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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	W631GG6NB11K Winbond	1	Power Supply: VDD, VDDQ = 1.5V ± 0.075V⚫ Double Data Rate architecture: two data transfers per clock cycle⚫ Eight internal banks for concurrent operation⚫ 8 bit prefetch architecture⚫ CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14⚫ Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF)⚫ Programmable read burst ordering: interleaved or nibble sequential⚫ Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received wit	BGA	W631GG6NB11K	3D model available Symbol and footprint available 3	1 Download Model
	W25M512JWBAM Winbond	1	512Mb Serial NOR Flash 104MHz TFBGA (5X5)24	BGA	W25M512JWBAM	3D model available Symbol and footprint available 3	1 Download Model
	W29N01HVDKNF Winbond	1	NAND Flash 1G-bit NAND flash, 3V, 1-bit ECC, 3V, 48 ball VFBGA (x8)	BGA	W29N01HVDKNF	3D model available Symbol and footprint available 3	1 Download Model
	W9751G6NB18I Winbond	1	512Mb DDR2 SDRAM 1066MHz VFBGA84	BGA	W9751G6NB18I	3D model available Symbol and footprint available 3	1 Download Model
	W25Q40EWUXJE Winbond	1	4Mb Serial NOR Flash 104MHz SON8	Small Outline No-lead	W25Q40EWUXJE	3D model available Symbol and footprint available 3	1 Download Model
	W25Q32JVTBSQ Winbond	1	32Mb Serial NOR Flash 133MHz TFBGA (5X5)24	BGA	W25Q32JVTBSQ	3D model available Symbol and footprint available 3	1 Download Model
	W25Q64JVZEJQ Winbond	1	64Mb Serial NOR Flash 133MHz SON8	Small Outline No-lead	W25Q64JVZEJQ	3D model available Symbol and footprint available 3	1 Download Model
	W25M512JWCSQ Winbond	1	Serial NOR Flash 104MHz	BGA	W25M512JWCSQ	3D model available Symbol and footprint available 3	1 Download Model
	W632GG6MB15A Winbond	1	 Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received w	BGA	W632GG6MB15A	3D model available Symbol and footprint available 3	1 Download Model
	W631GU8MB12S Winbond	1	SDRAM - DDR3L Memory IC 1Gbit Parallel 800 MHz 20 ns 78-VFBGA (10.5x8)	BGA	W631GU8MB12S	3D model available Symbol and footprint available 3	1 Download Model
	W9864G6KH-5 Winbond	1	64Mb SDRAM 200MHz TSOPII54	Small Outline Packages	W9864G6KH-5	3D model available Symbol and footprint available 3	1 Download Model
	W634GU6QB11I Winbond	1	4Gb DDR3 SDRAM 1866MHz VFBGA96	BGA	W634GU6QB11I	3D model available Symbol and footprint available 3	1 Download Model
	W25M512JWFSM Winbond	1	Serial NOR Flash 104MHz	Small Outline Packages	W25M512JWFSM	3D model available Symbol and footprint available 3	1 Download Model
	W25Q64JVZPIQ Winbond	1	64Mb Serial NOR Flash 133MHz SON8	Small Outline No-lead	W25Q64JVZPIQ	3D model available Symbol and footprint available 3	1 Download Model
	W634GU6RB11I Winbond	1	4Gb DDR3 SDRAM 1866MHz VFBGA96	BGA	W634GU6RB11I	3D model available Symbol and footprint available 3	1 Download Model
	W29N04GVSIAA Winbond	1	• Basic Features– Density: 4Gbit (Single chip solution)– Vcc: 2.7V to 3.6V– Bus width: x8– Operating temperature▪ Industrial: -40°C to 85°C• Single-Level Cell (SLC) technology• Organization– Density: 4G-bit/512M-byte– Page size▪ 2,112 bytes (2048 + 64 bytes)– Block size▪ 64 pages (128K + 4K bytes)• Highest Performance– Read performance (Max.)▪ Random read: 25us▪ Sequential read cycle: 25ns– Write Erase performance▪ Page program time: 250us(typ.)▪ Block erase time: 2ms(t	Small Outline Packages	W29N04GVSIAA	3D model available Symbol and footprint available 3	1 Download Model
	W66BQ6NBUAHS Winbond	1	2Gb Low Power DDR4/4X SDRAM 4267MHz WFBGA200	BGA	W66BQ6NBUAHS	3D model available Symbol and footprint available 3	1 Download Model
	W634GU8QB-09 Winbond	1	4Gb DDR3 SDRAM 2133MHz VFBGA78	BGA	W634GU8QB-09	3D model available Symbol and footprint available 3	1 Download Model
	W631GU8MB15A Winbond	1	SDRAM - DDR3L Memory IC 1Gbit Parallel 800 MHz 20 ns 78-VFBGA (10.5x8)	BGA	W631GU8MB15A	3D model available Symbol and footprint available 3	1 Download Model
	W9751G6NB18W Winbond	1	DDR2 SDRAM 1066MHz	BGA	W9751G6NB18W	3D model available Symbol and footprint available 3	1 Download Model
	W94AD6KBHA6A Winbond	1	1Gb Low Power DDR SDRAM 333MHz VFBGA60	BGA	W94AD6KBHA6A	3D model available Symbol and footprint available 3	1 Download Model
	W66BP6NBUAHS Winbond	1	2Gb Low Power DDR4/4X SDRAM 4267MHz WFBGA200	BGA	W66BP6NBUAHS	3D model available Symbol and footprint available 3	1 Download Model
	W631GG6MB12K Winbond	1	Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received wit	BGA	W631GG6MB12K	3D model available Symbol and footprint available 3	1 Download Model
	W634GG8NB11K Winbond	1	4Gb DDR3 SDRAM 1866MHz VFBGA78	BGA	W634GG8NB11K	3D model available Symbol and footprint available 3	1 Download Model
	W632GG8MB09W Winbond	1	SDRAM - DDR3 Memory IC 2Gbit Parallel 800 MHz 20 ns 78-VFBGA (10.5x8)	BGA	W632GG8MB09W	3D model available Symbol and footprint available 3	1 Download Model
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