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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	W989D2DBJX6I Winbond	1	512Mb Low Power SDR SDRAM 166MHz VFBGA90 1.8V/1.8V	BGA	W989D2DBJX6I	3D model available Symbol and footprint available 3	1 Download Model
	W25N512GWEIT Winbond	1	512Mb QspiNAND Flash 104MHz SON8	Small Outline No-lead	W25N512GWEIT	3D model available Symbol and footprint available 3	1 Download Model
	W632GG8NB11A Winbond	1	2Gb DDR3 SDRAM 1866MHz VFBGA78	BGA	W632GG8NB11A	3D model available Symbol and footprint available 3	1 Download Model
	W29N01HZDANA Winbond	1	1Gb SLC NAND Flash MHz VFBGA48	BGA	W29N01HZDANA	3D model available Symbol and footprint available 3	1 Download Model
	W634GG8NB-15 Winbond	1	packagebga78	BGA	W634GG8NB-15	3D model available Symbol and footprint available 3	1 Download Model
	W9816G6JH-5 Winbond	1	2.7V~3.6V power supply Up to 200 MHz Clock Frequency 524,288 words x 2 banks x 16 bits organization Self Refresh current: standard and low power CAS Latency: 2 and 3 Burst Length: 1, 2, 4, 8 and Full Page Burst Read, Single Writes Mode Byte Data Controlled by LDQM, UDQM Auto-precharge and Controlled Precharge 2K Refresh Cycles/32 mS Interface: LVTTL Packaged in 50-pin, 400 mil TSOP II, using Lead free materials with RoHS compliant	Small Outline Packages	W9816G6JH-5	3D model available Symbol and footprint available 3	1 Download Model
	W66AP6NBHAHI Winbond	1	BGA100	BGA	W66AP6NBHAHI	3D model available Symbol and footprint available 3	1 Download Model
	W25Q32JWUUJQ Winbond	1	32Mb Serial NOR Flash 133MHz SON8	Other	W25Q32JWUUJQ	3D model available Symbol and footprint available 3	1 Download Model
	W632GU8MB11A Winbond	1	BGA78	BGA	W632GU8MB11A	3D model available Symbol and footprint available 3	1 Download Model
	W632GG6NB09S Winbond	1	2Gb DDR3 SDRAM 2133MHz VFBGA96	BGA	W632GG6NB09S	3D model available Symbol and footprint available 3	1 Download Model
	W25Q512JVBJQ Winbond	1	512Mb Serial NOR Flash 133MHz TFBGA (5X5)24	BGA	W25Q512JVBJQ	3D model available Symbol and footprint available 3	1 Download Model
	W25Q16RVSNJM Winbond	1	 New Family of SpiFlash Memories– W25Q16RV: 16M-bit/ 2M-byte (2,097,152)– Standard SPI: CLK, /CS, DI, DO, /WP, /Hold– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– SPI/QPI DTR(Double Transfer Rate) Read– Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Single, Dual/Quad SPI clocks– 266/532MHz equivalent Dual/Quad SPI– 66MB/S continuous data transfer rate– Min. 100K Program-Erase cycles– More than 20-year data retention Eff	Small Outline Packages	W25Q16RVSNJM	3D model available Symbol and footprint available 3	1 Download Model
	W956D8MBYA5A Winbond	1	64Mb HYPERRAM 400MHz TFBGA (5X5)24	BGA	W956D8MBYA5A	3D model available Symbol and footprint available 3	1 Download Model
	W25Q128JVBIQ Winbond	1	128M-bit Serial Flash Memory with uniform 4KB sectors and Dual/Quad SPI	BGA	W25Q128JVBIQ	3D model available Symbol and footprint available 3	1 Download Model
	W25Q32JVSNIQ Winbond	1	FLASH - NOR Memory IC 32Mbit SPI - Quad I/O 133 MHz 6 ns 8-SOIC	Small Outline Packages	W25Q32JVSNIQ	3D model available Symbol and footprint available 3	1 Download Model
	W631GG6NB11J Winbond	1	The W631GG6NB is a 1G bits DDR3 SDRAM and speed involving -09, 09I, 09J, -11, 11I, 11J, -12, 12I, 12J, -15, 15I and 15J	BGA	W631GG6NB11J	3D model available Symbol and footprint available 3	1 Download Model
	W97BH2MBVA1W Winbond	1	2Gb Low Power DDR2 SDRAM 1066MHz VFBGA134	BGA	W97BH2MBVA1W	3D model available Symbol and footprint available 3	1 Download Model
	W9725G6KB-3A Winbond	1	DDR2 SDRAM 667MHz	BGA	W9725G6KB-3A	3D model available Symbol and footprint available 3	1 Download Model
	W66AQ6NBHAHI Winbond	1	PACKAGE-BGA100	BGA	W66AQ6NBHAHI	3D model available Symbol and footprint available 3	1 Download Model
	W25M512JWBIQ Winbond	1	512Mb SpiStack Flash 104MHz TFBGA (5X5)24	BGA	W25M512JWBIQ	3D model available Symbol and footprint available 3	1 Download Model
	W632GG8NB09S Winbond	1	2Gb DDR3 SDRAM 2133MHz VFBGA78	BGA	W632GG8NB09S	3D model available Symbol and footprint available 3	1 Download Model
	W631GG8NB11K Winbond	1	Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received wit	BGA	W631GG8NB11K	3D model available Symbol and footprint available 3	1 Download Model
	W29N04GVSJAF Winbond	1	4Gb SLC NAND Flash MHz TSOPI48	Small Outline Packages	W29N04GVSJAF	3D model available Symbol and footprint available 3	1 Download Model
	W25Q64JVSSIQ Winbond	1	64Mb Serial NOR Flash 133MHz SOP8	Small Outline Packages	W25Q64JVSSIQ	3D model available Symbol and footprint available 3	1 Download Model
	W25Q32JVTCAQ Winbond	1	 New Family of SpiFlash Memories– W25Q32JV: 32M-bit / 4M-byte– Standard SPI: CLK, /CS, DI, DO– Dual SPI: CLK, /CS, IO0, IO1,– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Single, Dual/Quad SPI clocks– 266/532MHz equivalent Dual/Quad SPI– 66MB/S continuous data transfer rate– Min. 100K Program-Erase cycles per sector– More than 20-year data retention Efficient “Continuous Read”– Continuous Read with 8/16/32/64-Byte	BGA	W25Q32JVTCAQ	3D model available Symbol and footprint available 3	1 Download Model
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