2309- Footprint, Symbol and 3D Model search results

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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	2309B-1HPGG8 Renesas Electronics	1	The IDT2309B is a high-speed phase-lock loop (PLL) clock buffer, designed to address high-speed clock distribution applications. The zero delay is achieved by aligning the phase between the incoming clock and the output clock, operable within the range of 10 to 133MHz. The IDT2309B is a 16-pin version of the IDT2305B. The IDT2309B accepts one reference input, and drives two banks of four low skew clocks. The -1H version of this device operates at up to 133MHz frequency and has higher drive than the -1 devic	Small Outline Packages	2309B-1HPGG8	3D model available Symbol and footprint available 3	1 Download Model
	2309B-1HPGGI8 Renesas Electronics	1	The IDT2309B is a high-speed phase-lock loop (PLL) clock buffer, designed to address high-speed clock distribution applications. The zero delay is achieved by aligning the phase between the incoming clock and the output clock, operable within the range of 10 to 133MHz. The IDT2309B is a 16-pin version of the IDT2305B. The IDT2309B accepts one reference input, and drives two banks of four low skew clocks. The -1H version of this device operates at up to 133MHz frequency and has higher drive than the -1 devic	Small Outline Packages	2309B-1HPGGI8	3D model available Symbol and footprint available 3	1 Download Model
	2309410-1 TE Connectivity	1	Body Features: Connector Profile Low \| Retention Post Location Both Ends \| Retention Post Material Copper Alloy \| Ejector Location Both Ends \| Latch Material High Temperature Thermoplastic \| Ejector Type Locking \| Configuration Features: Number of Positions 260 \| Number of Positions 200 \| Number of Rows 2 \| Module Orientation Right Angle \| Number of Keys 1 \| Contact Features: Contact Base Material Copper Alloy \| Contact Underplating Material Nickel \| PCB Contact Termination Area Plating Material Gold Flash	Other	2309410-1	3D model available Symbol and footprint available 3	1 Download Model
	292230-9 TE Connectivity	1	TE Connectivity 292230, 1.5mm Pitch, 9 Way, 1 Row, Vertical PCB Header, Surface Mount	Other	292230-9	3D model available Symbol and footprint available 3	1 Download Model

	LTC2309IUF#PBF Analog Devices	1	ADC 12-bit SAR Serial QFN24 EP Linear Technology LTC2309IUF#PBF, 12 bit Serial ADC, Differential Input, 10-Pin DFN	Quad Flat No-Lead	LTC2309IUF#PBF	3D model available Symbol and footprint available 3	1 Download Model
	CRCW0402309KFKEDHP Vishay	1	Standard Thick Film Chip Resistors value 309K ohm.	Resistor Chip	CRCW0402309KFKEDHP	3D model available Symbol and footprint available 3	1 Download Model
	CRCW0402309KFKTD Vishay	1	Thick Film Resistors - SMD 1/16watt 309Kohms 1%	Resistor Chip	CRCW0402309KFKTD	3D model available Symbol and footprint available 3	1 Download Model
	CRCW0402309KFKTD Vishay	1	Thick Film Resistors - SMD 1/16watt 309Kohms 1%	Resistor Chip	CRCW0402309KFKTD	3D model available Symbol and footprint available 3	1 Download Model
	MAL223091003E3 Vishay	1	Vishay 20F Supercapacitor EDLC -20 %, +50 % Tolerance EDLC-HV Series 3V dc Through Hole	Capacitor, Polarized Radial Diameter	MAL223091003E3	3D model available Symbol and footprint available 3	1 Download Model
	SQ2309ES-T1-GE3 Vishay	1	Trans MOSFET P-CH 60V 1.7A Automotive 3-Pin SOT-23 T/R	SOT23 (3-Pin)	SQ2309ES-T1-GE3	3D model available Symbol and footprint available 3	1 Download Model
	LTC2309IF#TRPBF Analog Devices	1	Analog to Digital Converters - ADC 12-bit, 8-ch 14ksps I2C SAR ADC	Small Outline Packages	LTC2309IF#TRPBF	3D model available Symbol and footprint available 3	1 Download Model
	LTC2309CF#PBF Analog Devices	1	ADC 12-Bit 8-Channel 14ksps I2C TSSOP20 Linear Technology LTC2309CF#PBF, 12 bit Serial ADC, 8-channel Differential Input, 20-Pin TSSOP	Small Outline Packages	LTC2309CF#PBF	3D model available Symbol and footprint available 3	1 Download Model
	TLP2309(E(O Toshiba	1	TOSHIBA - TLP2309(E(O - Optocoupler, Digital Output, 1 Channel, 3.75 kV, 1 Mbps, SOIC, 5 Pins	Small Outline Packages	TLP2309(E(O	3D model available Symbol and footprint available 3	1 Download Model
	CY2309CSXI-1H Infineon	1	Zero Delay Buffer 9-Out LVCMOS Single-Ended 16-Pin SOIC Tube	Small Outline Packages	CY2309CSXI-1H	3D model available Symbol and footprint available 3	1 Download Model
	CRCW0402309RFKED Vishay	1	RESISTOR, 0402 309 Ohms ±1% 0.063 W	Resistor Chip	CRCW0402309RFKED	3D model available Symbol and footprint available 3	1 Download Model

	CRCW0402309RFKED Vishay	1	RESISTOR, 0402 309 Ohms ±1% 0.063 W	Resistor Chip	CRCW0402309RFKED	3D model available Symbol and footprint available 3	1 Download Model
	2309414-1 TE Connectivity	1	Body Features: Latch Material High Temperature Thermoplastic \| Ejector Location Both Ends \| Connector Profile High \| Ejector Type Locking \| Retention Post Material Stainless Steel \| Retention Post Location Both Ends \| Module Key Type Offset Right \| Configuration Features: Number of Positions 260 \| Number of Rows 2 \| Module Orientation Right Angle \| Number of Keys 1 \| Contact Features: Memory Socket Type Memory Card \| Contact Base Material Copper Alloy \| PCB Contact Termination Area Plating Material Gold Fla	Other	2309414-1	3D model available Symbol and footprint available 3	1 Download Model
	TSW-123-09-F-S SAMTEC	1	23 Position, Single Row, Classic PCB Header Strips, 0.100" pitch	Other	TSW-123-09-F-S	3D model not available Symbol and footprint available 2	1 Download Model
	2309413-4 TE Connectivity	1	Body Features: Module Key Type Offset Left \| Ejector Location Both Ends \| Ejector Type Locking \| Retention Post Location Both Ends \| Retention Post Material Stainless Steel \| Connector Profile High \| Latch Material High Temperature Thermoplastic \| Configuration Features: Number of Positions 260 \| Module Orientation Right Angle \| Number of Keys 1 \| Number of Rows 2 \| Contact Features: Memory Socket Type Memory Card \| Contact Underplating Material Nickel \| Contact Mating Area Plating Material Gold \| Contact C	Other	2309413-4	3D model available Symbol and footprint available 3	1 Download Model
	TSW-123-09-E-D SAMTEC	1	46 Position, Classic PCB Header Strips, 0.100" pitch	Other	TSW-123-09-E-D	3D model not available Symbol and footprint available 2	1 Download Model
	MS2309L4 CIT Relay & Switch	1	SLIDE SWITCH DP3T 300MA 50VDC	Other	MS2309L4	3D model not available Symbol and footprint available 2	1 Download Model
	TSW-123-09-G-S SAMTEC	1	23 Position, Single Row, Classic PCB Header Strips, 0.100" pitch	Other	TSW-123-09-G-S	3D model not available Symbol and footprint available 2	1 Download Model
	TSW-123-09-H-S SAMTEC	1	23 Position, Single Row, Classic PCB Header Strips, 0.100" pitch	Other	TSW-123-09-H-S	3D model not available Symbol and footprint available 2	1 Download Model
	2309A-1DCGI Renesas Electronics	1	The 2309A is a high-speed phase-lock loop (PLL) clock buffer, designed to address high-speed clock distribution applications. The zero delay is achieved by aligning the phase between the incoming clock and the output clock, operable within the range of 10 to 133MHz. The 2309A is a 16-pin version of the 2305A. The 2309A accepts one reference input, and drives two banks of four low skew clocks. The -1H version of this device operates up to 133MHz frequency and has higher drive than the -1 device. All parts ha	Small Outline Packages	2309A-1DCGI	3D model available Symbol and footprint available 3	1 Download Model
	2309409-1 TE Connectivity	1	Body Features: Latch Material High Temperature Thermoplastic \| Retention Post Location Both Ends \| Ejector Type Locking \| Connector Profile Low \| Module Key Type Offset Left \| Ejector Location Both Ends \| Configuration Features: Number of Positions 260 \| Number of Keys 1 \| Module Orientation Right Angle \| Number of Rows 2 \| Contact Features: Contact Current Rating (Max) .5 AMP \| Contact Mating Area Plating Material Gold Flash \| Contact Base Material Copper Alloy \| PCB Contact Termination Area Plating Materi	Other	2309409-1	3D model available Symbol and footprint available 3	1 Download Model
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