tolerance .1 PCT | Operating Voltage 50 V | Packaging Features: Packaging Method Reel | Product Type Features: Package Size Code 0603 | Resistor Type Precision Resistor | El | Resistor Chip | CPF0603B267RE |
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CRGH2010J22R
TE Connectivity
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1 | Configuration Features: Number of Resistors 1 | Dimensions: Product Length 5 MM | Product Width 2.5 MM | Product Width .098 INCH | Product Height .022 INCH | Product Length .197 INCH | Product Height .55 MM | Electrical Characteristics: Power Rating 1 WATT | Resistance Class Up to 1kΩ | Operating Voltage 200 V | Passive Component Tolerance 5 PCT | Resistance Value 22 OHM | Packaging Features: Packaging Method Taped & Reeled | Product Type Features: Resistor Type Power Resistor | Package Size Code 2010 | El | Resistor Chip | CRGH2010J22R |
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CPF0603B57R6E
TE Connectivity
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1 | Configuration Features: Number of Resistors 1 | Dimensions: Product Length 1.55 MM | Product Height .45 MM | Product Length .061 INCH | Product Width .8 MM | Product Height .018 INCH | Product Width .031 INCH | Electrical Characteristics: Power Rating .063 WATT | Operating Voltage 50 V | Passive Component Tolerance .1 PCT | Resistance Value 57.6 OHM | Resistance Class Up to 1kΩ | Packaging Features: Packaging Method Reel | Product Type Features: Package Size Code 0603 | Resistor Type Precision Resistor | El | Resistor Chip | CPF0603B57R6E |
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W25N04KVTBJR
Winbond
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1 | New W25N Family of QspiNAND\r\nMemories\r\n– W25N04KV: 4G-bit / 512M-Byte\r\n– Standard SPI: CLK, /CS, DI, DO, /WP,\r\n/Hold\r\n– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold\r\n– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3\r\n– Compatible SPI serial flash commands\r\n Highest Performance Serial NAND Flash\r\n– 104MHz Standard/Dual/Quad SPI clocks\r\n– 208/416MHz equivalent Dual/Quad SPI\r\n– 50MB/S sequential data transfer rate\r\n– Fast Program/Erase performance\r\n– 60,000 erase/program cycles\r\n– 10-year data retention\r\n Low Power, Wi | BGA | W25N04KVTBJR |
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iW1797-34
Renesas Electronics
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1 | Supports USB PD 3.0, Qualcomm® Quick Charge™ 4+, and Direct Charge Adapters; Companion to the iW657P USB PD 3.0 ControllerThe iW1797 is a compact, 27W, high-performance AC/DC RapidCharge™ power supply controller that supports USB Power Delivery with Programmable Power Supply (USB PD PPS) and other rapid charging protocols. The device comes in a space-saving SOT23-6 package, reducing the total solution size for space-constrained applications. The iW1797 also offers high voltage and current resolution wi | SOT23 (6-Pin) | iW1797-34 |
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W25N01KVZEIR
Winbond
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1 | New W25N Family of QspiNAND\r\nMemories\r\n– W25N02KV: 2G-bit / 256M-Byte\r\n– Standard SPI: CLK, /CS, DI, DO, /WP,\r\n/Hold\r\n– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold\r\n– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3\r\n– Compatible SPI serial flash commands\r\n Highest Performance Serial NAND Flash\r\n– 104MHz Standard/Dual/Quad SPI clocks\r\n– 208/416MHz equivalent Dual/Quad SPI\r\n– 50MB/S sequential data transfer rate\r\n– Fast Program/Erase performance\r\n– 60,000 erase/program cycles\r\n– 10-year data retention\r\n Low Power, Wi | Small Outline No-lead | W25N01KVZEIR |
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W25N02KVTBJU
Winbond
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1 | New W25N Family of QspiNAND\r\nMemories\r\n– W25N02KV: 2G-bit / 256M-Byte\r\n– Standard SPI: CLK, /CS, DI, DO, /WP,\r\n/Hold\r\n– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold\r\n– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3\r\n– Compatible SPI serial flash commands\r\n Highest Performance Serial NAND Flash\r\n– 104MHz Standard/Dual/Quad SPI clocks\r\n– 208/416MHz equivalent Dual/Quad SPI\r\n– 50MB/S sequential data transfer rate\r\n– Fast Program/Erase performance\r\n– 60,000 erase/program cycles\r\n– 10-year data retention\r\n Low Power, Wi | BGA | W25N02KVTBJU |
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1845989
Phoenix Contact
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1 | PCB headers, nominal cross section: 2.5 mm², color: green, nominal current: 10 A, rated voltage (III/2): 320 V, contact surface: Tin, contact connection type: Pin, number of potentials: 14, number of rows: 2, number of positions: 7, number of connections: 14, product range: MDSTBV 2,5/..-G, pitch: 5 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 3.9 mm, number of solder pins per potential: 1, plug-in system: COMBICON MSTB 2,5, Pin connector pattern alignment: Standard, locking: wi | Other | 1845989 |
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185226-1
TE Connectivity
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1 | Body Features: Connector & Keying Code A-E | Primary Product Color Yellow | Configuration Features: Number of Signal Positions 26 | PCB Mount Orientation Vertical | Number of Positions 26 | Number of Rows 2 | Number of Sections 1 | Contact Features: Mating Tab Thickness .63 MM | Mating Tab Thickness .025 INCH | Mating Tab Width .025 INCH | Contact Size .63mm | Mating Tab Width .63 MM | Contact Mating Area Plating Material Tin | Contact Type Tab | Dimensions: PCB Thickness (Recommended) 1.6 MM | Connector Wi | Other | 185226-1 |
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174146-2
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: PCB Mount Orientation Horizontal | Number of Positions 36 | Number of Rows 2 | Number of Sections 2 | Number of Signal Positions 36 | Contact Features: Contact Size 1mm | Mating Tab Width 1 MM | Mating Tab Thickness .025 INCH | Contact Mating Area Plating Material Tin | Contact Type Tab | Mating Tab Width .039 INCH | Mating Tab Thickness .64 MM | Dimensions: Profile Height from PCB .657 INCH | Profile Height from PCB 16.7 MM | Connector Wi | Other | 174146-2 |
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W25N04KVTBJU
Winbond
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1 | New W25N Family of QspiNAND\r\nMemories\r\n– W25N04KV: 4G-bit / 512M-Byte\r\n– Standard SPI: CLK, /CS, DI, DO, /WP,\r\n/Hold\r\n– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold\r\n– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3\r\n– Compatible SPI serial flash commands\r\n Highest Performance Serial NAND Flash\r\n– 104MHz Standard/Dual/Quad SPI clocks\r\n– 208/416MHz equivalent Dual/Quad SPI\r\n– 50MB/S sequential data transfer rate\r\n– Fast Program/Erase performance\r\n– 60,000 erase/program cycles\r\n– 10-year data retention\r\n Low Power, Wi | BGA | W25N04KVTBJU |
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W25N02KVTBIR
Winbond
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1 | New W25N Family of QspiNAND\r\nMemories\r\n– W25N02KV: 2G-bit / 256M-Byte\r\n– Standard SPI: CLK, /CS, DI, DO, /WP,\r\n/Hold\r\n– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold\r\n– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3\r\n– Compatible SPI serial flash commands\r\n Highest Performance Serial NAND Flash\r\n– 104MHz Standard/Dual/Quad SPI clocks\r\n– 208/416MHz equivalent Dual/Quad SPI\r\n– 50MB/S sequential data transfer rate\r\n– Fast Program/Erase performance\r\n– 60,000 erase/program cycles\r\n– 10-year data retention\r\n Low Power, Wi | BGA | W25N02KVTBIR |
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4-2172070-2
TE Connectivity
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1 | Body Features: Shell Base Material Brass | Circular Connector Insulation Material Type Polyamide | Shell Plating Material Nickel | Configuration Features: Number of Positions 5 | Number of Power Positions 0 | Contacts Preloaded Yes | Number of Signal Positions 5 | Contact Features: Reverse Gender Yes | Contact Current Rating (Max) 4 AMP | Contact Layout Arrangement Circular | Circular Connector Contact Type Pin | Housing Features: Circular Connector Shell Size 12 | Mechanical Attachment: Mating Retention Wi | Other | 4-2172070-2 |
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