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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	W631GG8MB15S Winbond	1	SDRAM - DDR3 Memory IC 1Gbit Parallel 800 MHz 20 ns 78-VFBGA (10.5x8)	BGA	W631GG8MB15S	3D model available Symbol and footprint available 3	1 Download Model
	W25Q16JWSNIQ Winbond	1	 New Family of SpiFlash Memories– W25Q16JW: 16M-bit / 2M-byte– Standard SPI: CLK, /CS, DI, DO– Dual SPI: CLK, /CS, IO0, IO1,– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Quad I/O SPI clocks– 66MB/S continuous data transfer rate– Min. 100K Program-Erase cycles– More than 20-year data retention Low Power, Wide Temperature Range– Single 1.65V to 1.95V supply– <0.1µA Power-down (typ.)– -40°C to +85°C operating range	Small Outline Packages	W25Q16JWSNIQ	3D model available Symbol and footprint available 3	1 Download Model
	W631GG6NB11I Winbond	1	The W631GG6NB is a 1G bits DDR3 SDRAM and speed involving -09, 09I, 09J, -11, 11I, 11J, -12, 12I, 12J, -15, 15I and 15J	BGA	W631GG6NB11I	3D model available Symbol and footprint available 3	1 Download Model
	W9751G8NB18W Winbond	1	 Power Supply: VDD, VDDQ = 1.8 V ± 0.1V Double Data Rate architecture: two data transfers per clock cycle CAS Latency: 3, 4, 5, 6 and 7 Burst Length: 4 and 8 Bi-directional, differential data strobes (DQS andDQS) are transmitted / received with data Edge-aligned with Read data and center-aligned with Write data DLL aligns DQ and DQS transitions with clock Differential clock inputs (CLK andCLK) Data masks (DM) for write data Commands entered on each positive CLK edge, data	BGA	W9751G8NB18W	3D model available Symbol and footprint available 3	1 Download Model
	W97AH6NBVA2K Winbond	1	VFBGA134	BGA	W97AH6NBVA2K	3D model available Symbol and footprint available 3	1 Download Model
	W634GG6NB11A Winbond	1	 Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received w	BGA	W634GG6NB11A	3D model available Symbol and footprint available 3	1 Download Model
	W25N01JWZEJG Winbond	1	1Gb QspiNAND Flash 166MHz SON8	Small Outline No-lead	W25N01JWZEJG	3D model available Symbol and footprint available 3	1 Download Model
	W632GG8NB12J Winbond	1	DDR3 SDRAM 1600MHz	BGA	W632GG8NB12J	3D model available Symbol and footprint available 3	1 Download Model
	W9825G6KB-6J Winbond	1	256Mb SDRAM 166MHz TFBGA 54 5 mA -40°C ~ 105°C	BGA	W9825G6KB-6J	3D model available Symbol and footprint available 3	1 Download Model
	W25Q16JVSSSM Winbond	1	New Family of SpiFlash Memories– W25Q16JV: 16M-bit / 2M-byte (2,097,152)– Standard SPI: CLK, /CS, DI, DO– Dual SPI: CLK, /CS, IO0, IO1– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Single, Dual/Quad SPI clocks– 266/532MHz equivalent Dual/Quad SPI– 66MB/S continuous data transfer rate– Min. 100K Program-Erase cycles per sector– More than 20-year data retention Efficient “Continuous Read”– Continuous Read with 8/16/32	Small Outline Packages	W25Q16JVSSSM	3D model available Symbol and footprint available 3	1 Download Model
	W9751G6KB25W Winbond	1	512Mb DDR2 SDRAM 800MHz WBGA84	BGA	W9751G6KB25W	3D model available Symbol and footprint available 3	1 Download Model
	W9751G8NB-3J Winbond	1	 Power Supply: VDD, VDDQ = 1.8 V ± 0.1V Double Data Rate architecture: two data transfers per clock cycle CAS Latency: 3, 4, 5, 6 and 7 Burst Length: 4 and 8 Bi-directional, differential data strobes (DQS andDQS) are transmitted / received with data Edge-aligned with Read data and center-aligned with Write data DLL aligns DQ and DQS transitions with clock Differential clock inputs (CLK andCLK) Data masks (DM) for write data Commands entered on each positive CLK edge, data	BGA	W9751G8NB-3J	3D model available Symbol and footprint available 3	1 Download Model
	W25Q16JWSNIM Winbond	1	New Family of SpiFlash Memories– W25Q16JW: 16M-bit / 2M-byte (2,097,152)– Standard SPI: CLK, /CS, DI, DO, /WP, /Hold– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– QPI: CLK, /CS, IO0, IO1, IO2, IO3– SPI/QPI DTR(Double Transfer Rate) Read– Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Quad I/O SPI clocks– 208/416MHz equivalent Dual/Quad SPI– 66MB/S continuous data transfer rate– Min. 100K Program-Erase cycles– More than 20	Small Outline Packages	W25Q16JWSNIM	3D model available Symbol and footprint available 3	1 Download Model
	W66BQ6NBUAFK Winbond	1	2Gb Low Power DDR4/4X SDRAM 3200MHz WFBGA200	BGA	W66BQ6NBUAFK	3D model available Symbol and footprint available 3	1 Download Model
	W632GG6MB09K Winbond	1	2Gb DDR3 SDRAM 2133MHz VFBGA96	BGA	W632GG6MB09K	3D model available Symbol and footprint available 3	1 Download Model
	W25N01KVZPJE Winbond	1	New W25N Family of QspiNANDMemories– W25N01KV: 1G-bit / 128M-Byte– Standard SPI: CLK, /CS, DI, DO, /WP,/Hold– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– Compatible SPI serial flash commands Highest Performance Serial NAND Flash– 104MHz Standard/Dual/Quad SPI clocks– 208/416MHz equivalent Dual/Quad SPI– Fast Program/Erase performance– 100,000 erase/program cycles(3)– 10-year data retention Low Power, Wide Temperature Range– Single 2.7 to	Small Outline No-lead	W25N01KVZPJE	3D model available Symbol and footprint available 3	1 Download Model
	W25Q01NWZEIN Winbond	1	Serial NOR Flash 133MHz	Small Outline No-lead	W25Q01NWZEIN	3D model available Symbol and footprint available 3	1 Download Model
	W25Q32JWSSIM Winbond	1	32Mb Serial NOR Flash 133MHz SOP8	Small Outline Packages	W25Q32JWSSIM	3D model available Symbol and footprint available 3	1 Download Model
	W634GU8NB12J Winbond	1	VFBGA - 78-	BGA	W634GU8NB12J	3D model available Symbol and footprint available 3	1 Download Model
	W631GU8RB12S Winbond	1	1Gb DDR3 SDRAM 1600MHz VFBGA96	BGA	W631GU8RB12S	3D model available Symbol and footprint available 3	1 Download Model
	W632GU6NB12W Winbond	1	2Gb DDR3 SDRAM 1600MHz VFBGA96	BGA	W632GU6NB12W	3D model available Symbol and footprint available 3	1 Download Model
	W632GG8MB15K Winbond	1	DDR3 SDRAM 1333MHz Memory IC 2Gbit Parallel 800 MHz 20 ns 78-VFBGA (10.5x8)	BGA	W632GG8MB15K	3D model available Symbol and footprint available 3	1 Download Model
	W9812G6KB-6I Winbond	1	TFBGA 54	BGA	W9812G6KB-6I	3D model available Symbol and footprint available 3	1 Download Model
	W25M512JVCAM Winbond	1	Serial NOR Flash 104MHz	BGA	W25M512JVCAM	3D model available Symbol and footprint available 3	1 Download Model
	W634GU6NB15J Winbond	1	DDR3 SDRAM 1333MHz	BGA	W634GU6NB15J	3D model available Symbol and footprint available 3	1 Download Model
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