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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	MT53E256M32D2FW-046AUT:B Micron	1	This data sheet specifies the operation of the unifiedLPDDR4 and LPDDR4X product, and first describesspecific requirements for LPDDR4X 0.6V VDDQ operation. When using the product as an LPDDR4 device,refer to LPDDR4 setting section LPDDR4 1.10V VDDQat the end of this data sheet	BGA	MT53E256M32D2FW-046AUT:B	3D model not available Symbol and footprint available 2	1 Download Model
	NT6AN1024F32AV-J2 Nanya	1	Basis LPDDR4 Compliant- Low Power Consumption- 16n Prefetch Architecture and BL16, BL32 (OTF)Signal Integrity- Internal VREF and VREF Training- Configurable DS for system compatibility- Configurable On-Die Termination- ZQ Calibration for DS/ODT impedance accuracy viaexternal ZQ pad (240Ω± 1%)- Data bus inversion (DBI)Training for Signals’ Synchronization- DQ Calibration offering specific DQ output patterns	BGA	NT6AN1024F32AV-J2	3D model available Symbol and footprint available 3	1 Download Model
	AS4C256M32MD4V-062BAN Alliance Memory	1	DRAM LPDDR4X, 8G, 256M x 32, 0.6V, 200ball TFBGA, 1600MHZ, ECC, AUTO TEMP	BGA	AS4C256M32MD4V-062BAN	3D model available Symbol and footprint available 3	1 Download Model
	D1611PM3BDGUI-U Kingston Technology	1	• Die Density: 16Gbits• Organization– x 16 bits: 128M words x 16 bits x 8 banks– 2 pieces of 16Gb (x16) in one package(For 32Gb case)– Row Address: R0 ~ R16– Column Address: C0 ~ C9• Package– 200-ball FBGA• Power supply– VDD1 = 1.8V (1.70V to 1.95V) ,– VDD2, VDDCA and VDDQ = 1.1V (1.06V to1.17V)• Data rate:– 3733Mbps max. Backward compatible• Eight internal banks per channel for concurrentoperation• Burst lengths (BL): 16, 32 and on-the-fly- On the fly mode is enabled by	BGA	D1611PM3BDGUI-U	3D model available Symbol and footprint available 3	1 Download Model

	IS43LQ32256A-062BLI Integrated Silicon Solution Inc.	1	DRAM 8G, 1.06-1.17/1.70-1.95V, LPDDR4, 256Mx32, 1600MHz, 200 ball BGA (10mmx14.5mm) RoHS	BGA	IS43LQ32256A-062BLI	3D model available Symbol and footprint available 3	1 Download Model
	IS43LD16128B-25BLI Integrated Silicon Solution Inc.	1	DRAM LPDDR2 2Gb 400MHz 12 8Mx16 IT	BGA	IS43LD16128B-25BLI	3D model available Symbol and footprint available 3	1 Download Model
	EDB4432BBPA-1D-F-R Micron	1	DRAM LPDDR2 4G 128MX32 FBGA	BGA	EDB4432BBPA-1D-F-R	3D model available Symbol and footprint available 3	1 Download Model
	IS46LQ32256B-062BLA2 Integrated Silicon Solution Inc.	1	DRAM Automotive (Tc: -40 to +105C), 8G, 1.06-1.17/1.70-1.95V, LPDDR4, 256Mx32, 1600MHz, 200 ball BGA (10mmx14.5mm) RoHS	BGA	IS46LQ32256B-062BLA2	3D model available Symbol and footprint available 3	1 Download Model
	IS43LQ16128A-062BLI Integrated Silicon Solution Inc.	1	DRAM 2G, 1.06-1.17/1.70-1.95V, LPDDR4, 128Mx16, 1600MHz, 200 ball BGA (10mmx14.5mm) RoHS	BGA	IS43LQ16128A-062BLI	3D model available Symbol and footprint available 3	1 Download Model
	NT6AN256T32AV-J2 Nanya	1	LPDDR4x 8GB	BGA	NT6AN256T32AV-J2	3D model available Symbol and footprint available 3	1 Download Model
	IS43LD32640B-18BL Integrated Silicon Solution Inc.	1	DRAM Chip Mobile LPDDR2 SDRAM 2Gbit 64Mx32 1.8V/1.2V 134-Pin TFBGA	BGA	IS43LD32640B-18BL	3D model available Symbol and footprint available 3	1 Download Model
	IS43LD16640A-25BLI Integrated Silicon Solution Inc.	1	DRAM 1G 1.2/1.8V 64Mx16 400MHz 134ball BGA	BGA	IS43LD16640A-25BLI	3D model available Symbol and footprint available 3	1 Download Model
	AS4C8M32MD2A-25BPCN Alliance Memory	1	DRAM 256M 1.2/1.8V 32Mx32 Mobile DDR2 E-Temp	BGA	AS4C8M32MD2A-25BPCN	3D model available Symbol and footprint available 3	1 Download Model
	MT62F1G64D8EK-031AUT:B Micron Technology Inc	1	LPDDR5 DRAM, 1GX64, CMOS, PBGA441		MT62F1G64D8EK-031AUT:B	3D model not available Symbol and footprint not available 0	0 Build or Request
	MT62F4G32D8DV-023IT:B Micron Technology Inc	1	LPDDR5 DRAM, 4GX32, CMOS, PBGA315		MT62F4G32D8DV-023IT:B	3D model not available Symbol and footprint not available 0	0 Build or Request

	MT62F512M64D4EK-031AAT:B Micron Technology Inc	1	LPDDR5 DRAM, 512MX64, CMOS, PBGA441		MT62F512M64D4EK-031AAT:B	3D model not available Symbol and footprint not available 0	0 Build or Request
	MT62F1G64D8DS-031WT:B Micron Technology Inc	1	LPDDR5 DRAM, 1GX64, CMOS, PBGA315		MT62F1G64D8DS-031WT:B	3D model not available Symbol and footprint not available 0	0 Build or Request
	MT62F512M64D4DR-031IT:B Micron Technology Inc	1	LPDDR5 DRAM, 512MX64, CMOS, PBGA315		MT62F512M64D4DR-031IT:B	3D model not available Symbol and footprint not available 0	0 Build or Request
	MT62F1G64D8EK-031AAT:B Micron Technology Inc	1	LPDDR5 DRAM, 1GX64, CMOS, PBGA441		MT62F1G64D8EK-031AAT:B	3D model not available Symbol and footprint not available 0	0 Build or Request
	MT62F512M32D2DR-031WT:B Micron Technology Inc	1	LPDDR5 DRAM, 512MX32, CMOS		MT62F512M32D2DR-031WT:B	3D model not available Symbol and footprint not available 0	0 Build or Request
	MT62F512M64D4DR-031WT:B Micron Technology Inc	1	LPDDR5 DRAM, 512MX64, CMOS, PBGA315		MT62F512M64D4DR-031WT:B	3D model not available Symbol and footprint not available 0	0 Build or Request
	MT62F2G32D8DR-031IT:B Micron Technology Inc	1	LPDDR5 DRAM, 2GX32, CMOS, PBGA315		MT62F2G32D8DR-031IT:B	3D model not available Symbol and footprint not available 0	0 Build or Request
	MT62F1G32D4DS-031AUT:B Micron Technology Inc	1	LPDDR5 DRAM, 1GX32, CMOS, PBGA315		MT62F1G32D4DS-031AUT:B	3D model not available Symbol and footprint not available 0	0 Build or Request
	MT62F1G32D4EK-031WT:B Micron Technology Inc	1	LPDDR5 DRAM, 1GX32, CMOS, PBGA441		MT62F1G32D4EK-031WT:B	3D model not available Symbol and footprint not available 0	0 Build or Request
	MT62F1G32D2DS-023WT:B Micron Technology Inc	1	LPDDR5 DRAM, 1GX32, CMOS, PBGA315		MT62F1G32D2DS-023WT:B	3D model not available Symbol and footprint not available 0	0 Build or Request
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