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SN75LVDS387DGGR - Texas Instruments

Description: LVDS Interface IC 16-Channel LVDS Transmitter

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SN75LVDS387DGGR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGG (R-PDSO-G**)
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SN75LVDS387DGGR - Texas Instruments  - 3D model - Small Outline Packages - DGG (R-PDSO-G**)
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SN75LVDS387DGGR Details

  • Manufacturer Part Number:

    SN75LVDS387DGGR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-64

  • Pin Count:

    64

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Differential Output:

    YES

  • Driver Number of Bits:

    16

  • High Level Input Current-Max:

    0.00002 A

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LINE DRIVER

  • Interface Standard:

    EIA-644; TIA-644

  • JESD-30 Code:

    R-PDSO-G64

  • JESD-609 Code:

    e4

  • Length:

    17 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    16

  • Number of Terminals:

    64

  • Operating Temperature-Max:

    70 °C

  • Out Swing-Min:

    0.247 V

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP64,.32,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    95 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    2.9 ns

  • Width:

    6.1 mm

SN75LVDS387DGGR Frequently Asked Questions (FAQs)

  • The maximum cable length depends on the specific application and the signal frequency. As a general rule, the maximum cable length for LVDS signals is around 10-15 meters. However, it's recommended to consult the TI application note 'LVDS Owner's Manual' (SLWC073) for more detailed information on cable length and signal integrity.
  • To ensure signal integrity and minimize EMI, it's recommended to follow proper PCB layout and design guidelines, such as using differential pairs, minimizing trace length and impedance mismatch, and using shielding and grounding techniques. Additionally, the use of LVDS signal conditioning and termination resistors can help to improve signal quality and reduce EMI.
  • Yes, the SN75LVDS387DGGR can be used in a multi-point LVDS bus configuration. However, it's recommended to consult the TI application note 'LVDS Owner's Manual' (SLWC073) for more detailed information on multi-point bus configuration and signal loading considerations.
  • The recommended power supply decoupling for the SN75LVDS387DGGR is to use a 0.1 μF ceramic capacitor in parallel with a 10 μF tantalum capacitor, placed as close as possible to the device's power pins. This helps to filter out noise and ensure stable operation.
  • To troubleshoot common issues with the SN75LVDS387DGGR, it's recommended to use oscilloscopes and logic analyzers to monitor the signal quality and data transmission. Additionally, checking the PCB layout and design, power supply decoupling, and signal termination can help to identify and resolve issues. TI also provides a range of application notes and technical documents that can provide guidance on troubleshooting and debugging.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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