LPC-5 Model Download Search Results
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LPC5526JBD64
NXP
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1 | LPC5526JBD64 | Quad Flat Packages | LPC5526JBD64 |
3
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LPC55S04JHI48
NXP
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1 | 32-bit Arm Cortex®-M33, TrustZone, PRINCE, CASPER, 96 KB SRAM; 256 KB flash, Flexcomm Interface, CAN FD, 32-bit counter/ timers, SCTimer/PWM, PLU, 16-bit 2.0 Msamples/sec ADC, Comparator, Temperature Sensor, AES, PUF, SHA, CRC, RNG | Quad Flat No-Lead | LPC55S04JHI48 |
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1 | ARM Microcontrollers - MCU | Quad Flat Packages | LPC54607J256BD208E |
3
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1 | ARM Microcontrollers - MCU LPC54S018J4MET180 | BGA | LPC54S018J4MET180E |
3
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LPC55S69JBD64E
NXP
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1 | ARM® Cortex®-M33 LPC55S6x Microcontrollers IC 32-bit Dual-Core 150MHz 640KB (640K x 8) FLASH 64-HTQFP (10x10) | Quad Flat Packages | LPC55S69JBD64E |
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LPC5528JEV98
NXP
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1 | ARM® Cortex®-M33 LPC552x Microcontroller IC 32-Bit 150MHz 512KB (512K x 8) FLASH 98-VFBGA (7x7) | BGA | LPC5528JEV98 |
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LPC55S16JEV59
NXP
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1 | 32-bit Arm Cortex®-M33, TrustZone, PRINCE, CASPER, 96 KBSRAM; 256 KB flash, USB HS, Flexcomm Interface, CAN FD,32-bit counter/ timers, SCTimer/PWM, PLU, 16-bit 2.0Msamples/sec ADC, Comparator, Temperature Sensor, AES,PUF, SHA, CRC, RNG | BGA | LPC55S16JEV59 |
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LPC5536JHI48/00E
NXP
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1 | ARM® Cortex®-M33 - Microcontroller IC 32-Bit Single-Core 150MHz 256KB (256K x 8) FLASH 48-HVQFN (7x7) | Quad Flat No-Lead | LPC5536JHI48/00E |
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LPC55S69JBD100Y
NXP
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1 | High Efficiency ARM Cortex M33-based Microcontroller | Quad Flat Packages | LPC55S69JBD100Y |
3
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LPC5504JBD64E
NXP
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1 | ARM Microcontrollers - MCU High Efficient Arm Cortex-M33-based Microcontroller | Quad Flat Packages | LPC5504JBD64E |
3
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LPC55S16JBD64E
NXP
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1 | ARM Microcontrollers - MCU High Efficiency Arm Cortex-M33-based Microcontroller | Quad Flat Packages | LPC55S16JBD64E |
3
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LPC55S69JBD100K
NXP
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1 | NXP - LPC55S69JBD100K - MCU, 32BIT, 100MHZ, HLQFP | Quad Flat Packages | LPC55S69JBD100K |
3
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LPC55S66JEV98
NXP
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1 | ARM® Cortex®-M33 LPC55S6x Microcontroller IC 32-Bit Dual-Core 150MHz 256KB (256K x 8) FLASH 98-VFBGA (7x7) | BGA | LPC55S66JEV98 |
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LPC55S26JBD64K
NXP
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1 | ARM Microcontrollers - MCU High Efficiency Arm Cortex -M33-based Microcontroller | Quad Flat Packages | LPC55S26JBD64K |
3
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LPC5506JHI48
NXP
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1 | LPC550x/S0x: Baseline Arm® Cortex®-M33-Based Microcontroller Family | Quad Flat No-Lead | LPC5506JHI48 |
3
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LPC5504JHI48
NXP
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1 | 32-bit Arm® Cortex®-M33 MCU @ 96 MHz, up to 256 KB Flash, 96 KB SRAM, TrustZone®, AES-256, PUF, 16-bit ADC (2 MS/s), 9x Flexcomm (USART/SPI/I²C/I²S), CAN FD, DMA, SCT/PWM, RTC, up to 64 GPIO, -40°C to 105°C, HVQFN48/HTQFP64 packages. | Quad Flat No-Lead | LPC5504JHI48 |
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1 | ARM Microcontrollers - MCU Low Power 32-bit Microcontroller based on ARM® Cortex®-M4 | Quad Flat Packages | LPC54113J128BD64QL |
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LPC5512JBD100
NXP
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1 | 32-bit Arm Cortex®-M33, TrustZone, PRINCE, CASPER, 96 KBSRAM; 256 KB flash, USB HS, Flexcomm Interface, CAN FD,32-bit counter/ timers, SCTimer/PWM, PLU, 16-bit 2.0Msamples/sec ADC, Comparator, Temperature Sensor, AES,PUF, SHA, CRC, RNG | Quad Flat Packages | LPC5512JBD100 |
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1 | Up to 512 KB on-chip flash program memory with flash accelerator and 256 bytepage erase and write. Up to 200 KB total SRAM consisting of 160 KB contiguous main SRAM and anadditional 32 KB SRAM on the I&D buses. 8 KB of SRAM bank intended for USBtraffic. 16 KB of EEPROM. ROM API support: Flash In-Application Programming (IAP) and In-System Programming (ISP). ROM-based USB drivers (HID, CDC, MSC, and DFU). Flash updates via USB. Booting from valid user code in flash, USART, SPI, and | Quad Flat Packages | LPC54607J256BD208 |
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LPC55S14JBD64E
NXP
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1 | ARM® Cortex®-M33 LPC55S1x Microcontroller IC 32-Bit Single-Core 150MHz 128KB (128K x 8) FLASH 64-HTQFP (10x10) | Quad Flat Packages | LPC55S14JBD64E |
3
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LPC5516JBD100Y
NXP
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1 | ARM Microcontrollers - MCU High Efficiency Arm Cortex-M33-based Microcontroller | Quad Flat Packages | LPC5516JBD100Y |
3
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LPC55S28JEV98
NXP
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1 | 32-bit Arm Cortex®-M33, CASPER, 256 KB SRAM; 512 KB flash, USB HS, Flexcomm Interface, SDIO, 32-bit counter/ timers, SCTimer/PWM, PLU, 16-bit 1.0 Msamples/sec ADC, Comparator, Temperature Sensor, AES, PUF, SHA, CRC, RNG | BGA | LPC55S28JEV98 |
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LPC5502JBD64E
NXP
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1 | plastic thermal enhanced thin quad flat package; 64 leads; 0.5 mm pitch, 10 mm x 10 mm x 1 mm body | Quad Flat Packages | LPC5502JBD64E |
3
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LPC55S36JHI48
NXP
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1 | HVQFN48: plastic thermal enhanced very thin quad flat package; no leads; | Quad Flat No-Lead | LPC55S36JHI48 |
3
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1 | MCU 32-bit ARM Cortex M4 RISC 512KB Flash 3.3V 208-Pin LQFP Tray | Quad Flat Packages | LPC54606J512BD208E |
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