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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	W9751G8NB25J Winbond	1	512Mb DDR2 SDRAM 800MHz VFBGA60	BGA	W9751G8NB25J	3D model available Symbol and footprint available 3	1 Download Model
	W25Q32JWXGIM Winbond	1	SON8	Small Outline No-lead	W25Q32JWXGIM	3D model available Symbol and footprint available 3	1 Download Model
	W9751G8NB18I Winbond	1	 Power Supply: VDD, VDDQ = 1.8 V ± 0.1V Double Data Rate architecture: two data transfers per clock cycle CAS Latency: 3, 4, 5, 6 and 7 Burst Length: 4 and 8 Bi-directional, differential data strobes (DQS andDQS) are transmitted / received with data Edge-aligned with Read data and center-aligned with Write data DLL aligns DQ and DQS transitions with clock Differential clock inputs (CLK andCLK) Data masks (DM) for write data Commands entered on each positive CLK edge, data	BGA	W9751G8NB18I	3D model available Symbol and footprint available 3	1 Download Model
	W9712G6KB25K Winbond	1	128Mb DDR2 SDRAM 800MHz TFBGA 84	BGA	W9712G6KB25K	3D model available Symbol and footprint available 3	1 Download Model
	W25Q01JVZEIQ Winbond	1	1Gb Serial NOR Flash 133MHz SON8	Small Outline No-lead	W25Q01JVZEIQ	3D model available Symbol and footprint available 3	1 Download Model
	W631GU8MB09K Winbond	1	SDRAM - DDR3L Memory IC 1Gbit Parallel 800 MHz 20 ns 78-VFBGA (10.5x8)	BGA	W631GU8MB09K	3D model available Symbol and footprint available 3	1 Download Model
	W634GG6NB09J Winbond	1	 Refresh, Self-Refresh, Auto Self-refresh (ASR) and Partial array self refresh (PASR) Precharged Power Down and Active Power Down Data masks (DM) for write data Programmable CAS Write Latency (CWL) per operating frequency Write Latency WL = AL + CWL Multi purpose register (MPR) for readout a predefined system timing calibration bit sequence System level timing calibration support via write leveling and MPR read pattern ZQ Calibration for output driver and ODT using external reference r	BGA	W634GG6NB09J	3D model available Symbol and footprint available 3	1 Download Model
	W29N01HVBINF Winbond	1	1Gb SLC NAND Flash Memory with uniform 2KB+64B page size	BGA	W29N01HVBINF	3D model available Symbol and footprint available 3	1 Download Model
	W29N01HVDINA Winbond	1	1Gb SLC NAND Flash MHz VFBGA48	BGA	W29N01HVDINA	3D model available Symbol and footprint available 3	1 Download Model
	W25Q128JVEIQ Winbond	1	128M-bit Serial Flash Memory with uniform 4KB sectors and Dual/Quad SPI	Small Outline No-lead	W25Q128JVEIQ	3D model available Symbol and footprint available 3	1 Download Model
	W957D8MFYA5I Winbond	1	128Mb HYPERRAM 400MHz TFBGA (5X5)24	BGA	W957D8MFYA5I	3D model available Symbol and footprint available 3	1 Download Model
	W9751G8NB-18 Winbond	1	 Power Supply: VDD, VDDQ = 1.8 V ± 0.1V Double Data Rate architecture: two data transfers per clock cycle CAS Latency: 3, 4, 5, 6 and 7 Burst Length: 4 and 8 Bi-directional, differential data strobes (DQS andDQS) are transmitted / received with data Edge-aligned with Read data and center-aligned with Write data DLL aligns DQ and DQS transitions with clock Differential clock inputs (CLK andCLK) Data masks (DM) for write data Commands entered on each positive CLK edge, data	BGA	W9751G8NB-18	3D model available Symbol and footprint available 3	1 Download Model
	W94AD6KBHX5I Winbond	1	1Gb Low Power DDR SDRAM 400MHz VFBGA60	BGA	W94AD6KBHX5I	3D model available Symbol and footprint available 3	1 Download Model
	W25Q40EWBYIG Winbond	1	4Mb Serial NOR Flash 104MHz WLCSP8	BGA	W25Q40EWBYIG	3D model available Symbol and footprint available 3	1 Download Model
	W25Q16RVZPJM Winbond	1	 New Family of SpiFlash Memories– W25Q16RV: 16M-bit/ 2M-byte (2,097,152)– Standard SPI: CLK, /CS, DI, DO, /WP, /Hold– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– SPI/QPI DTR(Double Transfer Rate) Read– Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Single, Dual/Quad SPI clocks– 266/532MHz equivalent Dual/Quad SPI– 66MB/S continuous data transfer rate– Min. 100K Program-Erase cycles– More than 20-year data retention Eff	Small Outline No-lead	W25Q16RVZPJM	3D model available Symbol and footprint available 3	1 Download Model
	W634GU8NB11W Winbond	1	DDR3 SDRAM 1866MHz	BGA	W634GU8NB11W	3D model available Symbol and footprint available 3	1 Download Model
	W25Q16JWZPIM Winbond	1	New Family of SpiFlash Memories– W25Q16JW: 16M-bit / 2M-byte (2,097,152)– Standard SPI: CLK, /CS, DI, DO, /WP, /Hold– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– QPI: CLK, /CS, IO0, IO1, IO2, IO3– SPI/QPI DTR(Double Transfer Rate) Read– Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Quad I/O SPI clocks– 208/416MHz equivalent Dual/Quad SPI– 66MB/S continuous data transfer rate– Min. 100K Program-Erase cycles– More than 20	Small Outline No-lead	W25Q16JWZPIM	3D model available Symbol and footprint available 3	1 Download Model
	W9751G6NB18J Winbond	1	512Mb DDR2 SDRAM 1066MHz VFBGA84	BGA	W9751G6NB18J	3D model available Symbol and footprint available 3	1 Download Model
	W9751G8NB-25 Winbond	1	 Power Supply: VDD, VDDQ = 1.8 V ± 0.1V Double Data Rate architecture: two data transfers per clock cycle CAS Latency: 3, 4, 5, 6 and 7 Burst Length: 4 and 8 Bi-directional, differential data strobes (DQS andDQS) are transmitted / received with data Edge-aligned with Read data and center-aligned with Write data DLL aligns DQ and DQS transitions with clock Differential clock inputs (CLK andCLK) Data masks (DM) for write data Commands entered on each positive CLK edge, data	BGA	W9751G8NB-25	3D model available Symbol and footprint available 3	1 Download Model
	W25Q01JVZEJQ Winbond	1	1Gb Serial NOR Flash 133MHz SON8	Small Outline No-lead	W25Q01JVZEJQ	3D model available Symbol and footprint available 3	1 Download Model
	W25Q128JWSIQ Winbond	1	128M-bit Serial Flash Memory with uniform 4KB sectors and Dual/Quad SPI	Small Outline Packages	W25Q128JWSIQ	3D model available Symbol and footprint available 3	1 Download Model
	W634GU6NB11W Winbond	1	4Gb DDR3 SDRAM 1866MHz VFBGA96	BGA	W634GU6NB11W	3D model available Symbol and footprint available 3	1 Download Model
	W25Q40EWSSJG Winbond	1	 Family of SpiFlash Memories– 4M-bit/512K-byte (524,288)– 256-byte per programmable page– Standard SPI: CLK, /CS, DI, DO, /WP, /Hold– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– QPI: CLK, /CS, IO0, IO1, IO2, IO3 Highest Performance Serial Flash– 104MHz Dual/Quad SPI clocks– 208/416MHz equivalent Dual/Quad SPI– 50MB/S continuous data transfer rate– Up to 6X that of ordinary Serial Flash– Min 100K Program-Erase cycles per sector– More than 20-y	Small Outline Packages	W25Q40EWSSJG	3D model available Symbol and footprint available 3	1 Download Model
	W25Q40EWSSIG Winbond	1	4Mb Serial NOR Flash 104MHz SOP8	Small Outline Packages	W25Q40EWSSIG	3D model available Symbol and footprint available 3	1 Download Model
	W25Q128JWPIQ Winbond	1	128M-bit Serial Flash Memory with uniform 4KB sectors and Dual/Quad SPI	Small Outline No-lead	W25Q128JWPIQ	3D model available Symbol and footprint available 3	1 Download Model
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