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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	W638GU6QB-11 Winbond	1	⚫ Backward compatible to VDD, VDDQ = 1.5V ± 0.075V⚫ Double Data Rate architecture: two data transfers per clock cycle⚫ Eight internal banks for concurrent operation⚫ 8 bit prefetch architecture⚫ CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14⚫ Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF)⚫ Programmable read burst ordering: interleaved or nibble sequential⚫ Bi-directional, differential data strobes (DQS and DQS#) are transmitted / r	BGA	W638GU6QB-11	3D model available Symbol and footprint available 3	1 Download Model
	W25Q64JVZEIQ Winbond	1	FLASH - NOR Memory IC 64Mbit SPI - Quad I/O 133 MHz 8-WSON (8x6)	Small Outline No-lead	W25Q64JVZEIQ	3D model available Symbol and footprint available 3	1 Download Model
	W25N01KVZPJU Winbond	1	QspiNAND Flash 104MHz	Small Outline No-lead	W25N01KVZPJU	3D model available Symbol and footprint available 3	1 Download Model
	W25Q512NWBJQ Winbond	1	 New Family of SpiFlash Memories– W25Q512NW: 512M-bit / 64M-byte– Standard SPI: CLK, /CS, DI, DO– Dual SPI: CLK, /CS, IO0, IO1,– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– 3 or 4-Byte Addressing Mode– Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Standard/Dual/Quad SPI clocks– 266/532MHz equivalent Dual/Quad SPI– 66MB/S continuous data transfer rate– Min. 100K Program-Erase cycles– More than 20-year data retention Efficient Read– Allows true XIP (execute i	BGA	W25Q512NWBJQ	3D model available Symbol and footprint available 3	1 Download Model
	W25Q16JVSSIQ Winbond	1	16Mb Serial NOR Flash 133MHz SOP8	Small Outline Packages	W25Q16JVSSIQ	3D model available Symbol and footprint available 3	1 Download Model
	W632GU6MB12A Winbond	1	2Gb DDR3 SDRAM 1600MHz VFBGA96	BGA	W632GU6MB12A	3D model available Symbol and footprint available 3	1 Download Model
	W979H6KBVA2A Winbond	1	Low Power DDR2 SDRAM 800MHz	BGA	W979H6KBVA2A	3D model available Symbol and footprint available 3	1 Download Model
	W631GU8RB09I Winbond	1	Power Supply: 1.35V (typ.), VDD, VDDQ = 1.283V to 1.45V⚫ Backward compatible to VDD, VDDQ = 1.5V ± 0.075V⚫ Double Data Rate architecture: two data transfers per clock cycle⚫ Eight internal banks for concurrent operation⚫ 8 bit prefetch architecture⚫ CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14⚫ Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF)⚫ Programmable read burst ordering: interleaved or nibble sequential⚫ Bi-directional, dif	BGA	W631GU8RB09I	3D model available Symbol and footprint available 3	1 Download Model
	W972GG6KB25K Winbond	1	2Gb DDR2 SDRAM 800MHz WBGA84	BGA	W972GG6KB25K	3D model available Symbol and footprint available 3	1 Download Model
	W25Q16JVSSAQ Winbond	1	New Family of SpiFlash Memories– W25Q16JV: 16M-bit / 2M-byte (2,097,152)– Standard SPI: CLK, /CS, DI, DO– Dual SPI: CLK, /CS, IO0, IO1– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Single, Dual/Quad SPI clocks– 266/532MHz equivalent Dual/Quad SPI– 66MB/S continuous data transfer rate– Min. 100K Program-Erase cycles per sector– More than 20-year data retention Efficient “Continuous Read”– Continuous Read with 8/16/32	Small Outline Packages	W25Q16JVSSAQ	3D model available Symbol and footprint available 3	1 Download Model
	W972GG6KB18W Winbond	1	DDR2 SDRAM 1066MHz	BGA	W972GG6KB18W	3D model available Symbol and footprint available 3	1 Download Model
	W25Q80EWBYIQ Winbond	1	• Family of SpiFlash Memories– 8M-bit/1M-byte (1,048,576)– 256-byte per programmable page– Standard SPI: CLK, /CS, DI, DO, /WP, /Hold– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– QPI: CLK, /CS, IO0, IO1, IO2, IO3• Highest Performance Serial Flash– 104MHz Dual/Quad SPI clocks– 208/416MHz equivalent Dual/Quad SPI– 50MB/S continuous data transfer rate– Up to 6X that of ordinary Serial Flash– Min 100K Program-Erase cycles per sector– More than 20-y	BGA	W25Q80EWBYIQ	3D model available Symbol and footprint available 3	1 Download Model
	W9816G6JH-6K Winbond	1	SDRAM 166MHz TSOPII50	Small Outline Packages	W9816G6JH-6K	3D model available Symbol and footprint available 3	1 Download Model
	W29N02KZSIBE Winbond	1	2Gb SLC NAND Flash MHz TSOPI48	Small Outline Packages	W29N02KZSIBE	3D model available Symbol and footprint available 3	1 Download Model
	W972GG6KB18J Winbond	1	DDR2 SDRAM 1066MHz	BGA	W972GG6KB18J	3D model available Symbol and footprint available 3	1 Download Model
	W634GU6RB11K Winbond	1	4Gb DDR3 SDRAM 1866MHz VFBGA96	BGA	W634GU6RB11K	3D model available Symbol and footprint available 3	1 Download Model
	W632GU8NB15W Winbond	1	2Gb DDR3 SDRAM 1333MHz VFBGA78	BGA	W632GU8NB15W	3D model available Symbol and footprint available 3	1 Download Model
	W25N01GVSFKG Winbond	1	New W25N Family of SpiFlash Memories– W25N01GV: 1G-bit / 128M-byte– Standard SPI: CLK, /CS, DI, DO, /WP,/Hold– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– Compatible SPI serial flash commands Highest Performance Serial NAND Flash– 104MHz Standard/Dual/Quad SPI clocks– 208/416MHz equivalent Dual/Quad SPI– 50MB/S continuous data transfer rate– Fast Program/Erase performance– More than 100,000 erase/program cycles(4)– More than 10-year data reten	Small Outline Packages	W25N01GVSFKG	3D model available Symbol and footprint available 3	1 Download Model
	W631GG8MB12A Winbond	1	Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received wit	BGA	W631GG8MB12A	3D model available Symbol and footprint available 3	1 Download Model
	W632GU6MB15S Winbond	1	2Gb DDR3 SDRAM 1333MHz VFBGA96	BGA	W632GU6MB15S	3D model available Symbol and footprint available 3	1 Download Model
	W634GU8NB09K Winbond	1	4Gb DDR3 SDRAM 2133MHz VFBGA78	BGA	W634GU8NB09K	3D model available Symbol and footprint available 3	1 Download Model
	W632GU8QB11I Winbond	1	2Gb DDR3 SDRAM 1866MHz VFBGA78	BGA	W632GU8QB11I	3D model available Symbol and footprint available 3	1 Download Model
	W631GU8RB11I Winbond	1	Power Supply: 1.35V (typ.), VDD, VDDQ = 1.283V to 1.45V⚫ Backward compatible to VDD, VDDQ = 1.5V ± 0.075V⚫ Double Data Rate architecture: two data transfers per clock cycle⚫ Eight internal banks for concurrent operation⚫ 8 bit prefetch architecture⚫ CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14⚫ Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF)⚫ Programmable read burst ordering: interleaved or nibble sequential⚫ Bi-directional, dif	BGA	W631GU8RB11I	3D model available Symbol and footprint available 3	1 Download Model
	W9725G6KB25W Winbond	1	256Mb DDR2 SDRAM 800MHz WBGA84	BGA	W9725G6KB25W	3D model available Symbol and footprint available 3	1 Download Model
	W632GU8NB12W Winbond	1	2Gb DDR3 SDRAM 1600MHz VFBGA78	BGA	W632GU8NB12W	3D model available Symbol and footprint available 3	1 Download Model
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