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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	W631GU8NB-15 Winbond	1	The W631GU8NB is a 1G bits DDR3L SDRAM and speed involving -09, 09I, 09J, -11, 11I, 11J, -12, 12I, 12J, -15, 15I and 15J	BGA	W631GU8NB-15	3D model available Symbol and footprint available 3	1 Download Model
	W66AQ6NBHAHS Winbond	1	VFBGA100	BGA	W66AQ6NBHAHS	3D model available Symbol and footprint available 3	1 Download Model
	W25M512JVBAQ Winbond	1	512Mb Serial NOR Flash 104MHz TFBGA (5X5)24	BGA	W25M512JVBAQ	3D model available Symbol and footprint available 3	1 Download Model
	W25Q12PWSSIM Winbond	1	New Family of SpiFlash Memories– W25Q12PW: 128M-bit / 16M-byte– Standard SPI: CLK, /CS, DI, DO, /WP, /Hold– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– QPI: CLK, /CS, IO0, IO1, IO2, IO3– SPI/QPI DTR(Double Transfer Rate) Read– On-chip ECC(1-Bit correction every 16-Byte)(1) Highest Performance Serial Flash–166MHz Quad I/O clocks– 83MB/S continuous data transfer rate– Min. 100K Program-Erase cycles(2)– More than 20-year data retention Efficie	Small Outline Packages	W25Q12PWSSIM	3D model available Symbol and footprint available 3	1 Download Model
	W25Q01NWZEIM Winbond	1	 New Family of SpiFlash Memories– W25Q01NW: two 1G-bit / 128M-byte– Standard SPI: CLK, /CS, DI, DO, /WP, /Hold– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– SPI/QPI DTR (Double Transfer Rate) Read– 3 or 4-Byte Addressing Mode– Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Standard/Dual/Quad SPI clocks– 266/532MHz equivalent Dual/Quad SPI– 66MB/S continuous data transfer rate– Min. 100K Program-Erase cycles– More than 20	Small Outline No-lead	W25Q01NWZEIM	3D model available Symbol and footprint available 3	1 Download Model
	W631GG6MB15S Winbond	1	 Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received w	BGA	W631GG6MB15S	3D model available Symbol and footprint available 3	1 Download Model
	W634GU6NB12I Winbond	1	4Gb DDR3 SDRAM 1600MHz VFBGA96	BGA	W634GU6NB12I	3D model available Symbol and footprint available 3	1 Download Model
	W638GU6QB-09 Winbond	1	Data masks (DM) for write data⚫ Programmable CAS Write Latency (CWL) per operating frequency⚫ Write Latency WL = AL + CWL⚫ Multi purpose register (MPR) for readout a predefined system timing calibration bit sequence⚫ System level timing calibration support via write leveling and MPR read pattern⚫ ZQ Calibration for output driver and ODT using external reference resistor to ground⚫ Asynchronous RESET# pin for Power-up initialization sequence and reset function⚫ Programmable on-die termination (	BGA	W638GU6QB-09	3D model available Symbol and footprint available 3	1 Download Model
	W632GU8MB09K Winbond	1	VFBGA - 78	BGA	W632GU8MB09K	3D model available Symbol and footprint available 3	1 Download Model
	W25Q512NWFIN Winbond	1	 New Family of SpiFlash Memories– W25Q512NW: 512M-bit / 64M-byte– Standard SPI: CLK, /CS, DI, DO– Dual SPI: CLK, /CS, IO0, IO1,– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– 3 or 4-Byte Addressing Mode– Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Standard/Dual/Quad SPI clocks– 266/532MHz equivalent Dual/Quad SPI– 66MB/S continuous data transfer rate– Min. 100K Program-Erase cycles– More than 20-year data retention Efficient Read– Allows true XIP (execute i	Small Outline Packages	W25Q512NWFIN	3D model available Symbol and footprint available 3	1 Download Model
	W25N02KVZEIR Winbond	1	NAND Flash 2G-bit Serial NAND flash, 3V	Small Outline No-lead	W25N02KVZEIR	3D model available Symbol and footprint available 3	1 Download Model
	W25Q32JWUUSQ Winbond	1	1.8V 32M-BIT SERIAL FLASH MEMORY WITH DUAL, QUAD SPI	Other	W25Q32JWUUSQ	3D model available Symbol and footprint available 3	1 Download Model
	W631GU8MB09A Winbond	1	 Power Supply: 1.35V (typ.), VDD, VDDQ = 1.283V to 1.45V Backward compatible to VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, d	BGA	W631GU8MB09A	3D model available Symbol and footprint available 3	1 Download Model
	W632GU6RB09J Winbond	1	2Gb DDR3 SDRAM 2133MHz VFBGA96	BGA	W632GU6RB09J	3D model available Symbol and footprint available 3	1 Download Model
	W634GU6RB-12 Winbond	1	4Gb DDR3 SDRAM 1600MHz VFBGA96	BGA	W634GU6RB-12	3D model available Symbol and footprint available 3	1 Download Model
	W634GU6RB12A Winbond	1	DDR3 SDRAM 1600MHz	BGA	W634GU6RB12A	3D model available Symbol and footprint available 3	1 Download Model
	W9751G8NB25K Winbond	1	512Mb DDR2 SDRAM 800MHz VFBGA60	BGA	W9751G8NB25K	3D model available Symbol and footprint available 3	1 Download Model
	W25Q80RVXHJQ Winbond	1	 New Family of SpiFlash Memories– W25Q80RV: 8M-bit / 1M-byte (1,048,576)– Standard SPI: CLK, /CS, DI, DO, /WP, /Hold– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3 – Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Single, Dual/Quad SPI clocks– 266/532MHz equivalent Dual/Quad SPI– 66MB/S continuous data transfer rate– Min. 100K Program-Erase cycles– More than 20-year data retention Efficient “Continuous Read”– Continuous Re	Small Outline No-lead	W25Q80RVXHJQ	3D model available Symbol and footprint available 3	1 Download Model
	W631GG6NB12S Winbond	1	⚫ Power Supply: VDD, VDDQ = 1.5V ± 0.075V⚫ Double Data Rate architecture: two data transfers per clock cycle⚫ Eight internal banks for concurrent operation⚫ 8 bit prefetch architecture⚫ CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14⚫ Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF)⚫ Programmable read burst ordering: interleaved or nibble sequential⚫ Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received w	BGA	W631GG6NB12S	3D model available Symbol and footprint available 3	1 Download Model
	W631GU6RB12A Winbond	1	1Gb DDR3 SDRAM 1600MHz VFBGA96	BGA	W631GU6RB12A	3D model available Symbol and footprint available 3	1 Download Model
	W25N01GVTBAT Winbond	1	 New W25N Family of SpiFlash Memories– W25N01GV: 1G-bit / 128M-byte– Standard SPI: CLK, /CS, DI, DO, /WP, /Hold– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– Compatible SPI serial flash commands Highest Performance Serial NAND Flash– 104MHz Standard/Dual/Quad SPI clocks– 208/416MHz equivalent Dual/Quad SPI– 50MB/S continuous data transfer rate– Fast Program/Erase performance– 100,000 erase/program cycles(4)– 10-year data retention Efficient “	BGA	W25N01GVTBAT	3D model available Symbol and footprint available 3	1 Download Model
	W25Q32JWZPAM Winbond	1	32Mb Serial NOR Flash 104MHz SON8	Small Outline No-lead	W25Q32JWZPAM	3D model available Symbol and footprint available 3	1 Download Model
	W631GU6RB09I Winbond	1	1Gb DDR3 SDRAM 2133MHz VFBGA96	BGA	W631GU6RB09I	3D model available Symbol and footprint available 3	1 Download Model
	W632GU6QB09I Winbond	1	2Gb DDR3 SDRAM 2133MHz VFBGA96	BGA	W632GU6QB09I	3D model available Symbol and footprint available 3	1 Download Model
	W632GU8RB09J Winbond	1	2Gb DDR3 SDRAM 2133MHz VFBGA78	BGA	W632GU8RB09J	3D model available Symbol and footprint available 3	1 Download Model
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