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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	W25Q32JVUUJM Winbond	1	32Mb Serial NOR Flash 133MHz SON8 ,2.7V - 3.6V .	Other	W25Q32JVUUJM	3D model available Symbol and footprint available 3	1 Download Model
	W634GU8NB12A Winbond	1	4Gb DDR3 SDRAM 1600MHz VFBGA78	BGA	W634GU8NB12A	3D model available Symbol and footprint available 3	1 Download Model
	W29N02KVBIAF Winbond	1	 Basic Features– Density: 2Gbit (Single chip solution)– Vcc: 2.7V to 3.6V– Bus width: x8– Operating temperature Industrial: -40°C to 85°C Single-Level Cell (SLC) technology Organization– Density: 2G-bit/256M-byte– Page size 2,176 bytes– Block size 64 pages Highest Performance– Read performance (Max.) Random read: 25us Sequential read cycle: 25ns– Write Erase performance Page program time: 250us (typ.) Block erase time: 2ms (typ.)– Endurance: 60,000 Erase/Pr	BGA	W29N02KVBIAF	3D model available Symbol and footprint available 3	1 Download Model
	W632GU6NB11S Winbond	1	2Gb DDR3 SDRAM 1866MHz VFBGA96	BGA	W632GU6NB11S	3D model available Symbol and footprint available 3	1 Download Model
	W631GU8MB11W Winbond	1	SDRAM - DDR3L Memory IC 1Gbit Parallel 800 MHz 20 ns 78-VFBGA (10.5x8)	BGA	W631GU8MB11W	3D model available Symbol and footprint available 3	1 Download Model
	W9751G6NB-3K Winbond	1	DDR2 SDRAM 667MHz	BGA	W9751G6NB-3K	3D model available Symbol and footprint available 3	1 Download Model
	W949D6DBHX5I Winbond	1	512Mb Low Power DDR SDRAM 400MHz VFBGA60	BGA	W949D6DBHX5I	3D model available Symbol and footprint available 3	1 Download Model
	W97BH2MBVA2K Winbond	1	2Gb Low Power DDR2 SDRAM 800MHz VFBGA134	BGA	W97BH2MBVA2K	3D model available Symbol and footprint available 3	1 Download Model
	W959D8NFYA5K Winbond	1	512Mb HYPERRAM 400MHz TFBGA (5X5)24	BGA	W959D8NFYA5K	3D model available Symbol and footprint available 3	1 Download Model
	W631GG6NB15A Winbond	1	Power Supply: VDD, VDDQ = 1.5V ± 0.075V⚫ Double Data Rate architecture: two data transfers per clock cycle⚫ Eight internal banks for concurrent operation⚫ 8 bit prefetch architecture⚫ CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14⚫ Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF)⚫ Programmable read burst ordering: interleaved or nibble sequential⚫ Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received wit	BGA	W631GG6NB15A	3D model available Symbol and footprint available 3	1 Download Model
	W25Q40RVZPJM Winbond	1	Serial NOR Flash 133MHz , 8-Pad WSON 6x5-mm (Package Code ZP) .	Small Outline No-lead	W25Q40RVZPJM	3D model available Symbol and footprint available 3	1 Download Model
	W35T51NWTBSF Winbond	1	512Mb Octal NOR Flash 166MHz TFBGA (5X5)24	BGA	W35T51NWTBSF	3D model available Symbol and footprint available 3	1 Download Model
	W25Q64JWXGAQ Winbond	1	 New Family of SpiFlash Memories– W25Q64JV: 64M-bit / 8M-byte– Standard SPI: CLK, /CS, DI, DO– Dual SPI: CLK, /CS, IO0, IO1– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Single, Dual/Quad SPI clocks– 266/532MHz equivalent Dual/Quad SPI– Min. 100K Program-Erase cycles per sector– More than 20-year data retention Low Power, Wide Temperature Range– Single 2.7 to 3.6V supply– <1µA Power-down (typ.)– -40°C to +85°C op	Small Outline No-lead	W25Q64JWXGAQ	3D model available Symbol and footprint available 3	1 Download Model
	W25Q512NWFJM Winbond	1	 New Family of SpiFlash Memories– W25Q512NW: 512M-bit / 64M-byte– Standard SPI: CLK, /CS, DI, DO, /WP, /Hold– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– SPI/QPI DTR (Double Transfer Rate) Read– 3 or 4-Byte Addressing Mode– Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Standard/Dual/Quad SPI clocks– 266/532MHz equivalent Dual/Quad SPI– 66MB/S continuous data transfer rate– Min. 100K Program-Erase cycles– More than 20-y	Small Outline Packages	W25Q512NWFJM	3D model available Symbol and footprint available 3	1 Download Model
	W25Q32JVSFAM Winbond	1	32Mb Serial NOR Flash 133MHz SOP16	Small Outline Packages	W25Q32JVSFAM	3D model available Symbol and footprint available 3	1 Download Model
	W25Q256JWEIQ Winbond	1	256M-bit Serial Flash Memory with uniform 4KB sectors and Dual/Quad SPI	Small Outline No-lead	W25Q256JWEIQ	3D model available Symbol and footprint available 3	1 Download Model
	W25Q32JWUUAQ Winbond	1	1.8V 32M-BIT SERIAL FLASH MEMORY WITH DUAL, QUAD SPI	Other	W25Q32JWUUAQ	3D model available Symbol and footprint available 3	1 Download Model
	W29N01HZBANA Winbond	1	1Gb SLC NAND Flash MHz VFBGA63	BGA	W29N01HZBANA	3D model available Symbol and footprint available 3	1 Download Model
	W25Q16JVXGSQ Winbond	1	New Family of SpiFlash Memories– W25Q16JV: 16M-bit / 2M-byte (2,097,152)– Standard SPI: CLK, /CS, DI, DO– Dual SPI: CLK, /CS, IO0, IO1– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Single, Dual/Quad SPI clocks– 266/532MHz equivalent Dual/Quad SPI– 66MB/S continuous data transfer rate– Min. 100K Program-Erase cycles per sector– More than 20-year data retention Efficient “Continuous Read”– Continuous Read with 8/16/32	Small Outline No-lead	W25Q16JVXGSQ	3D model available Symbol and footprint available 3	1 Download Model
	W25Q32JVTCSQ Winbond	1	 New Family of SpiFlash Memories– W25Q32JV: 32M-bit / 4M-byte– Standard SPI: CLK, /CS, DI, DO– Dual SPI: CLK, /CS, IO0, IO1,– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Single, Dual/Quad SPI clocks– 266/532MHz equivalent Dual/Quad SPI– 66MB/S continuous data transfer rate– Min. 100K Program-Erase cycles per sector– More than 20-year data retention Efficient “Continuous Read”– Continuous Read with 8/16/32/64-Byte	BGA	W25Q32JVTCSQ	3D model available Symbol and footprint available 3	1 Download Model
	W631GG8MB11A Winbond	1	 Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received w	BGA	W631GG8MB11A	3D model available Symbol and footprint available 3	1 Download Model
	W66BP6NBUAGK Winbond	1	WFBGA200	BGA	W66BP6NBUAGK	3D model available Symbol and footprint available 3	1 Download Model
	W634GU8NB-09 Winbond	1	4Gb DDR3 SDRAM 2133MHz VFBGA78	BGA	W634GU8NB-09	3D model available Symbol and footprint available 3	1 Download Model
	W25Q32JWZPSM Winbond	1	32Mb Serial NOR Flash 104MHz SON8	Small Outline No-lead	W25Q32JWZPSM	3D model available Symbol and footprint available 3	1 Download Model
	W948V6KBHX5E Winbond	1	256Mb Low Power DDR SDRAM 400MHz VFBGA60	BGA	W948V6KBHX5E	3D model available Symbol and footprint available 3	1 Download Model
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