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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	W9751G8NB18I Winbond	1	 Power Supply: VDD, VDDQ = 1.8 V ± 0.1V Double Data Rate architecture: two data transfers per clock cycle CAS Latency: 3, 4, 5, 6 and 7 Burst Length: 4 and 8 Bi-directional, differential data strobes (DQS andDQS) are transmitted / received with data Edge-aligned with Read data and center-aligned with Write data DLL aligns DQ and DQS transitions with clock Differential clock inputs (CLK andCLK) Data masks (DM) for write data Commands entered on each positive CLK edge, data	BGA	W9751G8NB18I	3D model available Symbol and footprint available 3	1 Download Model
	W9751G8NB-18 Winbond	1	 Power Supply: VDD, VDDQ = 1.8 V ± 0.1V Double Data Rate architecture: two data transfers per clock cycle CAS Latency: 3, 4, 5, 6 and 7 Burst Length: 4 and 8 Bi-directional, differential data strobes (DQS andDQS) are transmitted / received with data Edge-aligned with Read data and center-aligned with Write data DLL aligns DQ and DQS transitions with clock Differential clock inputs (CLK andCLK) Data masks (DM) for write data Commands entered on each positive CLK edge, data	BGA	W9751G8NB-18	3D model available Symbol and footprint available 3	1 Download Model
	W29N01HZDANF Winbond	1	1Gb SLC NAND Flash MHz VFBGA48	BGA	W29N01HZDANF	3D model available Symbol and footprint available 3	1 Download Model
	W9751G6NB18J Winbond	1	512Mb DDR2 SDRAM 1066MHz VFBGA84	BGA	W9751G6NB18J	3D model available Symbol and footprint available 3	1 Download Model
	W9751G8NB-25 Winbond	1	 Power Supply: VDD, VDDQ = 1.8 V ± 0.1V Double Data Rate architecture: two data transfers per clock cycle CAS Latency: 3, 4, 5, 6 and 7 Burst Length: 4 and 8 Bi-directional, differential data strobes (DQS andDQS) are transmitted / received with data Edge-aligned with Read data and center-aligned with Write data DLL aligns DQ and DQS transitions with clock Differential clock inputs (CLK andCLK) Data masks (DM) for write data Commands entered on each positive CLK edge, data	BGA	W9751G8NB-25	3D model available Symbol and footprint available 3	1 Download Model
	W25Q64JWXGJQ Winbond	1	64Mb Serial NOR Flash 133MHz SON8	Small Outline No-lead	W25Q64JWXGJQ	3D model available Symbol and footprint available 3	1 Download Model
	W957D8MFYA5I Winbond	1	128Mb HYPERRAM 400MHz TFBGA (5X5)24	BGA	W957D8MFYA5I	3D model available Symbol and footprint available 3	1 Download Model
	W25Q64JWXGIQ Winbond	1	FLASH - NOR Memory IC 64Mbit SPI - Quad I/O 133 MHz 8-XSON (4x4)	Small Outline No-lead	W25Q64JWXGIQ	3D model available Symbol and footprint available 3	1 Download Model
	W25Q64JWZPIN Winbond	1	64Mb Serial NOR Flash 133MHz SON8	Small Outline No-lead	W25Q64JWZPIN	3D model available Symbol and footprint available 3	1 Download Model
	W25Q64JWZEAQ Winbond	1	New Family of SpiFlash Memories– W25Q64JW: 64M-bit / 8M-byte– Standard SPI: CLK, /CS, DI, DO– Dual SPI: CLK, /CS, IO0, IO1– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Quad I/O SPI clocks– 66MB/S continuous data transfer rate– Min. 100K Program-Erase cycles– More than 20-year data retention Low Power, Wide Temperature Range– Single 1.7V to 1.95Vsupply– <1µA Power-down (typ.)– -40°C to +85°C operating range Fle	Small Outline No-lead	W25Q64JWZEAQ	3D model available Symbol and footprint available 3	1 Download Model
	W25Q16RVZPJQ Winbond	1	16Mb Serial NOR Flash 133MHz SON8	Small Outline No-lead	W25Q16RVZPJQ	3D model available Symbol and footprint available 3	1 Download Model
	W9751G6KB18A Winbond	1	DDR2 SDRAM 1066MHz	BGA	W9751G6KB18A	3D model available Symbol and footprint available 3	1 Download Model
	W25Q16RVSSJM Winbond	1	16Mb Serial NOR Flash 133MHz SOP8	Small Outline Packages	W25Q16RVSSJM	3D model available Symbol and footprint available 3	1 Download Model
	W25M512JWCAQ Winbond	1	 New Family of SpiFlash® Memories– W25M512JV: 2 x 256M-bit (2 x 32M-Byte)– Standard SPI: CLK, /CS, DI, DO– Dual SPI: CLK, /CS, IO0, IO1– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– 3 or 4-Byte Addressing Mode– Software Die Select (C2h)– Software & Hardware Reset(1) High Performance Serial Flash– 104MHz Standard/Dual/Quad SPI clocks– 208/416MHz equivalent Dual/Quad SPI– 50MB/s continuous data transfer rate– Min. 100K Program-Erase cycles persector– More than 20-year data retention	BGA	W25M512JWCAQ	3D model available Symbol and footprint available 3	1 Download Model
	W25N01GVSFIT Winbond	1	1Gb QspiNAND Flash 104MHz SOP16	Small Outline Packages	W25N01GVSFIT	3D model available Symbol and footprint available 3	1 Download Model
	W632GG8NB15S Winbond	1	2Gb DDR3 SDRAM 1333MHz VFBGA78	BGA	W632GG8NB15S	3D model available Symbol and footprint available 3	1 Download Model
	W9751G6KB-3A Winbond	1	512Mb DDR2 SDRAM 667MHz WBGA84	BGA	W9751G6KB-3A	3D model available Symbol and footprint available 3	1 Download Model
	W634GU6QB-11 Winbond	1	4Gb DDR3 SDRAM 1866MHz VFBGA96	BGA	W634GU6QB-11	3D model available Symbol and footprint available 3	1 Download Model
	W25M02GVZEAG Winbond	1	2Gb QspiNAND Flash 104MHz SON8	Small Outline No-lead	W25M02GVZEAG	3D model available Symbol and footprint available 3	1 Download Model
	W631GG6NB12K Winbond	1	Power Supply: VDD, VDDQ = 1.5V ± 0.075V⚫ Double Data Rate architecture: two data transfers per clock cycle⚫ Eight internal banks for concurrent operation⚫ 8 bit prefetch architecture⚫ CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14⚫ Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF)⚫ Programmable read burst ordering: interleaved or nibble sequential⚫ Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received wit	BGA	W631GG6NB12K	3D model available Symbol and footprint available 3	1 Download Model
	W25M02GVSFAG Winbond	1	2Gb QspiNAND Flash 104MHz SOP16 2.7V - 3.6V -40℃ ~ 85℃ / -40℃ ~ 105℃ / -40℃ ~ 115℃	Small Outline Packages	W25M02GVSFAG	3D model available Symbol and footprint available 3	1 Download Model
	W955N8MBYA5A Winbond	1	32Mb HYPERRAM 400MHz TFBGA (5X5)24	BGA	W955N8MBYA5A	3D model available Symbol and footprint available 3	1 Download Model
	W632GG6NB11A Winbond	1	Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received wit	BGA	W632GG6NB11A	3D model available Symbol and footprint available 3	1 Download Model
	W972GG6KB25I Winbond	1	2Gb DDR2 SDRAM 800MHz WBGA84	BGA	W972GG6KB25I	3D model available Symbol and footprint available 3	1 Download Model
	W25Q32JWSNSM Winbond	1	32Mb Serial NOR Flash 104MHz SOP8	Small Outline Packages	W25Q32JWSNSM	3D model available Symbol and footprint available 3	1 Download Model
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