Showing 25 of 10385 results
| Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action |
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| Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action |
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W25Q32JWXGIQ
Winbond
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1 | 32Mb Serial NOR Flash 133MHz SON8 | Small Outline No-lead | W25Q32JWXGIQ |
3
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W25N01GWTCIG
Winbond
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1 | 1Gb Serial NAND Flash Memory with uniform 2KB+64B page size and set Buffer Read Mode as default | BGA | W25N01GWTCIG |
3
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W66AP6NBHAHK
Winbond
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1 | 1Gb Low Power DDR4/4X SDRAM 4267MHz VFBGA100 | BGA | W66AP6NBHAHK |
3
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W25Q16JWXHIM
Winbond
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1 | New Family of SpiFlash Memories– W25Q16JW: 16M-bit / 2M-byte (2,097,152)– Standard SPI: CLK, /CS, DI, DO, /WP, /Hold– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– QPI: CLK, /CS, IO0, IO1, IO2, IO3– SPI/QPI DTR(Double Transfer Rate) Read– Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Quad I/O SPI clocks– 208/416MHz equivalent Dual/Quad SPI– 66MB/S continuous data transfer rate– Min. 100K Program-Erase cycles– More than 20 | Small Outline No-lead | W25Q16JWXHIM |
3
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W9751G6NB25W
Winbond
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1 | Power Supply: VDD, VDDQ = 1.8 V ± 0.1V Double Data Rate architecture: two data transfers per clock cycle CAS Latency: 3, 4, 5, 6 and 7 Burst Length: 4 and 8 Bi-directional, differential data strobes (DQS andDQS) are transmitted / received with data Edge-aligned with Read data and center-aligned with Write data DLL aligns DQ and DQS transitions with clock Differential clock inputs (CLK andCLK) Data masks (DM) for write data Commands entered on each positive CLK edge, data | BGA | W9751G6NB25W |
3
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W25Q80DVSNJG
Winbond
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1 | 8Mb Serial NOR Flash 104MHz SOP8 | Small Outline Packages | W25Q80DVSNJG |
3
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W25X40CLZPIG
Winbond
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1 | 4Mb Serial NOR Flash 104MHz SON8 | Small Outline No-lead | W25X40CLZPIG |
3
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W25Q512NWEIM
Winbond
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1 | 512Mb Serial NOR Flash 133MHz SON8 | Small Outline No-lead | W25Q512NWEIM |
3
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W9825G6KH-6K
Winbond
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1 | Density 256Mb SDRAM 166MHz TSOPII54 3.3V±0.3V Frequency166 / 200Mbps | Small Outline Packages | W9825G6KH-6K |
3
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Download Model |
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W29N04GVBJAF
Winbond
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1 | Basic Features– Density: 4Gbit (Single chip solution)– Vcc: 2.7V to 3.6V– Bus width: x8– Operating temperature▪ Industrial: -40°C to 85°C• Single-Level Cell (SLC) technology.• Organization– Density: 4G-bit/512M-byte– Page size▪ 2,112 bytes (2048 + 64 bytes)– Block size▪ 64 pages (128K + 4K bytes)• Highest Performance– Read performance (Max.)▪ Random read: 25us▪ Sequential read cycle: 25ns– Write Erase performance▪ Page program time: 250us(typ.)▪ Block erase time: 2ms(ty | BGA | W29N04GVBJAF |
3
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W25Q32JWSSSM
Winbond
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1 | 32Mb Serial NOR Flash 104MHz SOP8 | Small Outline Packages | W25Q32JWSSSM |
3
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W25Q32JVTBAM
Winbond
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1 | New Family of SpiFlash Memories– W25Q32JV: 32M-bit / 4M-byte– Standard SPI: CLK, /CS, DI, DO– Dual SPI: CLK, /CS, IO0, IO1,– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Single, Dual/Quad SPI clocks– 266/532MHz equivalent Dual/Quad SPI– 66MB/S continuous data transfer rate– Min. 100K Program-Erase cycles per sector– More than 20-year data retention Efficient “Continuous Read”– Continuous Read with 8/16/32/64-Byte | BGA | W25Q32JVTBAM |
3
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W948D6KBHX6E
Winbond
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1 | 256Mb Low Power DDR SDRAM 333MHz VFBGA60 | BGA | W948D6KBHX6E |
3
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W29N04GVSIAF
Winbond
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1 | • Basic Features– Density: 4Gbit (Single chip solution)– Vcc: 2.7V to 3.6V– Bus width: x8– Operating temperature▪ Industrial: -40°C to 85°C• Single-Level Cell (SLC) technology.• Organization– Density: 4G-bit/512M-byte– Page size▪ 2,112 bytes (2048 + 64 bytes)– Block size▪ 64 pages (128K + 4K bytes)• Highest Performance– Read performance (Max.)▪ Random read: 25us▪ Sequential read cycle: 25ns– Write Erase performance▪ Page program time: 250us(typ.)▪ Block erase time: 2ms( | Small Outline Packages | W29N04GVSIAF |
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W29N04GZSJBF
Winbond
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1 | SLC NAND Flash MHz | Small Outline Packages | W29N04GZSJBF |
3
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W66AQ6NBHAFI
Winbond
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1 | BGA100 | BGA | W66AQ6NBHAFI |
3
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W66AP6NBHAGI
Winbond
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1 | 1Gb Low Power DDR4/4X SDRAM 3733MHz VFBGA100 | BGA | W66AP6NBHAGI |
3
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W634GG8NB-09
Winbond
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1 | 4Gb DDR3 SDRAM 2133MHz VFBGA78 | BGA | W634GG8NB-09 |
3
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W631GU8NB12A
Winbond
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1 | DDR3 SDRAM 1600MHz | BGA | W631GU8NB12A |
3
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W972GG6KB-18
Winbond
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1 | 2Gb DDR2 SDRAM 1066MHz WBGA84 | BGA | W972GG6KB-18 |
3
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W972GG6KB-25
Winbond
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1 | 2Gb DDR2 SDRAM 800MHz WBGA84 | BGA | W972GG6KB-25 |
3
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W25N512GVBIG
Winbond
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1 | 512Mb Serial NAND Flash Memory with uniform 2KB+64B page size and set Buffer Read Mode as default | BGA | W25N512GVBIG |
3
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W632GU6MB15A
Winbond
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1 | 2Gb DDR3 SDRAM 1333MHz VFBGA96 | BGA | W632GU6MB15A |
3
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W25Q32JWTBAM
Winbond
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1 | 32Mb Serial NOR Flash 104MHz TFBGA (5X5)24 | BGA | W25Q32JWTBAM |
3
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W634GG6NB12J
Winbond
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1 | 4Gb DDR3 SDRAM 1600MHz VFBGA96 | BGA | W634GG6NB12J |
3
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