SMB-5 Model Download Search Results
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1SMB5938-AU
PANJIT
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1 | Zener Diodes - 1SMB5938-AU , AEC-Q101, 1500mW, 5V, 3633, SMB | Diodes Moulded | 1SMB5938-AU |
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1SMB5923
PANJIT
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1 | Zener Diodes - 1SMB5923 , 1500mW, 5V, 8.27.5, SMB | Diodes Moulded | 1SMB5923 |
3
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1SMB5942-AU
PANJIT
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1 | Zener Diodes - 1SMB5942-AU , AEC-Q101, 1500mW, 5V, 5147, SMB | Diodes Moulded | 1SMB5942-AU |
3
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1SMB5933-AU
PANJIT
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1 | Zener Diodes - 1SMB5933-AU , AEC-Q101, 1500mW, 5V, 2220, SMB | Diodes Moulded | 1SMB5933-AU |
3
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1SMB5927-AU
PANJIT
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1 | Zener Diodes - 1SMB5927-AU , AEC-Q101, 1500mW, 5V, 1211, SMB | Diodes Moulded | 1SMB5927-AU |
3
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P6SMB56CAS
PANJIT
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1 | Transient Voltage Suppressors - P6SMB56CAS , BI, 600W, Min.47.8V, Max.58.8V, SMB | Diodes Moulded Non Polarised | P6SMB56CAS |
3
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P6SMB56AS
PANJIT
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1 | Transient Voltage Suppressors - P6SMB56AS , UNI, 600W, Min.47.8V, Max.58.8V, SMB | Diodes Moulded | P6SMB56AS |
3
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P6SMB56CA-AU
PANJIT
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1 | Transient Voltage Suppressors - P6SMB56CA-AU , AEC-Q101, BI, 600W, Min.47.8V, Max.58.8V, SMB | Diodes Moulded Non Polarised | P6SMB56CA-AU |
3
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P6SMB51A-AU
PANJIT
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1 | Transient Voltage Suppressors - P6SMB51A-AU , AEC-Q101, UNI, 600W, Min.43.6V, Max.53.6V, SMB | Diodes Moulded | P6SMB51A-AU |
3
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P6SMB56A-AU
PANJIT
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1 | Transient Voltage Suppressors - P6SMB56A-AU , AEC-Q101, UNI, 600W, Min.47.8V, Max.58.8V, SMB | Diodes Moulded | P6SMB56A-AU |
3
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P6SMB51AJ
Nexperia
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1 | 600 W Transient Voltage Suppressor 7.02 V to 214 V SMB (SOD1002-1) | Diodes Moulded | P6SMB51AJ |
3
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SMB5359B
DC COMPONENTS CO., LTD
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1 | Diode: Zener; 5W; 24V; SMD; reel,tape; SMB; single diode; 0.5uA | Diodes Moulded | SMB5359B |
3
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P6SMB550A
Bourns
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1 | ESD Suppressors / TVS Diodes 550V 600W UniDir | Diodes Moulded | P6SMB550A |
3
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SZ1SMB58AT3G
LITTELFUSE
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1 | ESD Suppressors / TVS Diodes 58V 600W UNI-DIR SZ1SMB AEC-Q101 | Other | SZ1SMB58AT3G |
3
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1SMB5937B-13
Diodes Incorporated
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1 | Zener Diodes 3.0W SM POWER ZENER 6.2V 39V 200mA 1.2 | Diodes Moulded | 1SMB5937B-13 |
3
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1SMB5950 R5
Taiwan Semiconductor
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1 | Zener Diodes 3W,110V,5%,ZENER,SMB | Diodes Moulded | 1SMB5950 R5 |
3
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1SMB5948
Taiwan Semiconductor
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1 | Zener Diode 91 V 3 W ±5% Surface Mount DO-214AA (SMB) | Diodes Moulded | 1SMB5948 |
3
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SZ1SMB5933BT3G
onsemi
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1 | Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi | Diodes Moulded | SZ1SMB5933BT3G |
3
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P6SMB56CA-Q
Bourns
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1 | P6SMB-Q Transient Voltage Suppressor Diode Series, Bi-Directional | Diodes Moulded Non Polarised | P6SMB56CA-Q |
3
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1SMB5946BT3G
onsemi
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1 | Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi | Diodes Moulded | 1SMB5946BT3G |
3
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SZ1SMB5941BT3G
onsemi
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1 | Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi | Diodes Moulded | SZ1SMB5941BT3G |
3
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1SMB5932BT3G
onsemi
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1 | Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi | Diodes Moulded | 1SMB5932BT3G |
3
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1SMB5916BT3G
onsemi
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1 | Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi | Diodes Moulded | 1SMB5916BT3G |
3
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1SMB5953BT3G
onsemi
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1 | Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi | Diodes Moulded | 1SMB5953BT3G |
3
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1SMB5934BT3G
onsemi
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1 | Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi | Diodes Moulded | 1SMB5934BT3G |
3
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