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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	W25Q32JWSSIQ Winbond	1	32Mb Serial NOR Flash 133MHz SOP8	Small Outline Packages	W25Q32JWSSIQ	3D model available Symbol and footprint available 3	1 Download Model
	W97AH6NBVA2E Winbond	1	1Gb Low Power DDR2 SDRAM 800MHz VFBGA134	BGA	W97AH6NBVA2E	3D model available Symbol and footprint available 3	1 Download Model
	W29N08GZSIBA Winbond	1	Basic Features– Density : 8Gbit (2 chip stacked solution)– Vcc : 1.7V to 1.95V– Bus width : x8/x16– Operating temperature Industrial: -40°C to 85°C Industrial Plus: -40°C to 105°C Single-Level Cell (SLC) technology. Organization– Density: 8G-bit/1G-byte– Page size 2,112 bytes (2048 + 64 bytes) 1,056 words (1024 + 32 words)– Block size 64 pages (128K + 4K bytes) 64 pages (64K + 2K words) Highest Performance– Read performance (Max.) Random read: 25us Sequential	Small Outline Packages	W29N08GZSIBA	3D model available Symbol and footprint available 3	1 Download Model
	W956D8MBYA5I Winbond	1	64Mb HYPERRAM 400MHz TFBGA (5X5)24	BGA	W956D8MBYA5I	3D model available Symbol and footprint available 3	1 Download Model
	W66BQ6NBUAHJ Winbond	1	This is a 2Gb Low Power DDR4X SDRAM organized as 16M words x 8 banks x 16bits with single channel	BGA	W66BQ6NBUAHJ	3D model available Symbol and footprint available 3	1 Download Model
	W25Q16RVSNJQ Winbond	1	16Mb Serial NOR Flash 133MHz SOP8	Small Outline Packages	W25Q16RVSNJQ	3D model available Symbol and footprint available 3	1 Download Model
	W25Q32JVZPIM Winbond	1	32M-bit Serial Flash Memory with uniform 4KB sectors and Dual/Quad SPI	Small Outline No-lead	W25Q32JVZPIM	3D model available Symbol and footprint available 3	1 Download Model
	W25Q32JVTCIM Winbond	1	32Mb Serial NOR Flash 133MHz TFBGA (4X6)24	BGA	W25Q32JVTCIM	3D model available Symbol and footprint available 3	1 Download Model
	W25Q16JLSSIG Winbond	1	16Mb Serial NOR Flash 104MHz SOP8	Small Outline Packages	W25Q16JLSSIG	3D model available Symbol and footprint available 3	1 Download Model
	W25Q80EWUXIE Winbond	1	8Mb Serial NOR Flash 104MHz SON8	Small Outline No-lead	W25Q80EWUXIE	3D model available Symbol and footprint available 3	1 Download Model
	W25Q512NWEIQ Winbond	1	512Mb Serial NOR Flash 133MHz SON8	Small Outline No-lead	W25Q512NWEIQ	3D model available Symbol and footprint available 3	1 Download Model
	W25Q16JWZPJQ Winbond	1	New Family of SpiFlash Memories– W25Q16JW: 16M-bit / 2M-byte– Standard SPI: CLK, /CS, DI, DO– Dual SPI: CLK, /CS, IO0, IO1,– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Quad I/O SPI clocks– 66MB/S continuous data transfer rate– Min. 100K Program-Erase cycles– More than 20-year data retention Low Power, Wide Temperature Range– Single 1.65V to 1.95V supply– <0.1µA Power-down (typ.)– -40°C to +85°C operating range	Small Outline No-lead	W25Q16JWZPJQ	3D model available Symbol and footprint available 3	1 Download Model
	W25Q20EWSNJG Winbond	1	2Mb Serial NOR Flash 104MHz SOP8	Small Outline Packages	W25Q20EWSNJG	3D model available Symbol and footprint available 3	1 Download Model
	W25Q64JVTCJQ Winbond	1	64Mb Serial NOR Flash 133MHz TFBGA (4X6)24	BGA	W25Q64JVTCJQ	3D model available Symbol and footprint available 3	1 Download Model
	W29N04GVBIAA Winbond	1	4Gb SLC NAND Flash MHz VFBGA63	BGA	W29N04GVBIAA	3D model available Symbol and footprint available 3	1 Download Model
	W25Q32JWTBJQ Winbond	1	 New Family of SpiFlash Memories– W25Q32JW: 32M-bit / 4M-byte– Standard SPI: CLK, /CS, DI, DO– Dual SPI: CLK, /CS, IO0, IO1,– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Quad I/O SPI clocks– 66MB/S continuous data transfer rate– Min. 100K Program-Erase cycles– More than 20-year data retention Low Power, Wide Temperature Range– Single 1.7V to 1.95V supply– <0.1µA Power-down (typ.)– -40°C to +85/105°C operating ra	BGA	W25Q32JWTBJQ	3D model available Symbol and footprint available 3	1 Download Model
	W66AQ6NBHAHJ Winbond	1	BGA100	BGA	W66AQ6NBHAHJ	3D model available Symbol and footprint available 3	1 Download Model
	W634GG8NB12K Winbond	1	DDR3 SDRAM 1600MHz	BGA	W634GG8NB12K	3D model available Symbol and footprint available 3	1 Download Model
	W632GG6NB12K Winbond	1	 Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received w	BGA	W632GG6NB12K	3D model available Symbol and footprint available 3	1 Download Model
	W66AQ6NBHAGJ Winbond	1	VFBGA100	BGA	W66AQ6NBHAGJ	3D model available Symbol and footprint available 3	1 Download Model
	W25Q12PWZPIM Winbond	1	128Mb Serial NOR Flash 166MHz SON8	Small Outline No-lead	W25Q12PWZPIM	3D model available Symbol and footprint available 3	1 Download Model
	W25Q64JVZEAQ Winbond	1	64Mb Serial NOR Flash 133MHz SON8	Small Outline No-lead	W25Q64JVZEAQ	3D model available Symbol and footprint available 3	1 Download Model
	W97AH6NBVA2W Winbond	1	1Gb Low Power DDR2 SDRAM 800MHz VFBGA134	BGA	W97AH6NBVA2W	3D model available Symbol and footprint available 3	1 Download Model
	W66AP6NBHAHJ Winbond	1	VFBGA100	BGA	W66AP6NBHAHJ	3D model available Symbol and footprint available 3	1 Download Model
	W25N512GWEIU Winbond	1	512Mb Serial NAND Flash Memory with uniform 2KB+64B page size and set Buffer Read Mode as default	Small Outline No-lead	W25N512GWEIU	3D model available Symbol and footprint available 3	1 Download Model
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