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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	STM32MP133FAG7 STMicroelectronics	1	Arm® Cortex®-A7 up to 1 GHz, 2×ETH, 2×CAN FD, 2×ADC, 24 timers, audio, crypto and adv. security	BGA	STM32MP133FAG7	3D model available Symbol and footprint available 3	1 Download Model
	R9A08G045S13GBG#BC0 Renesas Electronics	1	The RZ/G3S microprocessor includes a Cortex®-A55 (1.1GHz) CPU, 16-bit LPDDR4 or DDR4 interface and low-power mode. It also has many interfaces such as PCIe, CAN FD, and 12-bit ADC, making it ideal for applications such as IoT edge applications.As a software platform for this product, Renesas provides the Verified Linux package, which includes the Linux Kernel, middleware drivers, and basic software for this product. The Verified Linux package is verified and provided by Renesas.	BGA	R9A08G045S13GBG#BC0	3D model available Symbol and footprint available 3	1 Download Model
	R9A07G075M21GBA#AC0 Renesas Electronics	1	RZ/T2M is an industry-leading high-performance multi-function MPU that realizes high-speed processing, high precision control, and functional safety required for industrial equipment such as AC servos and industrial motors. Powered by dual Arm® Cortex®-R52 cores with a maximum frequency of 800MHz for real-time control and embedded with a large tightly coupled memory (576KB) directly connected to the CPU to realize high-performance real-time processing, RZ/T2M enables low latency access by arranging the peri	BGA	R9A07G075M21GBA#AC0	3D model available Symbol and footprint available 3	1 Download Model
	STM32MP133DAE7 STMicroelectronics	1	Arm® Cortex®-A7 up to 1 GHz, 2×ETH, 2×CAN FD, 2×ADC, 24 timers, audio	BGA	STM32MP133DAE7	3D model available Symbol and footprint available 3	1 Download Model

	R9A07G075M24GBA#AC0 Renesas Electronics	1	RZ/T2M is an industry-leading high-performance multi-function MPU that realizes high-speed processing, high precision control, and functional safety required for industrial equipment such as AC servos and industrial motors. Powered by dual Arm® Cortex®-R52 cores with a maximum frequency of 800MHz for real-time control and embedded with a large tightly coupled memory (576KB) directly connected to the CPU to realize high-performance real-time processing, RZ/T2M enables low latency access by arranging the peri	BGA	R9A07G075M24GBA#AC0	3D model available Symbol and footprint available 3	1 Download Model
	STM32MP255DAJ3 STMicroelectronics	1	Includes ST state-of-the-art patented technology.Cores• Up to 64-bit dual-core Arm® Cortex®-A35– Up to 1.5 GHz– 32-Kbyte I + 32-Kbyte D level 1 cache for each core– 512-Kbyte unified level 2 cache– Arm® NEON™ and Arm® TrustZone®• 32-bit Arm® Cortex®-M33 with FPU/MPU– Up to 400 MHz– L1 16-Kbyte I / 16-Kbyte D– Arm® TrustZone®	BGA	STM32MP255DAJ3	3D model available Symbol and footprint available 3	1 Download Model
	STM32MP251FAK3 STMicroelectronics	1	Arm® based dual Cortex®-A35 1.5 GHz + Cortex®-M33 MPU with AI, 3D GPU, video encoder/decoder, TFT/DSI/LVDS, USB 3.0, PCIe®, crypto	Other	STM32MP251FAK3	3D model available Symbol and footprint available 3	1 Download Model
	R9A07G074M01GBG#AC0 Renesas Electronics	1	RZ/T2L is high-performance MPU that realizes high-speed and high-precision real-time control with EtherCAT. RZ/T2L has Arm® Cortex®-R52 @Max Frequency 800MHz and the large tightly coupled memory size (576 KB) is directly connected to the CPU, reducing the fluctuation in execution time that can occur when cache memory is used, and delivering deterministic and fast-response processing. RZ/T2L has seamless hardware architecture with RZ/T2M such as CPU core, peripheral functions and LLPP (Low Latency Peripheral	BGA	R9A07G074M01GBG#AC0	3D model available Symbol and footprint available 3	1 Download Model
	R7S721000VCBG#AC0 Renesas Electronics	1	RZ/A1H is the premium full-featured part in the RZ/A1 family with an Arm® Cortex®-A9 core running at 400MHz and 10MB of on-chip SRAM. With 10MB on-chip SRAM, the RZ/A1H supports up to 2 Displays with WXGA (1280x800) resolution without the need for external memory. RZ/A1H enables very compact embedded designs without the need to worry about memory procurement and memory EOL. With RZ/A1H, you can design your embedded system like an MCU and get the performance of a 400MHz Arm® Cortex®-A9 MPU. Enabled for suppo	BGA	R7S721000VCBG#AC0	3D model available Symbol and footprint available 3	1 Download Model
	8405202QA Renesas Electronics	1	The Renesas 80C86 high performance 16-bit CMOS CPU is manufactured using a self-aligned silicon gate CMOS process (Scaled SAJI IV). Two modes of operation, minimum for small systems and maximum for larger applications such as multiprocessing, allow user configuration to achieve the highest performance level. Full TTL compatibility (with the exception of CLOCK) and industry standard operation allow use of existing NMOS 8086 hardware and software designs.	Ceramic Dual-In-Line Packages	8405202QA	3D model not available Symbol and footprint available 2	1 Download Model
	STM32MP253AAL3 STMicroelectronics	1	Arm® based dual Cortex®-A35 1.5 GHz + Cortex®-M33 MPU with AI, 3D GPU, video encoder/decoder, TFT/DSI/LVDS, USB 3.0, PCIe®	BGA	STM32MP253AAL3	3D model available Symbol and footprint available 3	1 Download Model
	STM32MP255AAJ3 STMicroelectronics	1	https://www.st.com/resource/Includes ST state-of-the-art patented technology.Cores• Up to 64-bit dual-core Arm® Cortex®-A35– Up to 1.5 GHz– 32-Kbyte I + 32-Kbyte D level 1 cache for each core– 512-Kbyte unified level 2 cache– Arm® NEON™ and Arm® TrustZone®• 32-bit Arm® Cortex®-M33 with FPU/MPU– Up to 400 MHz– L1 16-Kbyte I / 16-Kbyte D– Arm® TrustZone®en/datasheet/stm32mp251a.pdf	BGA	STM32MP255AAJ3	3D model available Symbol and footprint available 3	1 Download Model
	STM32MP135DAE3 STMicroelectronics	1	32-bit Arm Cortex-A7 1GHz MPU for Graphics	BGA	STM32MP135DAE3	3D model available Symbol and footprint available 3	1 Download Model
	MD80C86-2/883 Renesas Electronics	1	The Renesas 80C86 high performance 16-bit CMOS CPU is manufactured using a self-aligned silicon gate CMOS process (Scaled SAJI IV). Two modes of operation, minimum for small systems and maximum for larger applications such as multiprocessing, allow user configuration to achieve the highest performance level. Full TTL compatibility (with the exception of CLOCK) and industry standard operation allow use of existing NMOS 8086 hardware and software designs.	Ceramic Dual-In-Line Packages	MD80C86-2/883	3D model not available Symbol and footprint available 2	1 Download Model
	STM32MP253FAL3 STMicroelectronics	1	Arm® based dual Cortex®-A35 1.5 GHz + Cortex®-M33 MPU with AI, 3D GPU, video encoder/decoder, TFT/DSI/LVDS, USB 3.0, PCIe®, crypto	BGA	STM32MP253FAL3	3D model available Symbol and footprint available 3	1 Download Model

	STM32MP233CAJ3 STMicroelectronics	1	Cores Up to 64-bit dual-core Arm® Cortex®-A35 Up to 1.5 GHz 32-Kbyte I + 32-Kbyte D level 1 cache for each core 512-Kbyte unified level 2 cache Arm® NEON™ and Arm® TrustZone® 32-bit Arm® Cortex®-M33 with FPU/MPU Up to 400 MHz L1 16-Kbyte I / 16-Kbyte D Arm® TrustZone®Memories External DDR memory up to 4 Gbytes Up to DDR3L-2133 16-bit Up to DDR4-2400 16-bit Up to LPDDR4-2400 16-bit 776-Kbyte internal SRAM: 256-Kbyte AXI SYSRAM, 128-Kbyte AXI video RAMor SYSRAM extension, 256-K	BGA	STM32MP233CAJ3	3D model available Symbol and footprint available 3	1 Download Model
	STM32MP157FAB1 STMicroelectronics	1	Arm® dual Cortex®-A7 800 MHz + Cortex®-M4 MPU, 3D GPU, TFT/DSI, 37 comm. interfaces, 29 timers, adv. analog, crypto	BGA	STM32MP157FAB1	3D model available Symbol and footprint available 3	1 Download Model
	STM32MP255DAL3 STMicroelectronics	1	Arm® based dual Cortex®-A35 1.5 GHz + Cortex®-M33 MPU with AI, 3D GPU, video encoder/decoder, TFT/DSI/LVDS, USB 3.0, PCIe®	BGA	STM32MP255DAL3	3D model available Symbol and footprint available 3	1 Download Model
	STM32MP157AAC3 STMicroelectronics	1	Arm® dual Cortex®-A7 800 MHz + Cortex®-M4 MPU, 3D GPU, TFT/DSI, 37 comm. interfaces, 29 timers, adv. analog	Other	STM32MP157AAC3	3D model available Symbol and footprint available 3	1 Download Model
	STM32MP255CAI3 STMicroelectronics	1	MPU with Dual Arm Cortex-A35 @1.2GHz, Cortex-M33 @400MHz, 2xEthernet, 3xFD-CAN, LVDS/DSI, H.264, 3D GPU, AI/NN, Secure Boot, Cryptography, DRAM enc/dec, PKA	BGA	STM32MP255CAI3	3D model available Symbol and footprint available 3	1 Download Model
	R9A07G044L27GBG#BC0 Renesas Electronics	1	The RZ/G2L microprocessor includes a Cortex®-A55 (1.2 GHz) CPU, 16-bit DDR3L / DDR4 interface, 3D graphics engine with Arm Mali-G31 and video codec (H.264). It also has many interfaces such as camera input, display output, USB 2.0, and Gbit-Ether, making it ideal for applications such as entry-class industrial human-machine interfaces (HMIs) and embedded devices with video capabilities.As a software platform for this product, Renesas provides the Verified Linux Package, which includes the Linux Kernel, midd	BGA	R9A07G044L27GBG#BC0	3D model available Symbol and footprint available 3	1 Download Model
	STM32MP157AAA3 STMicroelectronics	1	Arm® dual Cortex®-A7 800 MHz + Cortex®-M4 MPU, 3D GPU, TFT/DSI, 37 comm. interfaces, 29 timers, adv. analog	BGA	STM32MP157AAA3	3D model available Symbol and footprint available 3	1 Download Model
	STM32MP157AAA3T STMicroelectronics	1	Arm® dual Cortex®-A7 800 MHz + Cortex®-M4 MPU, 3D GPU, TFT/DSI, 37 comm. interfaces, 29 timers, adv. analog	BGA	STM32MP157AAA3T	3D model available Symbol and footprint available 3	1 Download Model
	R9A07G054L27GBG#AC0 Renesas Electronics	1	RZ/V2L is equipped with a Cortex®-A55 (1.2GHz) CPU and built-in AI accelerator "DRP-AI" for vision, which is Renesas' original technology. "DRP-AI" is configured with DRP and AI-MAC. It also has a 16-bit DDR3L/DDR4 interface and a built-in 3D graphics engine with Arm Mali-G31 and video codec (H.264).DRP-AI’s excellent power efficiency eliminates the need for heat dissipation measures such as heat sinks or cooling fans. AI can be implemented cost efficiently not only in consumer electronics and industrial eq	BGA	R9A07G054L27GBG#AC0	3D model available Symbol and footprint available 3	1 Download Model
	STM32MP233DAJ3 STMicroelectronics	1	Includes ST state-of-the-art patented technology.Cores• Up to 64-bit dual-core Arm® Cortex®-A35– Up to 1.5 GHz– 32-Kbyte I + 32-Kbyte D level 1 cache for each core– 512-Kbyte unified level 2 cache– Arm® NEON™ and Arm® TrustZone®• 32-bit Arm® Cortex®-M33 with FPU/MPU– Up to 400 MHz– L1 16-Kbyte I / 16-Kbyte D– Arm® TrustZone®	BGA	STM32MP233DAJ3	3D model available Symbol and footprint available 3	1 Download Model
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