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5555162-1
TE Connectivity
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1 | Body Features: Modular Jack Latch Orientation Standard - Latch Down | Connector Profile Low | Configuration Features: PCB Mount Orientation Right Angle | Number of Positions 8 | Connector Contact Density Standard | Number of Loaded Positions 8 | Port Configuration Single Port | Port Matrix Configuration 1 x 1 | Status Light Type Not Illuminated | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 1.27 MICM | Contact Mating Area Plating Materi | Other | 5555162-1 |
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5055558-4
TE Connectivity
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1 | Body Features: Terminal Profile Standard | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 10 | Contact Features: Contact Mating Area Plating Material Thickness 3.04 MICM | Contact Current Rating (Max) 37.8 AMP | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness .5 – 3.04 MICM | PCB Contact Termination Area Plating Material Thickness 20 – 120 MICIN | PCB Contact Termination A | Other | 5055558-4 |
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SLG55550V
Renesas Electronics
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1 | The SLG55550 is a USB device that combines high speed USB switches with a USB host charger (dedicated charger) identification circuit. The device supports both the latest USB Battery Charging Specification Revision 1.1 including data contact detection and a set resistor bias for Apple compliant devices as well as legacy USB D+/D- short detection using data line pull-up. | Small Outline No-lead | SLG55550V |
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FJB5555TM
onsemi
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1 | Bipolar (BJT) Transistor NPN 400V 5A 1.6W Surface Mount TO-263 (D2PAK) , 800mA , -55°C to +150°C | Other | FJB5555TM |
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5555163-5
TE Connectivity
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1 | J11 Connectors, Single Port, 1 x 1, Low Profile, RJ Type Jacks & Plugs, Standard Connector Contact Density, Jack, Standard | Other | 5555163-5 |
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5555149-1
TE Connectivity
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1 | Body Features: Shield Plating Material Nickel over Copper | Primary Product Color Black | Shield Plating Finish Bright | Connector Profile Low | Shield Material Zinc | Configuration Features: Number of Positions 50 | Number of Rows 2 | PCB Mount Orientation Right Angle | Contact Features: Contact Base Material Copper Alloy | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 3.5 AMP | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material | Other | 5555149-1 |
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5555001F
Dialight
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1 | LED Circuit Board Indicator LED Circuit Board Indicator 4 Wide Red (x 4) Clear 1.6V 20mA Round with Domed Top 2.00mm Dia Through Hole , -55C to +100C | Other | 5555001F |
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ISOM5-555-R-L5
Bourns
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1 | IsoMOV 5KA 555Vrms Reel Crimped | Other | ISOM5-555-R-L5 |
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5555980-1
TE Connectivity
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1 | TE Connectivity Cat3 4P4C Right Angle Through Hole UTP RJ22 Modular Jack Connector, Socket | Other | 5555980-1 |
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2744555576
Fair-Rite
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1 | Ferrite Beads 44 SM BEAD Z=600 OHM @100MHz | Other | 2744555576 |
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JAN1N5555
Microsemi Corporation
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1 | ESD Suppressors / TVS Diodes 47.5V 32A Uni-Directional TVS | Diodes, Axial Diameter Horizontal Mounting | JAN1N5555 |
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5055557-3
TE Connectivity
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1 | Power to the Board 10 POWER TAP ASSY .100 Dual Row | Other | 5055557-3 |
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9-55556-0
TE Connectivity
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1 | 10 POWER TAP ASSY WITH SCREW #6-32 | Other | 9-55556-0 |
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875075555002
Würth Elektronik
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1 | WCAP-PSLC Aluminum Polymer Capacitors PSEE117470M025DVCTFB000; SMT V-Chip; 47 µF ± 20%; 25 V(DC); 2000 h; -55°C / +105°C; size DxL 8.0 x 11.7; ESR 15 mΩ; Max. Iripple 4210 mA @100 kHz; LC 235 µA; DF 8 % | Capacitor Al Electrolytic | 875075555002 |
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5555141-1
TE Connectivity
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1 | .01 Gb/s, RJ45 Connector, Single Port, 1 x 1, Jack, Shielded, Cat 3, Standard - Latch Down, 8 Position, Low Profile, Through Hole - Solder | Other | 5555141-1 |
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5555166-1
TE Connectivity
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1 | Body Features: Modular Jack Latch Orientation Standard - Latch Down | Connector Profile Low | Configuration Features: Connector Contact Density Standard | Number of Loaded Positions 8 | PCB Mount Orientation Right Angle | Port Matrix Configuration 1 x 1 | Status Light Type Not Illuminated | Port Configuration Single Port | Number of Positions 8 | Contact Features: Contact Current Rating (Max) 1.5 AMP | Contact Mating Area Plating Material Gold | Contact Base Material Phosphor Bronze | Contact Current Rating | Other | 5555166-1 |
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5555764-1
TE Connectivity
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1 | Body Features: Connector Profile Low | Modular Jack Latch Orientation Standard - Latch Down | Configuration Features: Connector Contact Density Standard | Port Matrix Configuration 1 x 1 | PCB Mount Orientation Right Angle | Port Configuration Single Port | Status Light Type Not Illuminated | Number of Positions 8 | Number of Loaded Positions 8 | Contact Features: Contact Current Rating (Max) 1.5 AMP | Contact Mating Area Plating Material Thickness 50 MICIN | Contact Base Material Phosphor Bronze | Contact | Other | 5555764-1 |
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5555163-1
TE Connectivity
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1 | MJ,LPF,R/A,6P/6C,PNL STOPS,BU | Other | 5555163-1 |
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6255.553
SCHURTER
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1 | CAD-Model shows variation protections class I, 2-pol fuse holder, snap-in 3.0 mm, terminal 6.3x0.8 mm | Other | 6255.553 |
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5055557-4
TE Connectivity
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1 | Body Features: Terminal Profile High | Configuration Features: Number of Positions 10 | PCB Mount Orientation Vertical | Contact Features: PCB Contact Termination Area Plating Material Finish Matte | Contact Mating Area Plating Material Finish Matte | Contact Mating Area Plating Material Thickness 3.81 MICM | PCB Contact Termination Area Plating Material Tin | Contact Fabrication Stamped & Formed | Contact Mating Area Plating Material Thickness 150 MICIN | Contact Mating Area Plating Material Tin | PCB Cont | Other | 5055557-4 |
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5555140-2
TE Connectivity
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1 | Single Port, 1 x 1, Low Profile, RJ Type Jacks & Plugs, Standard Connector Contact Density, Jack, Standard - Latch Down, Right Angle, RJ14 Connectors | Other | 5555140-2 |
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5555167-1
TE Connectivity
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1 | Body Features: Connector Profile Low | Modular Jack Latch Orientation Standard - Latch Down | Configuration Features: Status Light Type Not Illuminated | PCB Mount Orientation Right Angle | Number of Positions 8 | Connector Contact Density Standard | Port Configuration Single Port | Number of Loaded Positions 8 | Port Matrix Configuration 1 x 1 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 50 MICIN | Contact Current Rating (Max) 1.5 AM | Other | 5555167-1 |
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LTC5555IUFD#TRPBF
Analog Devices
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1 | 1.5GHz to 7GHz Programmable Gain Downconverting Mixer | Quad Flat No-Lead | LTC5555IUFD#TRPBF |
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875075555003
Würth Elektronik
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1 | WCAP-PSLC Aluminum Polymer Capacitors PSEE117680M025DVCTFB000; SMT V-Chip; 68 µF ± 20%; 25 V(DC); 2000 h; -55°C / +105°C; size DxL 8.0 x 11.7; ESR 15 mΩ; Max. Iripple 4210 mA @100 kHz; LC 340 µA; DF 8 % | Capacitor Al Electrolytic | 875075555003 |
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875075555004
Würth Elektronik
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1 | WCAP-PSLC Aluminum Polymer Capacitors PSEE117820M025DVCTFB000; SMT V-Chip; 82 µF ± 20%; 25 V(DC); 2000 h; -55°C / +105°C; size DxL 8.0 x 11.7; ESR 15 mΩ; Max. Iripple 4210 mA @100 kHz; LC 410 µA; DF 8 % | Capacitor Al Electrolytic | 875075555004 |
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![Part Image](["https://www.te.com/content/dam/te-com/catalog/part/055/551/621/5555162-1-t1.jpg/jcr:content/renditions/product-details.png","https://www.te.com/content/dam/te-com/catalog/part/055/551/621/5555162-1-t1.jpg/jcr:content/renditions/product-details.png",null])
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