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SZ1SMB5937BT3G
onsemi
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1 | Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi | Diodes Moulded | SZ1SMB5937BT3G |
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SZ1SMB5936BT3G
onsemi
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1 | Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi | Diodes Moulded | SZ1SMB5936BT3G |
3
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1SMB5928BT3G
onsemi
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1 | Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi | Diodes Moulded | 1SMB5928BT3G |
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TPSMB5.0CA-EVR
LITTELFUSE
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1 | TVS Diode, Surface Mount ? 600 W, Bi-directional, DO-214AA | Other | TPSMB5.0CA-EVR |
3
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1SMB5951BT3G
onsemi
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1 | Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi | Diodes Moulded | 1SMB5951BT3G |
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SZ1SMB5956BT3G
onsemi
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1 | Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi | Other | SZ1SMB5956BT3G |
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TPSMB550A-A
LITTELFUSE
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1 | LITTELFUSE - TPSMB550A-A - TVS DIODE, AEC-Q101, 600W, 468V, DO214AA | Other | TPSMB550A-A |
3
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TPSMB58CA-EVR
LITTELFUSE
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1 | TVS Diode, Surface Mount ? 600 W, Bi-directional, DO-214AA | Other | TPSMB58CA-EVR |
3
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SZ1SMB5917BT3G
onsemi
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1 | Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi | Diodes Moulded | SZ1SMB5917BT3G |
3
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TPSMB51A
LITTELFUSE
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1 | Automotive, Surface Mount 600 W in DO-214AA, Uni-Directional | Other | TPSMB51A |
3
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P6SMB510CA
Bourns
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1 | ESD Protection Diodes / TVS Diodes 510V 600W BiDir | Diodes Moulded Non Polarised | P6SMB510CA |
3
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1SMB5918-W
Rectron
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1 | Zener Diodes SMB,3000mW,Zener,5.1V,5% | Diodes Moulded | 1SMB5918-W |
3
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1PGSMB5935R5G
Taiwan Semiconductor
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1 | Zener Diodes DO-214AA (SMB) 3000m W 5% Zener Diode | Diodes Moulded | 1PGSMB5935R5G |
3
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P6SMB56AT3G
onsemi
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1 | 600 Watt Peak Power Zener Transient Voltage Suppressors | Diodes Moulded | P6SMB56AT3G |
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P6SMB51CAT3G
onsemi
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1 | 600 Watt Peak Power Zener Transient Voltage Suppressors | Diodes Moulded | P6SMB51CAT3G |
3
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SZ1SMB5931BT3G-VF01
onsemi
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1 | Zener Voltage Range − 3.3 V to 200 V• ESD Rating of Class 3 (> 16 kV) per Human Body Model• Flat Handling Surface for Accurate Placement• Package Design for Top Side or Bottom Circuit Board Mounting• AEC−Q101 Qualified and PPAP Capable − SZ1SMB59xxT3G• SZ Prefix for Automotive and Other Applications Requiring UniqueSite and Control Change Requirements• These are Pb−Free Devices* | Diodes Moulded | SZ1SMB5931BT3G-VF01 |
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1PGSMB5927
Taiwan Semiconductor
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1 | Zener Diode 12 V 3 W ±5% Surface Mount DO-214AA (SMB) 1 µA @ 9.1 V,-55°C ~ 175°C (TJ) | Diodes Moulded | 1PGSMB5927 |
3
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1SMB5930BT3G
onsemi
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1 | Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi | Diodes Moulded | 1SMB5930BT3G |
3
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1SMB5939BT3G
onsemi
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1 | Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi | Diodes Moulded | 1SMB5939BT3G |
3
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1SMB5931BT3G
onsemi
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1 | Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi | Diodes Moulded | 1SMB5931BT3G |
3
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SZ1SMB5944BT3G
onsemi
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1 | Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi | Diodes Moulded | SZ1SMB5944BT3G |
3
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Download Model | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SZ1SMB5945BT3G
onsemi
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1 | Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi | Diodes Moulded | SZ1SMB5945BT3G |
3
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1SMB5914BT3G
onsemi
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1 | Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi | Diodes Moulded | 1SMB5914BT3G |
3
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Download Model | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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P6SMB51CA-Q
Bourns
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1 | P6SMB-Q Transient Voltage Suppressor Diode Series, Bi-Directional | Diodes Moulded Non Polarised | P6SMB51CA-Q |
3
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Download Model | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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1SMB5944BT3G
onsemi
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1 | Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi | Diodes Moulded | 1SMB5944BT3G |
3
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