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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	W957D6NBGX4I Winbond	1	128Mb HYPERRAM 500MHz WFBGA49	BGA	W957D6NBGX4I	3D model available Symbol and footprint available 3	1 Download Model
	W9725G8KB25I Winbond	1	BGA60	BGA	W9725G8KB25I	3D model available Symbol and footprint available 3	1 Download Model
	W634GG8NB11A Winbond	1	4Gb DDR3 SDRAM 1866MHz VFBGA78	BGA	W634GG8NB11A	3D model available Symbol and footprint available 3	1 Download Model
	W25N01GVZEAG Winbond	1	1Gb QspiNAND Flash 104MHz SON8	Small Outline No-lead	W25N01GVZEAG	3D model available Symbol and footprint available 3	1 Download Model
	W25Q16JVXGIQ Winbond	1	16Mb Serial NOR Flash 133MHz SON8	Small Outline No-lead	W25Q16JVXGIQ	3D model available Symbol and footprint available 3	1 Download Model
	W25M512JVCSQ Winbond	1	FLASH - NOR Memory IC 512Mbit SPI 104 MHz	BGA	W25M512JVCSQ	3D model available Symbol and footprint available 3	1 Download Model
	W632GU6RB11A Winbond	1	2Gb DDR3 SDRAM 1866MHz VFBGA96	BGA	W632GU6RB11A	3D model available Symbol and footprint available 3	1 Download Model
	W25Q64JWSSIN Winbond	1	64Mb Serial NOR Flash 133MHz SOP8	Small Outline Packages	W25Q64JWSSIN	3D model available Symbol and footprint available 3	1 Download Model
	W631GG8MB09A Winbond	1	 Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received w	BGA	W631GG8MB09A	3D model available Symbol and footprint available 3	1 Download Model
	W25N01KWZEIE Winbond	1	 New W25N Family of SpiFlash Memories– W25N01GV: 1G-bit / 128M-byte– Standard SPI: CLK, /CS, DI, DO, /WP, /Hold– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– Compatible SPI serial flash commands Highest Performance Serial NAND Flash– 104MHz Standard/Dual/Quad SPI clocks– 208/416MHz equivalent Dual/Quad SPI– 50MB/S continuous data transfer rate– Fast Program/Erase performance– 100,000 erase/program cycles(4)– 10-year data retention Efficient “	Small Outline No-lead	W25N01KWZEIE	3D model available Symbol and footprint available 3	1 Download Model
	W29N02GZBABF Winbond	1	2Gb SLC NAND Flash MHz VFBGA63	BGA	W29N02GZBABF	3D model available Symbol and footprint available 3	1 Download Model
	W632GU6RB12I Winbond	1	2Gb DDR3 SDRAM 1600MHz VFBGA96	BGA	W632GU6RB12I	3D model available Symbol and footprint available 3	1 Download Model
	W634GU6NB12K Winbond	1	4Gb DDR3 SDRAM 1600MHz VFBGA96	BGA	W634GU6NB12K	3D model available Symbol and footprint available 3	1 Download Model
	W25Q16RVXHJQ Winbond	1	 New Family of SpiFlash Memories– W25Q16RV: 16M-bit/ 2M-byte (2,097,152)– Standard SPI: CLK, /CS, DI, DO– Dual SPI: CLK, /CS, IO0, IO1– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Single, Dual/Quad SPI clocks– 266/532MHz equivalent Dual/Quad SPI– 66MB/S continuous data transfer rate– Min. 100K Program-Erase cycles– More than 20-year data retention Efficient “Continuous Read” and QPI Mode– Continuous Read with 8/16	Small Outline No-lead	W25Q16RVXHJQ	3D model available Symbol and footprint available 3	1 Download Model
	W25Q01NWSFJM Winbond	1	1Gb Serial NOR Flash 133MHz SOP16	Small Outline Packages	W25Q01NWSFJM	3D model available Symbol and footprint available 3	1 Download Model
	W9725G6KB18K Winbond	1	256Mb DDR2 SDRAM 1066MHz WBGA84	BGA	W9725G6KB18K	3D model available Symbol and footprint available 3	1 Download Model
	W631GG6MB11S Winbond	1	 Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received w	BGA	W631GG6MB11S	3D model available Symbol and footprint available 3	1 Download Model
	W957D8MFYA5A Winbond	1	Interface: HyperBus• Power supply: 1.7V~2.0V or 2.7V~3.6V• Maximum clock rate: 200MHz• Double-Data Rate (DDR) Up to 400 MT/s• Clock:– Single ended clock (CK)– Differential clock (CK/CK#)• Chip Select (CS#)• 8-bit data bus (DQ[7:0])• Hardware reset (RESET#)• Read-Write Data Strobe (RWDS)– Bidirectional Data Strobe / Mask– Output at the start of all transactions to indicaterefresh latency– Output during read transactions as Read DataStrobe– Input during write transactions as Wr	BGA	W957D8MFYA5A	3D model available Symbol and footprint available 3	1 Download Model
	W632GU8RB09S Winbond	1	32M x 8 BANKS x 8 BIT DDR3L SDRAM	BGA	W632GU8RB09S	3D model available Symbol and footprint available 3	1 Download Model
	W631GU6RB11I Winbond	1	1Gb DDR3 SDRAM 1866MHz VFBGA96	BGA	W631GU6RB11I	3D model available Symbol and footprint available 3	1 Download Model
	W66AP6NBHAHS Winbond	1	BGA100	BGA	W66AP6NBHAHS	3D model available Symbol and footprint available 3	1 Download Model
	W9751G6KB18K Winbond	1	512Mb DDR2 SDRAM 1066MHz WBGA84	BGA	W9751G6KB18K	3D model available Symbol and footprint available 3	1 Download Model
	W634GG6NB11W Winbond	1	 Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received w	BGA	W634GG6NB11W	3D model available Symbol and footprint available 3	1 Download Model
	W631GU8RB11J Winbond	1	Power Supply: 1.35V (typ.), VDD, VDDQ = 1.283V to 1.45V⚫ Backward compatible to VDD, VDDQ = 1.5V ± 0.075V⚫ Double Data Rate architecture: two data transfers per clock cycle⚫ Eight internal banks for concurrent operation⚫ 8 bit prefetch architecture⚫ CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14⚫ Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF)⚫ Programmable read burst ordering: interleaved or nibble sequential⚫ Bi-directional, dif	BGA	W631GU8RB11J	3D model available Symbol and footprint available 3	1 Download Model
	W29N01HZSJNA Winbond	1	1Gb SLC NAND Flash MHz TSOPI48	Small Outline Packages	W29N01HZSJNA	3D model available Symbol and footprint available 3	1 Download Model
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