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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	W25M512JVESM Winbond	1	512Mb Serial NOR Flash 104MHz SON8 2.7V - 3.6V -40℃ ~ 85℃ / -40℃ ~ 105℃ / -40℃ ~ 125 WSON8 8X6mm	Small Outline No-lead	W25M512JVESM	3D model available Symbol and footprint available 3	1 Download Model
	W631GU6RB11K Winbond	1	1Gb DDR3 SDRAM 1866MHz VFBGA96	BGA	W631GU6RB11K	3D model available Symbol and footprint available 3	1 Download Model
	W632GU6RB11J Winbond	1	2Gb DDR3 SDRAM 1866MHz VFBGA96	BGA	W632GU6RB11J	3D model available Symbol and footprint available 3	1 Download Model
	W9751G6NB18K Winbond	1	512Mb DDR2 SDRAM 1066MHz VFBGA84	BGA	W9751G6NB18K	3D model available Symbol and footprint available 3	1 Download Model
	W94AD6KBHA5K Winbond	1	VFBGA60	BGA	W94AD6KBHA5K	3D model available Symbol and footprint available 3	1 Download Model
	W634GU8RB09J Winbond	1	4Gb DDR3 SDRAM 2133MHz VFBGA78	BGA	W634GU8RB09J	3D model available Symbol and footprint available 3	1 Download Model
	W631GU6MB15K Winbond	1	1Gb DDR3 SDRAM 1333MHz VFBGA96	BGA	W631GU6MB15K	3D model available Symbol and footprint available 3	1 Download Model
	W25Q16JVXGAQ Winbond	1	 New Family of SpiFlash Memories– W25Q16JV: 16M-bit / 2M-byte (2,097,152)– Standard SPI: CLK, /CS, DI, DO– Dual SPI: CLK, /CS, IO0, IO1– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Single, Dual/Quad SPI clocks– 266/532MHz equivalent Dual/Quad SPI– 66MB/S continuous data transfer rate– Min. 100K Program-Erase cycles per sector– More than 20-year data retention Efficient “Continuous Read”– Continuous Read with 8/16/	Small Outline No-lead	W25Q16JVXGAQ	3D model available Symbol and footprint available 3	1 Download Model
	W25N02KVZEJE Winbond	1	QspiNAND Flash 104MHz	Small Outline No-lead	W25N02KVZEJE	3D model available Symbol and footprint available 3	1 Download Model
	W632GU8MB11W Winbond	1	VFBGA - 78	BGA	W632GU8MB11W	3D model available Symbol and footprint available 3	1 Download Model
	W25Q64JWZPSQ Winbond	1	64Mb Serial NOR Flash 104MHz SON8	Small Outline No-lead	W25Q64JWZPSQ	3D model available Symbol and footprint available 3	1 Download Model
	W632GU6QB11I Winbond	1	2Gb DDR3 SDRAM 1866MHz VFBGA96	BGA	W632GU6QB11I	3D model available Symbol and footprint available 3	1 Download Model
	W25Q64JWTBSQ Winbond	1	New Family of SpiFlash Memories– W25Q64JW: 64M-bit / 8M-byte– Standard SPI: CLK, /CS, DI, DO– Dual SPI: CLK, /CS, IO0, IO1– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Quad I/O SPI clocks– 66MB/S continuous data transfer rate– Min. 100K Program-Erase cycles– More than 20-year data retention Low Power, Wide Temperature Range– Single 1.7V to 1.95Vsupply– <1µA Power-down (typ.)– -40°C to +85°C/+105°C operating range	BGA	W25Q64JWTBSQ	3D model available Symbol and footprint available 3	1 Download Model
	W9825G6KH75K Winbond	1	• 3.3V ± 0.3V Power Supply• Up to 200 MHz Clock Frequency• 4,194,304 Words  4 Banks  16 Bits Organization• Self Refresh Mode: Standard and Low Power• CAS Latency: 2 and 3• Burst Length: 1, 2, 4, 8 and Full Page• Burst Read, Single Writes Mode• Byte Data Controlled by LDQM, UDQM• Power Down Mode• Auto-precharge and Controlled Precharge• 8K Refresh Cycles/64 mS, @ -40°C ≤ TA ≤ 85°C• 8K Refresh Cycles/16 mS, @ 85°C < TA ≤ 105°C• Interface: LVTTL• Packaged in TSOP II 54-pin, 400 mil	Small Outline Packages	W9825G6KH75K	3D model available Symbol and footprint available 3	1 Download Model
	W97AH2KBVA1A Winbond	1	PACKAGE-BGA134	BGA	W97AH2KBVA1A	3D model available Symbol and footprint available 3	1 Download Model
	W634GU6RB09I Winbond	1	4Gb DDR3 SDRAM 2133MHz VFBGA96	BGA	W634GU6RB09I	3D model available Symbol and footprint available 3	1 Download Model
	W632GG8MB11W Winbond	1	SDRAM - DDR3 Memory IC 2Gbit Parallel 800 MHz 20 ns 78-VFBGA (10.5x8)	BGA	W632GG8MB11W	3D model available Symbol and footprint available 3	1 Download Model
	W634GU8NB11K Winbond	1	PACKAGE-BGA78	BGA	W634GU8NB11K	3D model available Symbol and footprint available 3	1 Download Model
	W25N02KVZEJU Winbond	1	QspiNAND Flash 104MHz	Small Outline No-lead	W25N02KVZEJU	3D model available Symbol and footprint available 3	1 Download Model
	W25N01KWZEJU Winbond	1	QspiNAND Flash 104MHz	Small Outline No-lead	W25N01KWZEJU	3D model available Symbol and footprint available 3	1 Download Model
	W632GU8MB15K Winbond	1	DDR3 SDRAM 1333MHz	BGA	W632GU8MB15K	3D model available Symbol and footprint available 3	1 Download Model
	W632GG6MB11S Winbond	1	Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received wit	BGA	W632GG6MB11S	3D model available Symbol and footprint available 3	1 Download Model
	W25N01KVZEJE Winbond	1	QspiNAND Flash 104MHz	Small Outline No-lead	W25N01KVZEJE	3D model available Symbol and footprint available 3	1 Download Model
	W632GU8RB11K Winbond	1	2Gb DDR3 SDRAM 1866MHz VFBGA96	BGA	W632GU8RB11K	3D model available Symbol and footprint available 3	1 Download Model
	W631GU6MB09S Winbond	1	 Power Supply: 1.35V (typ.), VDD, VDDQ = 1.283V to 1.45V Backward compatible to VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, d	BGA	W631GU6MB09S	3D model available Symbol and footprint available 3	1 Download Model
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