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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	R5F212DASNFP#V2 Renesas Electronics	1	The R8C/2D Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.The R8C/2C Group and R8C/2D Group of single-chip MCUs incorporates the R8C/Tiny Series CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supp	Quad Flat Packages	R5F212DASNFP#V2	3D model available Symbol and footprint available 3	1 Download Model
	R5F21256SDFP#V2 Renesas Electronics	1	The R8C/25 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and are packaged in a 52-pin molded-plastic LQFP or a 64-pin molded-plastic FLGA. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Fu	Quad Flat Packages	R5F21256SDFP#V2	3D model available Symbol and footprint available 3	1 Download Model
	R5F21368CNFP#V0 Renesas Electronics	1	The R8C/36C Group is supported only for customers who have already adopted these products. The RL78/G14, RL78/G1F Groups are recommended for new designs.The R8C/36C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating	Quad Flat Packages	R5F21368CNFP#V0	3D model available Symbol and footprint available 3	1 Download Model
	R5F213G6CNSP#U0 Renesas Electronics	1	The R8C/3GC Group is supported only for customers who have already adopted these products. The RL78/G1F, RL78/G13 Groups are recommended for new designs.The R8C/3GC Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating	Small Outline Packages	R5F213G6CNSP#U0	3D model available Symbol and footprint available 3	1 Download Model

	R5F212D8SNFP#V2 Renesas Electronics	1	The R8C/2D Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.The R8C/2C Group and R8C/2D Group of single-chip MCUs incorporates the R8C/Tiny Series CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supp	Quad Flat Packages	R5F212D8SNFP#V2	3D model available Symbol and footprint available 3	1 Download Model
	R5F213G1CNSP#W4 Renesas Electronics	1	The R8C/3GC Group is supported only for customers who have already adopted these products. The RL78/G1F, RL78/G13 Groups are recommended for new designs.The R8C/3GC Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating	Small Outline Packages	R5F213G1CNSP#W4	3D model available Symbol and footprint available 3	1 Download Model
	R5F21228JFP#U1 Renesas Electronics	1	The R8C/22 Group is supported only for customers who have already adopted these products. The RL78/F12, F13, F14, F15 Groups are recommended for new designs.This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level of instruction efficiency. With 1Mb of address space, it is capable of executing instructions at high speed. This Furthermore, the data fl	Quad Flat Packages	R5F21228JFP#U1	3D model available Symbol and footprint available 3	1 Download Model
	R5F2138ASNFP#30 Renesas Electronics	1	The R8C/38T-A Group of single-chip MCUs incorporates the R8C CPU core, which provides sophisticated instructions for a high level of efficiency.The R8C/38T-A Group of single-chip microcontrollers (MCUs) incorporates the R8C CPU core, which provides sophisticated instructions for a high level of efficiency. With 1Mb of address space, the CPU core is capable of executing instructions at high speed. In addition, it features a multiplier for high-speed arithmetic processing.Power consumption is low, and additio	Quad Flat Packages	R5F2138ASNFP#30	3D model available Symbol and footprint available 3	1 Download Model
	R5F21387CNFP#V0 Renesas Electronics	1	The R8C/38C Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.The R8C/38C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow	Quad Flat Packages	R5F21387CNFP#V0	3D model available Symbol and footprint available 3	1 Download Model
	R5F21334DNFP#V2 Renesas Electronics	1	The R8C/33D Group is supported only for customers who have already adopted these products.The R8C/33D Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow additional power control. These MCUs are designed	Quad Flat Packages	R5F21334DNFP#V2	3D model available Symbol and footprint available 3	1 Download Model
	R5F21238KFP#U1 Renesas Electronics	1	The R8C/23 Group is supported only for customers who have already adopted these products.This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level of instruction efficiency. With 1Mb of address space, it is capable of executing instructions at high speed. This MCU is equipped with one CAN module and suited to in-vehicle or FA networking. Furthermore,	Quad Flat Packages	R5F21238KFP#U1	3D model available Symbol and footprint available 3	1 Download Model
	R5F2136CCNFB#U0 Renesas Electronics	1	The R8C/36C Group is supported only for customers who have already adopted these products. The RL78/G14, RL78/G1F Groups are recommended for new designs.The R8C/36C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating	Quad Flat Packages	R5F2136CCNFB#U0	3D model available Symbol and footprint available 3	1 Download Model
	R5F211B4SP#W4 Renesas Electronics	1	The R8C/1B Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using the high-performance silicon gate CMOS process, embedding the R8C/ Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high	Small Outline Packages	R5F211B4SP#W4	3D model available Symbol and footprint available 3	1 Download Model
	R5F21182NP#U0 Renesas Electronics	1	The R8C/18 Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU core and is packaged in a 20-pin plastic molded LSSOP. This MCU operates using sophisticated instructions featuring a high level of instruction efficiency. With 1Mb of address space, it is capable of executing instructions at high speed. Furthermore, the data flash ROM (	Quad Flat No-Lead	R5F21182NP#U0	3D model available Symbol and footprint available 3	1 Download Model
	R5F21334CDFP#30 Renesas Electronics	1	The R8C/33C Group is supported only for customers who have already adopted these products.The R8C/33C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow additional power control. These MCUs are designed	Quad Flat Packages	R5F21334CDFP#30	3D model available Symbol and footprint available 3	1 Download Model

	R5F2135ACNFP#V0 Renesas Electronics	1	The R8C/35C Group is supported only for customers who have already adopted these products. The RL78/G14, RL78/G1F Groups are recommended for new designs.The R8C/35C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating	Quad Flat Packages	R5F2135ACNFP#V0	3D model available Symbol and footprint available 3	1 Download Model
	R5F212B8SDFP#V2 Renesas Electronics	1	The R8C/2B Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.The R8C/2A Group and R8C/2B Group of single-chip MCUs incorporates the R8C/Tiny Series CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supp	Quad Flat Packages	R5F212B8SDFP#V2	3D model available Symbol and footprint available 3	1 Download Model
	R5F21192SP#W4 Renesas Electronics	1	The R8C/19 Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded-HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high sp	Small Outline Packages	R5F21192SP#W4	3D model available Symbol and footprint available 3	1 Download Model
	R5F21335CNFP#V2 Renesas Electronics	1	The R8C/33C Group is supported only for customers who have already adopted these products.The R8C/33C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow additional power control. These MCUs are designed	Quad Flat Packages	R5F21335CNFP#V2	3D model available Symbol and footprint available 3	1 Download Model
	R5F21276SDFP#V2 Renesas Electronics	1	The R8C/27 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/27 Group has on-chip data	Quad Flat Packages	R5F21276SDFP#V2	3D model available Symbol and footprint available 3	1 Download Model
	R5F21275SDFP#X6 Renesas Electronics	1	The R8C/27 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/27 Group has on-chip data	Quad Flat Packages	R5F21275SDFP#X6	3D model available Symbol and footprint available 3	1 Download Model
	R5F211B4NP#U0 Renesas Electronics	1	The R8C/1B Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using the high-performance silicon gate CMOS process, embedding the R8C/ Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high	Quad Flat No-Lead	R5F211B4NP#U0	3D model available Symbol and footprint available 3	1 Download Model
	R5F21154SP Renesas Electronics	1	The R8C/15 Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.This MCU is built using the high-performance silicon gate CMOS process using a R8C/Tiny Series CPU core and is packaged in a 20-pin plastic molded LSSOP. This MCU operates using sophisticated instructions featuring a high level of instruction efficiency. With 1Mb of address space, it is capable of executing instructions at high speed. Furthermore, the data flash ROM (1K	Small Outline Packages	R5F21154SP	3D model available Symbol and footprint available 3	1 Download Model
	R5F2123CJFP#W4 Renesas Electronics	1	The R8C/23 Group is supported only for customers who have already adopted these products.This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level of instruction efficiency. With 1Mb of address space, it is capable of executing instructions at high speed. This MCU is equipped with one CAN module and suited to in-vehicle or FA networking. Furthermore,	Quad Flat Packages	R5F2123CJFP#W4	3D model available Symbol and footprint available 3	1 Download Model
	R5F2135ACDFP#V0 Renesas Electronics	1	The R8C/35C Group is supported only for customers who have already adopted these products. The RL78/G14, RL78/G1F Groups are recommended for new designs.The R8C/35C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating	Quad Flat Packages	R5F2135ACDFP#V0	3D model available Symbol and footprint available 3	1 Download Model
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