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TSB12LV01BIPZT - Texas Instruments

Description: High-Speed Serial-Bus Link-Layer Controller 100-Pin TQFP Tray

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TSB12LV01BIPZT - Texas Instruments - PCB symbol
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TSB12LV01BIPZT - Texas Instruments PCB footprint - Quad Flat Packages - Quad Flat Packages - PZT (S-PQFP-G100)
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TSB12LV01BIPZT - Texas Instruments - 3D model - Quad Flat Packages - PZT (S-PQFP-G100)
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TSB12LV01BIPZT Details

  • Manufacturer Part Number:

    TSB12LV01BIPZT

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFP

  • Package Description:

    PLASTIC, TQFP-100

  • Pin Count:

    100

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Additional Feature:

    ALSO REQUIRES 5V SUPPLY

  • Address Bus Width:

    8

  • Boundary Scan:

    NO

  • Clock Frequency-Max:

    49.152 MHz

  • Communication Protocol:

    ASYNC, BIT

  • Data Transfer Rate-Max:

    50 MBps

  • External Data Bus Width:

    32

  • JESD-30 Code:

    S-PQFP-G100

  • JESD-609 Code:

    e4

  • Length:

    14 mm

  • Low Power Mode:

    NO

  • Moisture Sensitivity Level:

    3

  • Number of Serial I/Os:

    1

  • Number of Terminals:

    100

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFQFP

  • Package Equivalence Code:

    QFP100,.63SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    14 mm

  • uPs/uCs/Peripheral ICs Type:

    SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

TSB12LV01BIPZT Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the application note SLVAE04, which includes guidelines for signal routing, power supply decoupling, and thermal management to ensure optimal performance and minimize signal integrity issues.
  • The TSB12LV01BIPZT has a thermal pad that must be connected to a thermal plane on the PCB to dissipate heat. A thermal via array or a thermal pad connected to a heat sink can be used to improve thermal management. Additionally, ensuring good airflow and using thermal interface materials can help reduce thermal resistance.
  • The TSB12LV01BIPZT has an operating temperature range of -40°C to 85°C, but it can be extended to -40°C to 125°C with proper thermal management and derating of the device.
  • To ensure signal integrity, use controlled impedance traces, minimize signal routing lengths, and use signal termination resistors as recommended in the datasheet. Additionally, use a common mode filter or a differential filter to reduce electromagnetic interference (EMI) and improve signal quality.
  • A 0.1 μF ceramic capacitor and a 10 μF electrolytic capacitor in parallel, placed close to the device, are recommended for power supply decoupling. This helps to filter out noise and reduce power supply ripple.

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TSB12LV01BIPZT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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