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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	W25N512GVPIT Winbond	1	512Mb Serial NAND Flash Memory with uniform 2KB+64B page size and set Buffer Read Mode as default	Small Outline No-lead	W25N512GVPIT	3D model available Symbol and footprint available 3	1 Download Model
	W972GG6KB-3 Winbond	1	WFBGA84	BGA	W972GG6KB-3	3D model available Symbol and footprint available 3	1 Download Model
	W29N02KVSIAE Winbond	1	 Basic Features– Density: 2Gbit (Single chip solution)– Vcc: 2.7V to 3.6V– Bus width: x8– Operating temperature Industrial: -40°C to 85°C Industrial Plus: -40°C to 105°C Single-Level Cell (SLC) technology. Organization– Density: 2G-bit/256M-byte– Page size 2,176 bytes– Block size 64 pages Highest Performance– Read performance (Max.) Random read: 25us Sequential read cycle: 25ns– Write Erase performance Page program time: 250us (typ.) Block erase time: 2ms	Small Outline Packages	W29N02KVSIAE	3D model available Symbol and footprint available 3	1 Download Model
	W63AH6NBVABE Winbond	1	This is a 1Gb Low Power DDR3 SDRAM organized as 8M words x 8 banks x 16bits	BGA	W63AH6NBVABE	3D model available Symbol and footprint available 3	1 Download Model
	W25N01JWTBIT Winbond	1	 New W25N Family of SpiFlash Memories– W25N01JW: 1G-bit / 128M-Byte– Standard SPI: CLK, /CS, DI, DO, /WP, /Hold,– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– Compatible SPI Serial Flash commands Highest Performance Serial NAND Flash– 166MHz Standard/Dual/Quad SPI clocks– 332/664MHz equivalent Dual/Quad SPI– DTR (Dual Transfer Rate) up to 80MHz– 80MB/s continuous data transfer rate– Fast Program/Erase performance– More than 100,000 erase/program	BGA	W25N01JWTBIT	3D model available Symbol and footprint available 3	1 Download Model
	W25Q64JWZEIQ Winbond	1	64Mb Serial NOR Flash 133MHz SON8	Small Outline No-lead	W25Q64JWZEIQ	3D model available Symbol and footprint available 3	1 Download Model
	W9751G8NB-3K Winbond	1	 Power Supply: VDD, VDDQ = 1.8 V ± 0.1V Double Data Rate architecture: two data transfers per clock cycle CAS Latency: 3, 4, 5, 6 and 7 Burst Length: 4 and 8 Bi-directional, differential data strobes (DQS andDQS) are transmitted / received with data Edge-aligned with Read data and center-aligned with Write data DLL aligns DQ and DQS transitions with clock Differential clock inputs (CLK andCLK) Data masks (DM) for write data Commands entered on each positive CLK edge, data	BGA	W9751G8NB-3K	3D model available Symbol and footprint available 3	1 Download Model
	W632GU8RB09A Winbond	1	2Gb DDR3 SDRAM 2133MHz VFBGA96	BGA	W632GU8RB09A	3D model available Symbol and footprint available 3	1 Download Model
	W25Q01NWZEJM Winbond	1	 New Family of SpiFlash Memories– W25Q01NW: two 512M-bit / 128M-byte– Standard SPI: CLK, /CS, DI, DO– Dual SPI: CLK, /CS, IO0, IO1,– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– 3 or 4-Byte Addressing Mode– Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Standard/Dual/Quad SPI clocks– 266/532MHz equivalent Dual/Quad SPI– 66MB/S continuous data transfer rate– Min. 100K Program-Erase cycles– More than 20-year data retention Efficient “Continuous Read”– Quad Peri	Small Outline No-lead	W25Q01NWZEJM	3D model available Symbol and footprint available 3	1 Download Model
	W634GU8RB12J Winbond	1	DDR3 SDRAM 1600MHz	BGA	W634GU8RB12J	3D model available Symbol and footprint available 3	1 Download Model
	W29N08GVSAAF Winbond	1	8Gb SLC NAND Flash MHz TSOPI48	Small Outline Packages	W29N08GVSAAF	3D model available Symbol and footprint available 3	1 Download Model
	W25N512GVEAG Winbond	1	512Mb QspiNAND Flash 166MHz SON8	Small Outline No-lead	W25N512GVEAG	3D model available Symbol and footprint available 3	1 Download Model
	W634GU8NB15W Winbond	1	DDR3 SDRAM 1333MHz	BGA	W634GU8NB15W	3D model available Symbol and footprint available 3	1 Download Model
	W632GU6NB15W Winbond	1	2Gb DDR3 SDRAM 1333MHz VFBGA96	BGA	W632GU6NB15W	3D model available Symbol and footprint available 3	1 Download Model
	W66AQ6NBHAHA Winbond	1	BGA100	BGA	W66AQ6NBHAHA	3D model available Symbol and footprint available 3	1 Download Model
	W29N01HVBINA Winbond	1	1Gb SLC NAND Flash MHz VFBGA63	BGA	W29N01HVBINA	3D model available Symbol and footprint available 3	1 Download Model
	W25Q80DVSNIG Winbond	1	Family of SpiFlash Memories– W25Q80DV: 8M-bit/1M-byte (1,048,576)– 256-byte per programmable page– Standard SPI: CLK,/CS,DI,DO,/WP,/Hold– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– Uniform 4KB Sectors, 32KB & 64KB Blocks• Highest Performance Serial Flash– 104MHz Dual/Quad SPI clocks– 208/416MHz equivalent Dual/Quad SPI– 50MB/S continuous data transfer rate• Software and Hardware Write Protection– Write-Protect all or portion of memory– Enable/	Small Outline Packages	W25Q80DVSNIG	3D model available Symbol and footprint available 3	1 Download Model
	W25Q64JVZESQ Winbond	1	 New Family of SpiFlash Memories– W25Q64JV: 64M-bit / 8M-byte– Standard SPI: CLK, /CS, DI, DO– Dual SPI: CLK, /CS, IO0, IO1– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Single, Dual/Quad SPI clocks– 266/532MHz equivalent Dual/Quad SPI– Min. 100K Program-Erase cycles per sector– More than 20-year data retention Low Power, Wide Temperature Range– Single 2.7 to 3.6V supply– <1µA Power-down (typ.)– -40°C to +85°C op	Small Outline No-lead	W25Q64JVZESQ	3D model available Symbol and footprint available 3	1 Download Model
	W634GG8NB11J Winbond	1	DDR3 SDRAM 1866MHz	BGA	W634GG8NB11J	3D model available Symbol and footprint available 3	1 Download Model
	W968D6DAGX7I Winbond	1	This is a 256M bit CellularRAM™ compliant products, organized as 16M word by 16 bite; high-speed, CMOS pseudo-static random access memories developed for low-power, portable applications.	BGA	W968D6DAGX7I	3D model available Symbol and footprint available 3	1 Download Model
	W948V6KBHX6E Winbond	1	256Mb Low Power DDR SDRAM 333MHz VFBGA60	BGA	W948V6KBHX6E	3D model available Symbol and footprint available 3	1 Download Model
	W634GG8NB11I Winbond	1	4Gb DDR3 SDRAM 1866MHz VFBGA78	BGA	W634GG8NB11I	3D model available Symbol and footprint available 3	1 Download Model
	W631GG6MB09W Winbond	1	 Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received w	BGA	W631GG6MB09W	3D model available Symbol and footprint available 3	1 Download Model
	W632GG6MB11K Winbond	1	 Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received w	BGA	W632GG6MB11K	3D model available Symbol and footprint available 3	1 Download Model
	W631GG8MB09W Winbond	1	 Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received w	BGA	W631GG8MB09W	3D model available Symbol and footprint available 3	1 Download Model
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