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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	W25Q32JVSFJQ Winbond	1	32Mb Serial NOR Flash 133MHz SOP16	Small Outline Packages	W25Q32JVSFJQ	3D model available Symbol and footprint available 3	1 Download Model
	W25Q16RVZPJM Winbond	1	 New Family of SpiFlash Memories– W25Q16RV: 16M-bit/ 2M-byte (2,097,152)– Standard SPI: CLK, /CS, DI, DO, /WP, /Hold– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– SPI/QPI DTR(Double Transfer Rate) Read– Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Single, Dual/Quad SPI clocks– 266/532MHz equivalent Dual/Quad SPI– 66MB/S continuous data transfer rate– Min. 100K Program-Erase cycles– More than 20-year data retention Eff	Small Outline No-lead	W25Q16RVZPJM	3D model available Symbol and footprint available 3	1 Download Model
	W634GU6QB-11 Winbond	1	4Gb DDR3 SDRAM 1866MHz VFBGA96	BGA	W634GU6QB-11	3D model available Symbol and footprint available 3	1 Download Model
	W634GU8NB11W Winbond	1	DDR3 SDRAM 1866MHz	BGA	W634GU8NB11W	3D model available Symbol and footprint available 3	1 Download Model
	W25Q32JWSNSM Winbond	1	32Mb Serial NOR Flash 104MHz SOP8	Small Outline Packages	W25Q32JWSNSM	3D model available Symbol and footprint available 3	1 Download Model
	W25N02KWZEJU Winbond	1	QspiNAND Flash 104MHz	Small Outline No-lead	W25N02KWZEJU	3D model available Symbol and footprint available 3	1 Download Model
	W634GU6NB11W Winbond	1	4Gb DDR3 SDRAM 1866MHz VFBGA96	BGA	W634GU6NB11W	3D model available Symbol and footprint available 3	1 Download Model
	W631GG6NB12K Winbond	1	Power Supply: VDD, VDDQ = 1.5V ± 0.075V⚫ Double Data Rate architecture: two data transfers per clock cycle⚫ Eight internal banks for concurrent operation⚫ 8 bit prefetch architecture⚫ CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14⚫ Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF)⚫ Programmable read burst ordering: interleaved or nibble sequential⚫ Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received wit	BGA	W631GG6NB12K	3D model available Symbol and footprint available 3	1 Download Model
	W25Q64JWXGIQ Winbond	1	FLASH - NOR Memory IC 64Mbit SPI - Quad I/O 133 MHz 8-XSON (4x4)	Small Outline No-lead	W25Q64JWXGIQ	3D model available Symbol and footprint available 3	1 Download Model
	W25Q16RVZPJQ Winbond	1	16Mb Serial NOR Flash 133MHz SON8	Small Outline No-lead	W25Q16RVZPJQ	3D model available Symbol and footprint available 3	1 Download Model
	W25M02GVSFAG Winbond	1	2Gb QspiNAND Flash 104MHz SOP16 2.7V - 3.6V -40℃ ~ 85℃ / -40℃ ~ 105℃ / -40℃ ~ 115℃	Small Outline Packages	W25M02GVSFAG	3D model available Symbol and footprint available 3	1 Download Model
	W972GG6KB25I Winbond	1	2Gb DDR2 SDRAM 800MHz WBGA84	BGA	W972GG6KB25I	3D model available Symbol and footprint available 3	1 Download Model
	W25Q64JWZPIN Winbond	1	64Mb Serial NOR Flash 133MHz SON8	Small Outline No-lead	W25Q64JWZPIN	3D model available Symbol and footprint available 3	1 Download Model
	W25Q64JWZEAQ Winbond	1	New Family of SpiFlash Memories– W25Q64JW: 64M-bit / 8M-byte– Standard SPI: CLK, /CS, DI, DO– Dual SPI: CLK, /CS, IO0, IO1– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Quad I/O SPI clocks– 66MB/S continuous data transfer rate– Min. 100K Program-Erase cycles– More than 20-year data retention Low Power, Wide Temperature Range– Single 1.7V to 1.95Vsupply– <1µA Power-down (typ.)– -40°C to +85°C operating range Fle	Small Outline No-lead	W25Q64JWZEAQ	3D model available Symbol and footprint available 3	1 Download Model
	W632GG8MB09S Winbond	1	SDRAM - DDR3 Memory IC 2Gbit Parallel 800 MHz 20 ns 78-VFBGA (10.5x8)	BGA	W632GG8MB09S	3D model available Symbol and footprint available 3	1 Download Model
	W25N04KWTBIR Winbond	1	 New W25N Family of QspiNANDMemories– W25N04KW: 4G-bit / 512M-Byte– Standard SPI: CLK, /CS, DI, DO, /WP,/Hold– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– Compatible SPI serial flash commands Highest Performance Serial NAND Flash– 104MHz Standard/Dual/Quad SPI clocks– 208/416MHz equivalent Dual/Quad SPI– 50MB/S sequential data transfer rate– Fast Program/Erase performance– 100,000 erase/program cycles(5) (6)– 10-year data retention Low P	BGA	W25N04KWTBIR	3D model available Symbol and footprint available 3	1 Download Model
	W25Q16JVUXAQ Winbond	1	 New Family of SpiFlash Memories– W25Q16JV: 16M-bit / 2M-byte (2,097,152)– Standard SPI: CLK, /CS, DI, DO– Dual SPI: CLK, /CS, IO0, IO1– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Single, Dual/Quad SPI clocks– 266/532MHz equivalent Dual/Quad SPI– 66MB/S continuous data transfer rate– Min. 100K Program-Erase cycles per sector– More than 20-year data retention Efficient “Continuous Read”– Continuous Read with 8/16/	Small Outline No-lead	W25Q16JVUXAQ	3D model available Symbol and footprint available 3	1 Download Model
	W25M512JVFSQ Winbond	1	512Mb SpiStack Flash 104MHz SOP16	Small Outline Packages	W25M512JVFSQ	3D model available Symbol and footprint available 3	1 Download Model
	W25Q80RVSNJQ Winbond	1	 New Family of SpiFlash Memories– W25Q80RV: 8M-bit / 1M-byte (1,048,576)– Standard SPI: CLK, /CS, DI, DO, /WP, /Hold– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3 – Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Single, Dual/Quad SPI clocks– 266/532MHz equivalent Dual/Quad SPI– 66MB/S continuous data transfer rate– Min. 100K Program-Erase cycles– More than 20-year data retention Efficient “Continuous Read”– Continuous Re	Small Outline Packages	W25Q80RVSNJQ	3D model available Symbol and footprint available 3	1 Download Model
	W634GG6NB09J Winbond	1	 Refresh, Self-Refresh, Auto Self-refresh (ASR) and Partial array self refresh (PASR) Precharged Power Down and Active Power Down Data masks (DM) for write data Programmable CAS Write Latency (CWL) per operating frequency Write Latency WL = AL + CWL Multi purpose register (MPR) for readout a predefined system timing calibration bit sequence System level timing calibration support via write leveling and MPR read pattern ZQ Calibration for output driver and ODT using external reference r	BGA	W634GG6NB09J	3D model available Symbol and footprint available 3	1 Download Model
	W25Q64JWUUSM Winbond	1	64Mb Serial NOR Flash 104MHz SON8	Other	W25Q64JWUUSM	3D model available Symbol and footprint available 3	1 Download Model
	W25N01GVSFIT Winbond	1	1Gb QspiNAND Flash 104MHz SOP16	Small Outline Packages	W25N01GVSFIT	3D model available Symbol and footprint available 3	1 Download Model
	W25M512JWESM Winbond	1	The W25M512JV (2 x 256M-bit) Serial MCP (Multi Chip Package) Flash memory is based on the popularW25Q SpiFlash® series by stacking two individual W25Q256JV die into a standard 8-pin package. It offersthe highest memory density for the low pin-count package, as well as Concurrent Operations in Serial Flashmemory for the first time. The W25M SpiStack® series is ideal for small form factor system designs, andapplications that demand high Program/Erase data throughput.The SpiStack® product series intr	Small Outline No-lead	W25M512JWESM	3D model available Symbol and footprint available 3	1 Download Model
	W29N04KZBIBG Winbond	1	4Gb SLC NAND Flash MHz VFBGA63	BGA	W29N04KZBIBG	3D model available Symbol and footprint available 3	1 Download Model
	W97AH6NBVA1W Winbond	1	1Gb Low Power DDR2 SDRAM 1066MHz VFBGA134	BGA	W97AH6NBVA1W	3D model available Symbol and footprint available 3	1 Download Model
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