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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	W25Q64JVTCAQ Winbond	1	64Mb Serial NOR Flash 133MHz TFBGA (5X5)24	BGA	W25Q64JVTCAQ	3D model available Symbol and footprint available 3	1 Download Model
	W25Q80EWBYIQ Winbond	1	• Family of SpiFlash Memories\r\n– 8M-bit/1M-byte (1,048,576)\r\n– 256-byte per programmable page\r\n– Standard SPI: CLK, /CS, DI, DO, /WP, /Hold\r\n– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold\r\n– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3\r\n– QPI: CLK, /CS, IO0, IO1, IO2, IO3\r\n• Highest Performance Serial Flash\r\n– 104MHz Dual/Quad SPI clocks\r\n– 208/416MHz equivalent Dual/Quad SPI\r\n– 50MB/S continuous data transfer rate\r\n– Up to 6X that of ordinary Serial Flash\r\n– Min 100K Program-Erase cycles per sector\r\n– More than 20-y	BGA	W25Q80EWBYIQ	3D model available Symbol and footprint available 3	1 Download Model
	W9751G6KB18K Winbond	1	512Mb DDR2 SDRAM 1066MHz WBGA84	BGA	W9751G6KB18K	3D model available Symbol and footprint available 3	1 Download Model
	W634GG6NB11W Winbond	1	 Power Supply: VDD, VDDQ = 1.5V ± 0.075V\r\n Double Data Rate architecture: two data transfers per clock cycle\r\n Eight internal banks for concurrent operation\r\n 8 bit prefetch architecture\r\n CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14\r\n Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF)\r\n Programmable read burst ordering: interleaved or nibble sequential\r\n Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received w	BGA	W634GG6NB11W	3D model available Symbol and footprint available 3	1 Download Model
	W631GU8RB11J Winbond	1	Power Supply: 1.35V (typ.), VDD, VDDQ = 1.283V to 1.45V\r\n⚫ Backward compatible to VDD, VDDQ = 1.5V ± 0.075V\r\n⚫ Double Data Rate architecture: two data transfers per clock cycle\r\n⚫ Eight internal banks for concurrent operation\r\n⚫ 8 bit prefetch architecture\r\n⚫ CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14\r\n⚫ Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF)\r\n⚫ Programmable read burst ordering: interleaved or nibble sequential\r\n⚫ Bi-directional, dif	BGA	W631GU8RB11J	3D model available Symbol and footprint available 3	1 Download Model
	W29N01HZSJNA Winbond	1	1Gb SLC NAND Flash MHz TSOPI48	Small Outline Packages	W29N01HZSJNA	3D model available Symbol and footprint available 3	1 Download Model
	W25N01GWZEJG Winbond	1	1Gb QspiNAND Flash 104MHz SON8	Small Outline No-lead	W25N01GWZEJG	3D model available Symbol and footprint available 3	1 Download Model
	W634GU8NB09K Winbond	1	4Gb DDR3 SDRAM 2133MHz VFBGA78	BGA	W634GU8NB09K	3D model available Symbol and footprint available 3	1 Download Model
	W66AP6NBHAHK Winbond	1	1Gb Low Power DDR4/4X SDRAM 4267MHz VFBGA100	BGA	W66AP6NBHAHK	3D model available Symbol and footprint available 3	1 Download Model
	W9751G6NB25W Winbond	1	 Power Supply: VDD, VDDQ = 1.8 V ± 0.1V\r\n Double Data Rate architecture: two data transfers per clock cycle\r\n CAS Latency: 3, 4, 5, 6 and 7\r\n Burst Length: 4 and 8\r\n Bi-directional, differential data strobes (DQS and\r\nDQS\r\n) are transmitted / received with data\r\n Edge-aligned with Read data and center-aligned with Write data\r\n DLL aligns DQ and DQS transitions with clock\r\n Differential clock inputs (CLK and\r\nCLK\r\n)\r\n Data masks (DM) for write data\r\n Commands entered on each positive CLK edge, data	BGA	W9751G6NB25W	3D model available Symbol and footprint available 3	1 Download Model
	W66AP6NBHAHS Winbond	1	BGA100	BGA	W66AP6NBHAHS	3D model available Symbol and footprint available 3	1 Download Model
	W25Q12PWZPIM Winbond	1	128Mb Serial NOR Flash 166MHz SON8	Small Outline No-lead	W25Q12PWZPIM	3D model available Symbol and footprint available 3	1 Download Model
	W632GU6RB11A Winbond	1	2Gb DDR3 SDRAM 1866MHz VFBGA96	BGA	W632GU6RB11A	3D model available Symbol and footprint available 3	1 Download Model
	W25Q64JWSSIN Winbond	1	64Mb Serial NOR Flash 133MHz SOP8	Small Outline Packages	W25Q64JWSSIN	3D model available Symbol and footprint available 3	1 Download Model
	W632GG8MB12A Winbond	1	SDRAM - DDR3 Memory IC 2Gbit Parallel 800 MHz 20 ns 78-VFBGA (10.5x8)	BGA	W632GG8MB12A	3D model available Symbol and footprint available 3	1 Download Model
	W631GU8RB-12 Winbond	1	1Gb DDR3 SDRAM 1600MHz VFBGA78	BGA	W631GU8RB-12	3D model available Symbol and footprint available 3	1 Download Model
	W25Q80RVSNJM Winbond	1	8Mb Serial NOR Flash 133MHz SOP8	Small Outline Packages	W25Q80RVSNJM	3D model available Symbol and footprint available 3	1 Download Model
	W25Q64JVZPSM Winbond	1	 New Family of SpiFlash Memories\r\n– W25Q64JV: 64M-bit / 8M-byte\r\n– Standard SPI: CLK, /CS, DI, DO\r\n– Dual SPI: CLK, /CS, IO0, IO1\r\n– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3\r\n– Software & Hardware Reset(1)\r\n Highest Performance Serial Flash\r\n– 133MHz Single, Dual/Quad SPI clocks\r\n– 266/532MHz equivalent Dual/Quad SPI\r\n– Min. 100K Program-Erase cycles per sector\r\n– More than 20-year data retention\r\n Low Power, Wide Temperature Range\r\n– Single 2.7 to 3.6V supply\r\n– <1µA Power-down (typ.)\r\n– -40°C to +85°C op	Small Outline No-lead	W25Q64JVZPSM	3D model available Symbol and footprint available 3	1 Download Model
	W25Q32JWTBAM Winbond	1	32Mb Serial NOR Flash 104MHz TFBGA (5X5)24	BGA	W25Q32JWTBAM	3D model available Symbol and footprint available 3	1 Download Model
	W631GU6RB11I Winbond	1	1Gb DDR3 SDRAM 1866MHz VFBGA96	BGA	W631GU6RB11I	3D model available Symbol and footprint available 3	1 Download Model
	W632GU8RB09S Winbond	1	32M x 8 BANKS x 8 BIT DDR3L SDRAM	BGA	W632GU8RB09S	3D model available Symbol and footprint available 3	1 Download Model
	W632GG8NB12S Winbond	1	2Gb DDR3 SDRAM 1600MHz VFBGA78	BGA	W632GG8NB12S	3D model available Symbol and footprint available 3	1 Download Model
	W25Q512JVFJQ Winbond	1	512Mb Serial NOR Flash 133MHz SOP16	Small Outline Packages	W25Q512JVFJQ	3D model available Symbol and footprint available 3	1 Download Model
	W66AP6NBHAFK Winbond	1	1Gb Low Power DDR4/4X SDRAM 3200MHz VFBGA100	BGA	W66AP6NBHAFK	3D model available Symbol and footprint available 3	1 Download Model
	W631GG8MB12S Winbond	1	 Power Supply: VDD, VDDQ = 1.5V ± 0.075V\r\n Double Data Rate architecture: two data transfers per clock cycle\r\n Eight internal banks for concurrent operation\r\n 8 bit prefetch architecture\r\n CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14\r\n Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF)\r\n Programmable read burst ordering: interleaved or nibble sequential\r\n Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received w	BGA	W631GG8MB12S	3D model available Symbol and footprint available 3	1 Download Model
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