SMB59 Model Download Search Results
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1SMB5927B-13
Diodes Incorporated
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1 | Zener Diodes 3.0W SM POWER ZENER 6.2V 39V 200mA 1.2 | Diodes Moulded | 1SMB5927B-13 |
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SZ1SMB5919BT3G
onsemi
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1 | Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi | Diodes Moulded | SZ1SMB5919BT3G |
3
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1SMB5942
PANJIT
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1 | Zener Diodes - 1SMB5942 , 1500mW, 5V, 5147, SMB | Diodes Moulded | 1SMB5942 |
3
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1SMB5915BT3G
onsemi
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1 | Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi | Diodes Moulded | 1SMB5915BT3G |
3
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SZ1SMB5922BT3G
onsemi
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1 | Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi | Diodes Moulded | SZ1SMB5922BT3G |
3
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1SMB5920BT3G
onsemi
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1 | Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi | Diodes Moulded | 1SMB5920BT3G |
3
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1SMB5928BT3G
onsemi
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1 | Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi | Diodes Moulded | 1SMB5928BT3G |
3
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SZ1SMB5936BT3G
onsemi
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1 | Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi | Diodes Moulded | SZ1SMB5936BT3G |
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1SMB5932-AU
PANJIT
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1 | Zener Diodes - 1SMB5932-AU , AEC-Q101, 1500mW, 5V, 2018, SMB | Diodes Moulded | 1SMB5932-AU |
3
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1SMB5951BT3G
onsemi
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1 | Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi | Diodes Moulded | 1SMB5951BT3G |
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SZ1SMB5937BT3G
onsemi
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1 | Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi | Diodes Moulded | SZ1SMB5937BT3G |
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SZ1SMB5947BT3G
onsemi
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1 | Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi | Diodes Moulded | SZ1SMB5947BT3G |
3
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SZ1SMB5956BT3G
onsemi
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1 | Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi | Other | SZ1SMB5956BT3G |
3
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SZ1SMB5917BT3G
onsemi
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1 | Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi | Diodes Moulded | SZ1SMB5917BT3G |
3
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1SMB5925-AU
PANJIT
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1 | Zener Diodes - 1SMB5925-AU , AEC-Q101, 1500mW, 5V, 109.1, SMB | Diodes Moulded | 1SMB5925-AU |
3
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1SMB5927-AU
PANJIT
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1 | Zener Diodes - 1SMB5927-AU , AEC-Q101, 1500mW, 5V, 1211, SMB | Diodes Moulded | 1SMB5927-AU |
3
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1SMB5934-AU
PANJIT
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1 | Zener Diodes - 1SMB5934-AU , AEC-Q101, 1500mW, 5V, 2422, SMB | Diodes Moulded | 1SMB5934-AU |
3
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1SMB5935-AU
PANJIT
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1 | Zener Diodes - 1SMB5935-AU , AEC-Q101, 1500mW, 5V, 2724, SMB | Diodes Moulded | 1SMB5935-AU |
3
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1SMB5924B-13
Diodes Incorporated
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1 | Diodes Inc 1SMB5924B-13 Zener Diode, 9.1V 5% 3 W SMT 2-Pin SMB | Diodes Moulded | 1SMB5924B-13 |
3
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1SMB5929B-13
Diodes Incorporated
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1 | ESD Suppressors / TVS Diodes 3.0W SM POWER ZENER 15V 5% SMB | Diodes Moulded | 1SMB5929B-13 |
3
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1SMB5942B-13
Diodes Incorporated
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1 | Zener Diodes 3.0 PWR Zener Diode 48.45 to 53 1.1kOhm | Diodes Moulded | 1SMB5942B-13 |
3
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1SMB5950 R4
Taiwan Semiconductor
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1 | Zener Diodes DO-214AA (SMB), 3000mW, 5%, Zener Diode | Diodes Moulded | 1SMB5950 R4 |
3
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1SMB5938BT3G
onsemi
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1 | Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi | Diodes Moulded | 1SMB5938BT3G |
3
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SZ1SMB5928BT3G
onsemi
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1 | Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi | Diodes Moulded | SZ1SMB5928BT3G |
3
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1SMB5939-AU
PANJIT
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1 | Zener Diodes - 1SMB5939-AU , AEC-Q101, 1500mW, 5V, 3936, SMB | Diodes Moulded | 1SMB5939-AU |
3
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![Part Image](["https://componentsearchengine.com/Images/9/1SMB5927B-13.jpg",null,null])
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![Part Image](["https://www.panjit.com.tw/upload/2023_04_1319/20230413155934rj041dbQI1.jpg","https://www.panjit.com.tw/upload/2023_04_1319/20230413155934rj041dbQI1.jpg",null])
![Part Image](["https://componentsearchengine.com/Images/9/SZ1SMB5947BT3G.jpg",null,null])
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