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CRCW0402309RFKED
Vishay
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1 | RESISTOR, 0402 309 Ohms ±1% 0.063 W | Other | CRCW0402309RFKED |
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1623097-1
TE Connectivity
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1 | 10K Ω, Thick Film, General Purpose Resistor, 1 %, 2 Termination, 0805, Taped & Reeled, .125 W, ±100 ppm/°C, Solder, 2 x 1.25 x .55 mm, Neohm CRG | Resistor Chip | 1623097-1 |
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2309567-1
TE Connectivity
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1 | SAS, Receptacle, Board-to-Board, 68 Position, 2 Row, Right Angle, Surface Mount, Signal, 0 – 55 °C [0 – 131 °F] | Other | 2309567-1 |
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2309412-1
TE Connectivity
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1 | Body Features: Ejector Type Locking | Module Key Type Offset Right | Ejector Location Both Ends | Retention Post Material Stainless Steel | Retention Post Location Both Ends | Latch Material High Temperature Thermoplastic | Connector Profile High | Configuration Features: Number of Positions 260 | Number of Keys 1 | Module Orientation Right Angle | Number of Rows 2 | Contact Features: Contact Underplating Material Nickel | Contact Mating Area Plating Material Gold Flash | Contact Base Material Copper Alloy | Other | 2309412-1 |
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2309410-1
TE Connectivity
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1 | Body Features: Connector Profile Low | Retention Post Location Both Ends | Retention Post Material Copper Alloy | Ejector Location Both Ends | Latch Material High Temperature Thermoplastic | Ejector Type Locking | Configuration Features: Number of Positions 260 | Number of Positions 200 | Number of Rows 2 | Module Orientation Right Angle | Number of Keys 1 | Contact Features: Contact Base Material Copper Alloy | Contact Underplating Material Nickel | PCB Contact Termination Area Plating Material Gold Flash | Other | 2309410-1 |
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2309414-1
TE Connectivity
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1 | Body Features: Latch Material High Temperature Thermoplastic | Ejector Location Both Ends | Connector Profile High | Ejector Type Locking | Retention Post Material Stainless Steel | Retention Post Location Both Ends | Module Key Type Offset Right | Configuration Features: Number of Positions 260 | Number of Rows 2 | Module Orientation Right Angle | Number of Keys 1 | Contact Features: Memory Socket Type Memory Card | Contact Base Material Copper Alloy | PCB Contact Termination Area Plating Material Gold Fla | Other | 2309414-1 |
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2309413-4
TE Connectivity
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1 | Body Features: Module Key Type Offset Left | Ejector Location Both Ends | Ejector Type Locking | Retention Post Location Both Ends | Retention Post Material Stainless Steel | Connector Profile High | Latch Material High Temperature Thermoplastic | Configuration Features: Number of Positions 260 | Module Orientation Right Angle | Number of Keys 1 | Number of Rows 2 | Contact Features: Memory Socket Type Memory Card | Contact Underplating Material Nickel | Contact Mating Area Plating Material Gold | Contact C | Other | 2309413-4 |
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2309409-2
TE Connectivity
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1 | Body Features: Module Key Type Offset Left | Ejector Type Locking | Connector Profile Low | Retention Post Location Both Ends | Ejector Location Both Ends | Latch Material High Temperature Thermoplastic | Configuration Features: Number of Keys 1 | Module Orientation Right Angle | Number of Rows 2 | Number of Positions 260 | Contact Features: Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 5 MICIN | Memory Socket Type Memory Card | Contact Current Rating (Max) .5 AM | Other | 2309409-2 |
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2309410-3
TE Connectivity
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1 | Body Features: Ejector Location Both Ends | Connector Profile Low | Latch Material High Temperature Thermoplastic | Retention Post Location Both Ends | Ejector Type Locking | Retention Post Material Copper Alloy | Configuration Features: Number of Rows 2 | Module Orientation Right Angle | Number of Positions 200 | Number of Keys 1 | Number of Positions 260 | Contact Features: Memory Socket Type Memory Card | PCB Contact Termination Area Plating Material Gold Flash | Contact Current Rating (Max) .5 AMP | Con | Other | 2309410-3 |
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2309413-3
TE Connectivity
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1 | Body Features: Retention Post Location Both Ends | Retention Post Material Stainless Steel | Connector Profile High | Latch Material High Temperature Thermoplastic | Ejector Type Locking | Ejector Location Both Ends | Module Key Type Offset Left | Configuration Features: Number of Positions 260 | Module Orientation Right Angle | Number of Rows 2 | Number of Keys 1 | Contact Features: Contact Underplating Material Nickel | Contact Mating Area Plating Material Thickness 10 MICIN | Contact Current Rating (Max) | Other | 2309413-3 |
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2309409-5
TE Connectivity
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1 | Body Features: Latch Material High Temperature Thermoplastic | Retention Post Location Both Ends | Ejector Type Locking | Ejector Location Both Ends | Module Key Type Offset Left | Connector Profile Low | Configuration Features: Number of Positions 260 | Number of Keys 1 | Number of Rows 2 | Module Orientation Right Angle | Contact Features: Contact Base Material Copper Alloy | Memory Socket Type Memory Card | Contact Mating Area Plating Material Thickness 30 MICIN | PCB Contact Termination Area Plating Mat | Other | 2309409-5 |
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2309408-1
TE Connectivity
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1 | Body Features: Latch Material High Temperature Thermoplastic | Connector Profile Low | Ejector Type Locking | Retention Post Location Both Ends | Ejector Location Both Ends | Configuration Features: Number of Rows 2 | Number of Keys 1 | Module Orientation Right Angle | Number of Positions 260 | Contact Features: Memory Socket Type Memory Card | PCB Contact Termination Area Plating Material Gold Flash | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Gold Flash | Contact Current Rat | Other | 2309408-1 |
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2309411-1
TE Connectivity
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1 | Body Features: Latch Material High Temperature Thermoplastic | Ejector Location Both Ends | Retention Post Material Stainless Steel | Ejector Type Locking | Connector Profile High | Retention Post Location Both Ends | Module Key Type Offset Left | Configuration Features: Module Orientation Right Angle | Number of Positions 260 | Number of Rows 2 | Number of Keys 1 | Contact Features: Contact Mating Area Plating Material Gold Flash | PCB Contact Termination Area Plating Material Gold Flash | Contact Underpla | Other | 2309411-1 |
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2309407-2
TE Connectivity
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1 | Body Features: Latch Material High Temperature Thermoplastic | Ejector Type Locking | Ejector Location Both Ends | Module Key Type Offset Left | Retention Post Location Both Ends | Connector Profile Low | Configuration Features: Number of Keys 1 | Module Orientation Right Angle | Number of Positions 260 | Number of Rows 2 | Contact Features: Contact Mating Area Plating Material Thickness .127 MICM | Memory Socket Type Memory Card | Contact Current Rating (Max) .5 AMP | Contact Base Material Copper Alloy | C | Other | 2309407-2 |
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2309413-1
TE Connectivity
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1 | Body Features: Module Key Type Offset Left | Ejector Location Both Ends | Retention Post Location Both Ends | Ejector Type Locking | Retention Post Material Stainless Steel | Latch Material High Temperature Thermoplastic | Connector Profile High | Configuration Features: Number of Keys 1 | Number of Rows 2 | Number of Positions 260 | Module Orientation Right Angle | Contact Features: Contact Underplating Material Nickel | Contact Mating Area Plating Material Gold Flash | Contact Base Material Copper Alloy | | Other | 2309413-1 |
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CRCW0402309RFKTD
Vishay
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1 | Thick Film Resistors - SMD 1/16watt 309ohms 1% | Other | CRCW0402309RFKTD |
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CRCW0402309KFKEDHP
Vishay
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1 | Standard Thick Film Chip Resistors value 309K ohm. | Resistor Chip | CRCW0402309KFKEDHP |
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TLP2309(TPL,E
Toshiba
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1 | Photocoupler (Photo-IC output) 3.3V/5V supply voltage / High temperature 110 degC operatio | Small Outline Packages | TLP2309(TPL,E |
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AD230-9-TO52-S1
First Sensor
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1 | Photodiodes AD230-9-TO52-S1 200-240V | Other | AD230-9-TO52-S1 |
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V23092-A1024-A802
TE Connectivity
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1 | General Purpose Relays Slimline PCB Relay SNR | Other | V23092-A1024-A802 |
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CY2309ZXC-1HT
Infineon
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1 | Zero Delay Buffer | Small Outline Packages | CY2309ZXC-1HT |
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MIC23099YFT-T5
Microchip
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1 | Power Management Specialized - PMIC Single Cell Boost | Quad Flat No-Lead | MIC23099YFT-T5 |
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MAL223091007E3
Vishay
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1 | Polarized energy storage capacitor with highcapacity and energy density• Rated voltage: 3.0 V• Available in through-hole (radial) version• Useful life: up to 2000 h at 85 °C• Rapid charge and discharge• Maintenance-free, no service necessary• Material categorization: for definitions of complianceplease see www.vishay.com/doc?99912 | Capacitor, Polarized Radial Diameter | MAL223091007E3 |
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LTC2309IUF#PBF
Analog Devices
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1 | ADC 12-bit SAR Serial QFN24 EP Linear Technology LTC2309IUF#PBF, 12 bit Serial ADC, Differential Input, 10-Pin DFN | Quad Flat No-Lead | LTC2309IUF#PBF |
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292230-9
TE Connectivity
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1 | TE Connectivity 292230, 1.5mm Pitch, 9 Way, 1 Row, Vertical PCB Header, Surface Mount | Other | 292230-9 |
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