Showing 25 of 10385 results
| Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action |
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| Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action |
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W25N01KVZPIR
Winbond
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1 | 1Gb QspiNAND Flash 104MHz SON8 | Small Outline No-lead | W25N01KVZPIR |
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W25M512JWCAM
Winbond
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1 | New Family of SpiFlash® Memories– W25M512JW-IQ: 2 x 256M-bit (2 x 32MByte)– Standard SPI: CLK, /CS, DI, DO– Dual SPI: CLK, /CS, IO0, IO1– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– 3 or 4-Byte Addressing Mode– Software Die Select (C2h)– Software & Hardware Reset(1) High Performance Serial Flash– 104MHz Standard/Dual/Quad SPI clocks– 208/416MHz equivalent Dual/Quad SPI– 52MB/s continuous data transfer rate– More than 100,000 Program/Erase cycles– More than 20-year data retention | BGA | W25M512JWCAM |
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W25Q64JVSSAQ
Winbond
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1 | New Family of SpiFlash Memories– W25Q64JV: 64M-bit / 8M-byte– Standard SPI: CLK, /CS, DI, DO– Dual SPI: CLK, /CS, IO0, IO1– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Single, Dual/Quad SPI clocks– 266/532MHz equivalent Dual/Quad SPI– Min. 100K Program-Erase cycles per sector– More than 20-year data retention Low Power, Wide Temperature Range– Single 2.7 to 3.6V supply– <1µA Power-down (typ.)– -40°C to +85°C op | Small Outline Packages | W25Q64JVSSAQ |
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W9725G6KB-3W
Winbond
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1 | SDRAM - DDR2 Memory IC 256Mbit Parallel 400 MHz 57.5 ns 84-WBGA (8x12.5) | BGA | W9725G6KB-3W |
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W631GU6NB12S
Winbond
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1 | 1Gb DDR3 SDRAM 1600MHz VFBGA96 | BGA | W631GU6NB12S |
3
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W25Q64JWTBIQ
Winbond
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1 | 64Mb Serial NOR Flash 133MHz TFBGA (5X5)24 | BGA | W25Q64JWTBIQ |
3
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W97AH2KBVX2I
Winbond
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1 | VFBGA134 | BGA | W97AH2KBVX2I |
3
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W25Q64JVZPAQ
Winbond
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1 | 64Mb Serial NOR Flash 133MHz SON8 | Small Outline No-lead | W25Q64JVZPAQ |
3
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W631GU6NB11I
Winbond
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1 | The W631GU6NB is a 1G bits DDR3L SDRAM and speed involving -09, 09I, 09J, -11, 11I, 11J, -12, 12I, 12J, -15, 15I and 15J | BGA | W631GU6NB11I |
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W631GG6MB11A
Winbond
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1 | Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received wit | BGA | W631GG6MB11A |
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W25N02KWZEJR
Winbond
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1 | 2Gb QspiNAND Flash 104MHz SON8 | Small Outline No-lead | W25N02KWZEJR |
3
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W29N01HZDJNA
Winbond
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1 | FLASH - NAND (SLC) Memory IC 1Gbit ONFI 22 ns 48-VFBGA (8x6.5) | BGA | W29N01HZDJNA |
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W634GG6NB-15
Winbond
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1 | DRAM 4Gb DDR3 SDRAM, x16, 800MHz | BGA | W634GG6NB-15 |
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W25X40CLSSIG
Winbond
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1 | 4Mb Serial NOR Flash 104MHz SOP8 | Small Outline Packages | W25X40CLSSIG |
3
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W29N04GZSIBA
Winbond
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1 | 4Gb SLC NAND Flash MHz TSOPI48 | Small Outline Packages | W29N04GZSIBA |
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W631GG8MB12S
Winbond
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1 | Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received w | BGA | W631GG8MB12S |
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W9725G6KB-3I
Winbond
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1 | 256Mb DDR2 SDRAM 667MHz WBGA84 | BGA | W9725G6KB-3I |
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W29N01HVSINA
Winbond
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1 | 1Gb SLC NAND Flash MHz TSOPI48 | Small Outline Packages | W29N01HVSINA |
3
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W971GG6NB-25
Winbond
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1 | 1Gb DDR2 SDRAM 800MHz VFBGA84 | BGA | W971GG6NB-25 |
3
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W9751G6KB25A
Winbond
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1 | 512Mb DDR2 SDRAM 800MHz WBGA84 | BGA | W9751G6KB25A |
3
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W25Q64JVSFSQ
Winbond
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1 | 64Mb Serial NOR Flash 133MHz SOP16 | Small Outline Packages | W25Q64JVSFSQ |
3
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W9725G6KB18W
Winbond
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1 | DDR2 SDRAM 1066MHz | BGA | W9725G6KB18W |
3
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W632GG8NB12I
Winbond
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1 | 2Gb DDR3 SDRAM 1600MHz VFBGA78 | BGA | W632GG8NB12I |
3
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W25Q80RVSSJQ
Winbond
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1 | New Family of SpiFlash Memories– W25Q80RV: 8M-bit / 1M-byte (1,048,576)– Standard SPI: CLK, /CS, DI, DO, /WP, /Hold– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3 – Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Single, Dual/Quad SPI clocks– 266/532MHz equivalent Dual/Quad SPI– 66MB/S continuous data transfer rate– Min. 100K Program-Erase cycles– More than 20-year data retention Efficient “Continuous Read”– Continuous Re | Small Outline Packages | W25Q80RVSSJQ |
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W25N02KVTBJU
Winbond
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1 | New W25N Family of QspiNANDMemories– W25N02KV: 2G-bit / 256M-Byte– Standard SPI: CLK, /CS, DI, DO, /WP,/Hold– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– Compatible SPI serial flash commands Highest Performance Serial NAND Flash– 104MHz Standard/Dual/Quad SPI clocks– 208/416MHz equivalent Dual/Quad SPI– 50MB/S sequential data transfer rate– Fast Program/Erase performance– 60,000 erase/program cycles– 10-year data retention Low Power, Wi | BGA | W25N02KVTBJU |
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