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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	W631GU6MB09W Winbond	1	 Power Supply: 1.35V (typ.), VDD, VDDQ = 1.283V to 1.45V Backward compatible to VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, d	BGA	W631GU6MB09W	3D model available Symbol and footprint available 3	1 Download Model
	W634GU8RB09K Winbond	1	DDR3 SDRAM 2133MHz	BGA	W634GU8RB09K	3D model available Symbol and footprint available 3	1 Download Model
	W955N8MBYA5S Winbond	1	32Mb HYPERRAM 400MHz TFBGA (5X5)24	BGA	W955N8MBYA5S	3D model available Symbol and footprint available 3	1 Download Model
	W632GG6NB15W Winbond	1	 Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received w	BGA	W632GG6NB15W	3D model available Symbol and footprint available 3	1 Download Model
	W631GG8MB11W Winbond	1	 Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received w	BGA	W631GG8MB11W	3D model available Symbol and footprint available 3	1 Download Model
	W29N04GVBAAF Winbond	1	4Gb SLC NAND Flash MHz VFBGA63	BGA	W29N04GVBAAF	3D model available Symbol and footprint available 3	1 Download Model
	W25Q64JWZESM Winbond	1	 New Family of SpiFlash Memories– W25Q64JW: 64M-bit / 8M-byte– Standard SPI: CLK, /CS, DI, DO– Dual SPI: CLK, /CS, IO0, IO1– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Quad I/O SPI clocks– 66MB/S continuous data transfer rate– Min. 100K Program-Erase cycles– More than 20-year data retention Low Power, Wide Temperature Range– Single 1.7V to 1.95Vsupply– <1µA Power-down (typ.)– -40°C to +85°C operating range F	Small Outline No-lead	W25Q64JWZESM	3D model available Symbol and footprint available 3	1 Download Model
	W25Q10RLXHJQ Winbond	1	 New Family of SpiFlash Memories– W25Q40RL: 4M-bit /512K-byte (524,288)W20Q20RL: 2M-bit /256K-byte (262,144)W20Q10RL: 1M-bit /128K-byte (131,072)– Standard SPI: CLK, /CS, DI, DO, /WP, /Hold– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Single, Dual/Quad SPI clocks– 266/532MHz equivalent Dual/Quad SPI– 66MB/S continuous data transfer rate– Min. 100K Program-Erase cycles– More	Small Outline No-lead	W25Q10RLXHJQ	3D model available Symbol and footprint available 3	1 Download Model
	W971GG6NB18K Winbond	1	1Gb DDR2 SDRAM 1066MHz VFBGA84	BGA	W971GG6NB18K	3D model available Symbol and footprint available 3	1 Download Model
	W25N04KVZEJR Winbond	1	4Gb QspiNAND Flash 104MHz SON8	Small Outline No-lead	W25N04KVZEJR	3D model available Symbol and footprint available 3	1 Download Model
	W25N01KWZEJT Winbond	1	FLASH - NAND Memory IC 1Gbit SPI 104 MHz 8-WSON (8x6)	Small Outline No-lead	W25N01KWZEJT	3D model available Symbol and footprint available 3	1 Download Model
	W634GG6NB09W Winbond	1	DDR3 SDRAM 2133MHz	BGA	W634GG6NB09W	3D model available Symbol and footprint available 3	1 Download Model
	W632GU6MB11K Winbond	1	2Gb DDR3 SDRAM 1866MHz VFBGA96	BGA	W632GU6MB11K	3D model available Symbol and footprint available 3	1 Download Model
	W631GU6MB12K Winbond	1	1Gb DDR3 SDRAM 1600MHz VFBGA96	BGA	W631GU6MB12K	3D model available Symbol and footprint available 3	1 Download Model
	W25Q32JVTBSM Winbond	1	32Mb Serial NOR Flash 133MHz TFBGA (5X5)24	BGA	W25Q32JVTBSM	3D model available Symbol and footprint available 3	1 Download Model
	W25Q512NWFJQ Winbond	1	 New Family of SpiFlash Memories– W25Q512NW: 512M-bit / 64M-byte– Standard SPI: CLK, /CS, DI, DO– Dual SPI: CLK, /CS, IO0, IO1,– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– 3 or 4-Byte Addressing Mode– Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Standard/Dual/Quad SPI clocks– 266/532MHz equivalent Dual/Quad SPI– 66MB/S continuous data transfer rate– Min. 100K Program-Erase cycles– More than 20-year data retention Efficient Read– Allows true XIP (execute i	Small Outline Packages	W25Q512NWFJQ	3D model available Symbol and footprint available 3	1 Download Model
	W632GG8NB12W Winbond	1	2Gb DDR3 SDRAM 1600MHz VFBGA78	BGA	W632GG8NB12W	3D model available Symbol and footprint available 3	1 Download Model
	W631GU8MB12K Winbond	1	SDRAM - DDR3L Memory IC 1Gbit Parallel 800 MHz 20 ns 78-VFBGA (10.5x8)	BGA	W631GU8MB12K	3D model available Symbol and footprint available 3	1 Download Model
	W631GG6MB12W Winbond	1	 Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received w	BGA	W631GG6MB12W	3D model available Symbol and footprint available 3	1 Download Model
	W631GG8NB11A Winbond	1	Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received wit	BGA	W631GG8NB11A	3D model available Symbol and footprint available 3	1 Download Model
	W25Q32JVZPSM Winbond	1	SON8	Small Outline No-lead	W25Q32JVZPSM	3D model available Symbol and footprint available 3	1 Download Model
	W25Q12PWZEIQ Winbond	1	128Mb Serial NOR Flash 166MHz SON8	Small Outline No-lead	W25Q12PWZEIQ	3D model available Symbol and footprint available 3	1 Download Model
	W25Q64JWXGSM Winbond	1	 New Family of SpiFlash Memories– W25Q64JV: 64M-bit / 8M-byte– Standard SPI: CLK, /CS, DI, DO– Dual SPI: CLK, /CS, IO0, IO1– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Single, Dual/Quad SPI clocks– 266/532MHz equivalent Dual/Quad SPI– Min. 100K Program-Erase cycles per sector– More than 20-year data retention Low Power, Wide Temperature Range– Single 2.7 to 3.6V supply– <1µA Power-down (typ.)– -40°C to +85°C op	Small Outline No-lead	W25Q64JWXGSM	3D model available Symbol and footprint available 3	1 Download Model
	W631GU6NB09S Winbond	1	1Gb DDR3 SDRAM 2133MHz VFBGA96	BGA	W631GU6NB09S	3D model available Symbol and footprint available 3	1 Download Model
	W632GU8RB11A Winbond	1	2Gb DDR3 SDRAM 1866MHz VFBGA96	BGA	W632GU8RB11A	3D model available Symbol and footprint available 3	1 Download Model
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