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415504-3
TE Connectivity
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1 | Mini SMB vertical PCB mount Jack 75ohm Mini SMB vertical PCB mount Jack 75ohm | Other | 415504-3 |
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2355045-4
TE Connectivity
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1 | 4P,2MM,BRK HDR,SRVT,2.8,0.1AU,TB | Header, Vertical | 2355045-4 |
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36550402JR12T
TE Connectivity
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1 | .12 µH Molded SMD Inductor, 150 mA, 2.5 ohm DC Resistance, 8 Quality Factor, 5 %, 1 mm [.039 in] Length, .5 mm [.019 in] Width, Sigma 3655 | Inductors Chip | 36550402JR12T |
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5504F1-25P-02A-03
Multicomp Pro
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1 | D Sub Connector, Right Angle, DB25, Standard, Plug, 5504, 25 Contacts, DB, Solder | Other | 5504F1-25P-02A-03 |
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249FGJS0XB25504KA
Vishay
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1 | Potentiometer,Cermet,12mm,1.0W,249-7,6.35mm shaft,lin,500k | Other | 249FGJS0XB25504KA |
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5504-12-1
Coto Technology
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1 | Reed Relays REED RELAY SPST 3A 12V | Other | 5504-12-1 |
3
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BQ25504RGTR
Texas Instruments
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1 | Ultra Low Power Boost Converter with Battery Management for Energy Harvester | Nano-Power Management | Quad Flat No-Lead | BQ25504RGTR |
3
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BQ25504RGTT
Texas Instruments
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1 | Boost Converter, Battery Manag. VQFN16 Texas Instruments BQ25504RGTT, 3, Boost Converter, Boost Converter, 1 MHz, 16-Pin QFN | Quad Flat No-Lead | BQ25504RGTT |
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GRF5504
Guerrilla RF
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1 | RF Amplifier High Efficiency, 3.5Watt PA/Saturated PA, OP1dB >34.0 dBm; 0.4 - 0.5 GHz | Quad Flat No-Lead | GRF5504 |
3
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MIC5504-2.8YM5-TR
Microchip
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1 | MICROCHIP - MIC5504-2.8YM5-TR - LDO VOLT REG, 0.3A, 2.8V, SOT-23-5 | SOT23 (5-Pin) | MIC5504-2.8YM5-TR |
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SI5504BDC-T1-E3
Vishay
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1 | Vishay SI5504BDC-T1-E3 N/P-channel MOSFET Transistor, 8-Pin 1206 | Other | SI5504BDC-T1-E3 |
3
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TMS320C5504AZCH10
Texas Instruments
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1 | Fixed-Point Digital Signal Processor | BGA | TMS320C5504AZCH10 |
3
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8550401EA
Texas Instruments
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1 | Decoder/Demultiplexer Single 3-to-8 16-Pin CDIP Tube | Ceramic Dual-In-Line Packages | 8550401EA |
3
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MSP430F5504IPT
Texas Instruments
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1 | Texas Instruments MSP430F5504IPT, 16bit MSP430 Microcontroller, 25MHz, 8 kB Flash, 48-Pin LQFP | Quad Flat Packages | MSP430F5504IPT |
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1955044
Phoenix Contact
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1 | CCA 2,5/ 3-G-5,08 P26THRR32 - PCB headers, nominal cross section: 2.5 mm2, color: black, nominal current: 12 A, rated voltage (III/2): 320 V, contact surface: Sn, contact connection type: Pin, number of potentials: 3, number of rows: 1, number of positions: 3, number of connections: 3, product range: CCA 2,5/..-G, pitch: 5.08 mm, connection method: Plug-in connection, mounting: THR soldering / wave soldering, pin layout: Linear pinning, solder pin [P]: 2.6 mm, number of solder pins per potential: | Other | 1955044 |
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SCF9550-45-10
Eaton
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1 | SCF9550, 45 AMP, 9~10 CELLS , 9.5 mm x 5.0 mm Surface mount self-control fuse | Other | SCF9550-45-10 |
3
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M22-6550442R
Harwin
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1 | M22: 4+4 Pos Receptacle DIL Right-Angle SMT Connector (T+R) | Other | M22-6550442R |
3
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744355047
Würth Elektronik
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1 | WE-HCI SMT Flat Wire High Current Inductor Size 1350; L = 0.47 µH ±20%; IR = 26 A; Isat = 50 A; RDC = 0.9 mΩ | Other | 744355047 |
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M55-6155042R
Harwin
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1 | Kontrol: 25+25 Pos Receptacle DIL Right-Angle SMT Connector Pegs THT Hold-down (T+R) | Other | M55-6155042R |
2
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150060YS55040
Würth Elektronik
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1 | WL-SMCD SMT Mono-color Chip LED Diffused 0603, Yellow Typ.(@20mA): 591 nm, 100 mcd, 2.0 V, 140° AlInGaP | LEDs Chip | 150060YS55040 |
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1155040000
Weidmüller
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1 | PCB connector (board connection), 320 V, 24 A, Pitch in mm: 5.08, Number of poles: 3, THT solder connection, Box | Other | 1155040000 |
3
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NCV5504DTRKG
onsemi
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1 | One Fixed and One Adjustable Output; Adjustable Output Voltage from 1.25 V to 5.0 V; Low Dropout Voltage of 250 mV Typical at 250 mA; Low Quiescent Current of 370 µA Typical; Ripple Rejection of 75 dB; Temperature Range of -40°C to +125°C; Accuracy of ±2.0% Over Temperature; Thermal Protection and Current Limit; AEC Qualified; PPAP Capable | Other | NCV5504DTRKG |
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2355045-8
TE Connectivity
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1 | 8P,2MM,BRK HDR,SRVT,2.8,0.1AU,TB | Header, Vertical | 2355045-8 |
3
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150060GS55040
Würth Elektronik
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1 | WL-SMCD SMT Mono-color Chip LED Diffused 0603, Green Typ.(@20mA): 520 nm, 430 mcd, 3.2 V, 140° InGaN | LEDs Chip | 150060GS55040 |
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415504-4
TE Connectivity
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1 | Body Features: Body Underplating Material Nickel | Body Plating Material Gold | Body Material Brass | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 1 | Number of Coaxial Contacts 1 | Contact Features: RF Connector Center Contact Plating Material Gold | RF Connector Center Contact Plating Thickness 30 MICIN | RF Connector Center Contact Material Brass | RF Connector Center Contact Underplating Material Nickel | Dimensions: Profile Height from PCB .3 INCH | Profile Height from P | Other | 415504-4 |
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