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TLV5619CDW - Texas Instruments

Description: 12-Bit, Single Channel DAC, Parallel, Voltage Out, Low Power, Asynchronous Update

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TLV5619CDW - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DW0020A
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TLV5619CDW - Texas Instruments  - 3D model - Small Outline Packages - DW0020A
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TLV5619CDW Details

  • Manufacturer Part Number:

    TLV5619CDW

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    20

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.40

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog Output Voltage-Max:

    2.9 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    PARALLEL, WORD

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e4

  • Length:

    12.8 mm

  • Linearity Error-Max (EL):

    0.0977%

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP20,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    1 MHz

  • Seated Height-Max:

    2.65 mm

  • Settling Time-Max:

    3 µs

  • Settling Time-Nom (tstl):

    1 µs

  • Supply Current-Max:

    3 mA

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

TLV5619CDW Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the TLV5619CDW involves placing the device close to the analog-to-digital converter (ADC) or digital-to-analog converter (DAC) it is driving, and using a ground plane to minimize noise and radiation. Additionally, it is recommended to use a 0.1uF decoupling capacitor between the VCC and GND pins, and to keep the analog and digital grounds separate.
  • To ensure the TLV5619CDW operates within its specified temperature range, it is recommended to provide adequate heat sinking and airflow around the device. The device should be mounted on a PCB with a thermal pad connected to a ground plane, and the ambient temperature should be kept between -40°C and 125°C.
  • The recommended power-up sequence for the TLV5619CDW involves applying the analog power supply (VCC) before the digital power supply (VDD). This ensures that the analog circuitry is powered up before the digital circuitry, which helps to prevent unwanted digital noise from affecting the analog circuitry.
  • During power-down or reset, the TLV5619CDW's digital output may float or go to an undefined state. To handle this, it is recommended to use a pull-down or pull-up resistor on the digital output pin to ensure it is in a defined state, and to use a buffer or latch to hold the output value during power-down or reset.
  • The recommended method for filtering the TLV5619CDW's output involves using a low-pass filter with a cutoff frequency that is significantly lower than the Nyquist frequency of the DAC. A simple RC filter or a more complex active filter can be used, depending on the specific application requirements.

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TLV5619CDW Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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