23094 Model Download Search Results
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2309407-2
TE Connectivity
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1 | Body Features: Latch Material High Temperature Thermoplastic | Ejector Type Locking | Ejector Location Both Ends | Module Key Type Offset Left | Retention Post Location Both Ends | Connector Profile Low | Configuration Features: Number of Keys 1 | Module Orientation Right Angle | Number of Positions 260 | Number of Rows 2 | Contact Features: Contact Mating Area Plating Material Thickness .127 MICM | Memory Socket Type Memory Card | Contact Current Rating (Max) .5 AMP | Contact Base Material Copper Alloy | C | Other | 2309407-2 |
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2309411-1
TE Connectivity
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1 | Body Features: Latch Material High Temperature Thermoplastic | Ejector Location Both Ends | Retention Post Material Stainless Steel | Ejector Type Locking | Connector Profile High | Retention Post Location Both Ends | Module Key Type Offset Left | Configuration Features: Module Orientation Right Angle | Number of Positions 260 | Number of Rows 2 | Number of Keys 1 | Contact Features: Contact Mating Area Plating Material Gold Flash | PCB Contact Termination Area Plating Material Gold Flash | Contact Underpla | Other | 2309411-1 |
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2309413-1
TE Connectivity
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1 | Body Features: Module Key Type Offset Left | Ejector Location Both Ends | Retention Post Location Both Ends | Ejector Type Locking | Retention Post Material Stainless Steel | Latch Material High Temperature Thermoplastic | Connector Profile High | Configuration Features: Number of Keys 1 | Number of Rows 2 | Number of Positions 260 | Module Orientation Right Angle | Contact Features: Contact Underplating Material Nickel | Contact Mating Area Plating Material Gold Flash | Contact Base Material Copper Alloy | | Other | 2309413-1 |
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2309407-1
TE Connectivity
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1 | Small Outline (SO), Stack Height 4 mm [.157 in], Right Angle Module Orientation, 260 Position, DDR4 DIMM, SO DIMM Sockets | Other | 2309407-1 |
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2309409-5
TE Connectivity
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1 | Body Features: Latch Material High Temperature Thermoplastic | Retention Post Location Both Ends | Ejector Type Locking | Ejector Location Both Ends | Module Key Type Offset Left | Connector Profile Low | Configuration Features: Number of Positions 260 | Number of Keys 1 | Number of Rows 2 | Module Orientation Right Angle | Contact Features: Contact Base Material Copper Alloy | Memory Socket Type Memory Card | Contact Mating Area Plating Material Thickness 30 MICIN | PCB Contact Termination Area Plating Mat | Other | 2309409-5 |
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2309413-3
TE Connectivity
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1 | Body Features: Retention Post Location Both Ends | Retention Post Material Stainless Steel | Connector Profile High | Latch Material High Temperature Thermoplastic | Ejector Type Locking | Ejector Location Both Ends | Module Key Type Offset Left | Configuration Features: Number of Positions 260 | Module Orientation Right Angle | Number of Rows 2 | Number of Keys 1 | Contact Features: Contact Underplating Material Nickel | Contact Mating Area Plating Material Thickness 10 MICIN | Contact Current Rating (Max) | Other | 2309413-3 |
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2309410-3
TE Connectivity
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1 | Body Features: Ejector Location Both Ends | Connector Profile Low | Latch Material High Temperature Thermoplastic | Retention Post Location Both Ends | Ejector Type Locking | Retention Post Material Copper Alloy | Configuration Features: Number of Rows 2 | Module Orientation Right Angle | Number of Positions 200 | Number of Keys 1 | Number of Positions 260 | Contact Features: Memory Socket Type Memory Card | PCB Contact Termination Area Plating Material Gold Flash | Contact Current Rating (Max) .5 AMP | Con | Other | 2309410-3 |
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2309414-1
TE Connectivity
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1 | Body Features: Latch Material High Temperature Thermoplastic | Ejector Location Both Ends | Connector Profile High | Ejector Type Locking | Retention Post Material Stainless Steel | Retention Post Location Both Ends | Module Key Type Offset Right | Configuration Features: Number of Positions 260 | Number of Rows 2 | Module Orientation Right Angle | Number of Keys 1 | Contact Features: Memory Socket Type Memory Card | Contact Base Material Copper Alloy | PCB Contact Termination Area Plating Material Gold Fla | Other | 2309414-1 |
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2309409-1
TE Connectivity
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1 | Small Outline (SO), Stack Height 5.2 mm [.205 in], Right Angle Module Orientation, 260 Position, DDR4 DIMM, SO DIMM Sockets | Other | 2309409-1 |
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2309413-4
TE Connectivity
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1 | Body Features: Module Key Type Offset Left | Ejector Location Both Ends | Ejector Type Locking | Retention Post Location Both Ends | Retention Post Material Stainless Steel | Connector Profile High | Latch Material High Temperature Thermoplastic | Configuration Features: Number of Positions 260 | Module Orientation Right Angle | Number of Keys 1 | Number of Rows 2 | Contact Features: Memory Socket Type Memory Card | Contact Underplating Material Nickel | Contact Mating Area Plating Material Gold | Contact C | Other | 2309413-4 |
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2309407-3
TE Connectivity
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1 | Small Outline (SO), 4 mm [.157 in] Stack Height, Right Angle Module Orientation, 260 Position, .5 mm [.02 in] Centerline, DDR4 DIMM, SO DIMM Sockets | Other | 2309407-3 |
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2309408-1
TE Connectivity
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1 | Body Features: Latch Material High Temperature Thermoplastic | Connector Profile Low | Ejector Type Locking | Retention Post Location Both Ends | Ejector Location Both Ends | Configuration Features: Number of Rows 2 | Number of Keys 1 | Module Orientation Right Angle | Number of Positions 260 | Contact Features: Memory Socket Type Memory Card | PCB Contact Termination Area Plating Material Gold Flash | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Gold Flash | Contact Current Rat | Other | 2309408-1 |
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2309412-1
TE Connectivity
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1 | Body Features: Ejector Type Locking | Module Key Type Offset Right | Ejector Location Both Ends | Retention Post Material Stainless Steel | Retention Post Location Both Ends | Latch Material High Temperature Thermoplastic | Connector Profile High | Configuration Features: Number of Positions 260 | Number of Keys 1 | Module Orientation Right Angle | Number of Rows 2 | Contact Features: Contact Underplating Material Nickel | Contact Mating Area Plating Material Gold Flash | Contact Base Material Copper Alloy | Other | 2309412-1 |
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2309409-2
TE Connectivity
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1 | Body Features: Module Key Type Offset Left | Ejector Type Locking | Connector Profile Low | Retention Post Location Both Ends | Ejector Location Both Ends | Latch Material High Temperature Thermoplastic | Configuration Features: Number of Keys 1 | Module Orientation Right Angle | Number of Rows 2 | Number of Positions 260 | Contact Features: Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 5 MICIN | Memory Socket Type Memory Card | Contact Current Rating (Max) .5 AM | Other | 2309409-2 |
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2309409-3
TE Connectivity
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1 | Small Outline (SO), 5.2 mm [.205 in] Stack Height, Right Angle Module Orientation, 260 Position, .5 mm [.02 in] Centerline, DDR4 DIMM, SO DIMM Sockets | Other | 2309409-3 |
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2309410-1
TE Connectivity
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1 | Body Features: Connector Profile Low | Retention Post Location Both Ends | Retention Post Material Copper Alloy | Ejector Location Both Ends | Latch Material High Temperature Thermoplastic | Ejector Type Locking | Configuration Features: Number of Positions 260 | Number of Positions 200 | Number of Rows 2 | Module Orientation Right Angle | Number of Keys 1 | Contact Features: Contact Base Material Copper Alloy | Contact Underplating Material Nickel | PCB Contact Termination Area Plating Material Gold Flash | Other | 2309410-1 |
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2309414-4
TE Connectivity
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1 | DIMM Connectors DDR4 SODIMM 260P 9.2H RVS | Other | 2309414-4 |
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1823094
Phoenix Contact
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1 | SPT-THR 1,5/ 3-H-5,08 P26 - Printed circuit board terminal, nominal current: 17.5 A, rated voltage (III/2): 320 V, nominal cross section: 1.5 mm2, number of potentials: 3, number of rows: 1, number of positions per row: 3, product range: SPT 1,5/..-H-THR, pitch: 5.08 mm, connection method: Push-in spring connection, mounting: THR soldering / wave soldering, conductor/PCB connection direction: 0 °, color: black, Pin layout: Linear pinning, Solder pin [P]: 2.6 mm, number of solder pins per potentia | Other | 1823094 |
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1623094-1
TE Connectivity
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1 | TE CONNECTIVITY / NEOHM - 1623094-1 - CRG0603 ZEROHM | Resistor Chip | 1623094-1 |
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2309411-4
TE Connectivity
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1 | Body Features: Ejector Location Both Ends | Ejector Type Locking | Retention Post Location Both Ends | Retention Post Material Stainless Steel | Connector Profile High | Latch Material High Temperature Thermoplastic | Module Key Type Offset Left | Configuration Features: Number of Positions 260 | Number of Rows 2 | Number of Keys 1 | Module Orientation Right Angle | Contact Features: Contact Mating Area Plating Material Thickness .381 MICM | Contact Current Rating (Max) .5 AMP | Contact Underplating Materia | 2309411-4 |
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2309412-3
TE Connectivity
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1 | Body Features: Retention Post Location Both Ends | Ejector Location Both Ends | Latch Material High Temperature Thermoplastic | Connector Profile High | Module Key Type Offset Right | Ejector Type Locking | Retention Post Material Stainless Steel | Configuration Features: Number of Keys 1 | Number of Rows 2 | Number of Positions 260 | Module Orientation Right Angle | Contact Features: Contact Underplating Material Nickel | PCB Contact Termination Area Plating Material Gold Flash | Contact Mating Area Platin | 2309412-3 |
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2309414-2
TE Connectivity
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1 | Body Features: Retention Post Material Stainless Steel | Latch Material High Temperature Thermoplastic | Connector Profile High | Ejector Location Both Ends | Module Key Type Offset Right | Retention Post Location Both Ends | Ejector Type Locking | Configuration Features: Number of Positions 260 | Number of Keys 1 | Number of Rows 2 | Module Orientation Right Angle | Contact Features: Memory Socket Type Memory Card | Contact Underplating Material Nickel | Contact Mating Area Plating Material Thickness 5 MIC | 2309414-2 |
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2309413-5
TE Connectivity
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1 | Body Features: Module Key Type Offset Left | Ejector Type Locking | Retention Post Material Stainless Steel | Connector Profile High | Ejector Location Both Ends | Retention Post Location Both Ends | Latch Material High Temperature Thermoplastic | Configuration Features: Number of Positions 260 | Module Orientation Right Angle | Number of Keys 1 | Number of Rows 2 | Contact Features: Contact Base Material Copper Alloy | Contact Mating Area Plating Material Thickness 30 MICIN | PCB Contact Termination Area P | 2309413-5 |
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2309412-4
TE Connectivity
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1 | Body Features: Module Key Type Offset Right | Retention Post Material Stainless Steel | Ejector Location Both Ends | Retention Post Location Both Ends | Ejector Type Locking | Latch Material High Temperature Thermoplastic | Connector Profile High | Configuration Features: Number of Positions 260 | Module Orientation Right Angle | Number of Keys 1 | Number of Rows 2 | Contact Features: Contact Mating Area Plating Material Gold | Contact Current Rating (Max) .5 AMP | Contact Base Material Copper Alloy | Conta | 2309412-4 |
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2309408-5
TE Connectivity
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1 | Body Features: Latch Material High Temperature Thermoplastic | Ejector Location Both Ends | Connector Profile Low | Ejector Type Locking | Retention Post Location Both Ends | Configuration Features: Module Orientation Right Angle | Number of Positions 260 | Number of Keys 1 | Number of Rows 2 | Contact Features: PCB Contact Termination Area Plating Material Gold Flash | Memory Socket Type Memory Card | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Cont | 2309408-5 |
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![Part Image](["https://www.te.com/content/dam/te-com/catalog/part/002/309/407/2309407-t1.jpg/jcr:content/renditions/product-details.png","https://www.te.com/content/dam/te-com/catalog/part/002/309/407/2309407-t1.jpg/jcr:content/renditions/product-details.png",null])
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