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5747834-6
TE Connectivity
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1 | Body Features: Insert Material Zinc | Connector Profile Standard | Mating Retention Feature Material Zinc | Assembly Process Feature Material Copper Alloy | Primary Product Color Black | Shell Plating Material Tin | Configuration Features: Number of Rows 2 | Number of Positions 25 | PCB Mount Orientation Right Angle | Contact Features: Contact Mating Area Plating Material Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating (Max) 6 AMP | Contact | Other | 5747834-6 |
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5747833-6
TE Connectivity
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1 | Body Features: Insert Material Zinc | Mating Feature Plating Material Clear Chromate | Primary Product Color Black | Assembly Process Feature Material Copper Alloy | Shell Plating Material Tin | Mating Feature Material Zinc | Connector Profile Standard | Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 2 | Number of Positions 15 | Contact Features: Contact Underplating Material Nickel | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | Contact Shape & Form Rou | Other | 5747833-6 |
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5747835-4
TE Connectivity
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1 | Body Features: Primary Product Color Black | Insert Material Zinc | Connector Profile Standard | Shell Plating Material Tin | Mating Retention Feature Material Zinc | Assembly Process Feature Material Copper Alloy | Configuration Features: PCB Mount Orientation Right Angle | Number of Positions 37 | Number of Rows 2 | Contact Features: Contact Base Material Brass | Contact Current Rating (Max) 6 AMP | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | PCB Contact Termination Area Platin | Other | 5747835-4 |
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NLAS4783MN1R2G
onsemi
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1 | Analog Switch ICs Triple SPDT Hi Speed 1ohm Sw. Ind. Temp | Quad Flat No-Lead | NLAS4783MN1R2G |
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MAX14783EATA+T
Analog Devices
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1 | MAXIM INTEGRATED PRODUCTS - MAX14783EATA+T - Transceiver, RS422, RS485, Half Duplex, 42Mbp, 1 Driver, 3 V to 5.5 V Supply, TDFN-8 | Small Outline No-lead | MAX14783EATA+T |
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MAL214274783E3
Vishay
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1 | Aluminum Electrolytic Capacitors - Radial Leaded 4,7 F 250V 8x12mm 105 C 2500h | Capacitor, Polarized Radial Diameter | MAL214274783E3 |
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MAX4783ETE+
Analog Devices
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1 | MAXIM INTEGRATED PRODUCTS - MAX4783ETE+ - ANALOGUE SWITCH, TRIPLE, TQFN-16 | Quad Flat No-Lead | MAX4783ETE+ |
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NLAS4783BMN1R2G
onsemi
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1 | ON SEMICONDUCTOR - NLAS4783BMN1R2G - Analogue Switch, 3 Channels, SPDT, 1.2 ohm, 1.65V to 4.5V, QFN, 16 Pins | Quad Flat No-Lead | NLAS4783BMN1R2G |
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MAX14783EAUA+
Analog Devices
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1 | RS-422/RS-485 Interface IC High-Spd 3.3V/5V w/ 35kV HBM ESD Protect | Small Outline Packages | MAX14783EAUA+ |
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MAX14783EGUA+
Analog Devices
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1 | High-Speed 3.3V/5V RS-485 Transceiver with ?35kV HBM ESD Protection | Small Outline Packages | MAX14783EGUA+ |
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MAX14783EEUA+
Analog Devices
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1 | RS-422/RS-485 Interface IC Half duplex, dual voltage (3V to 5.5V), high ESD HBM (+/-35kV), high speed (30Mbps), industrial temp ra | Small Outline Packages | MAX14783EEUA+ |
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MAX14783EEUA+T
Analog Devices
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1 | -40°C to +125°C | Small Outline Packages | MAX14783EEUA+T |
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MAX14783EAUA+T
Analog Devices
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1 | High-Speed 3.3V/5V RS-485 Transceiver with ?35kV HBM ESD Protection | Small Outline Packages | MAX14783EAUA+T |
3
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1944783
Phoenix Contact
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1 | MSTBA 2,5/ 2-G-RN - PCB headers, nominal cross section: 2.5 mm2, color: green, nominal current: 12 A, rated voltage (III/2): 320 V, contact surface: Sn, contact connection type: Pin, number of potentials: 2, number of rows: 1, number of positions: 2, number of connections: 2, product range: MSTBA 2,5/..-G-RN, pitch: 5 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 3.23 mm, number of solder pins per potential: 1, plug-in system: COMBICON MSTB 2,5, Pin connector pattern a | Other | 1944783 |
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MSP430F4783IPZ
Texas Instruments
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1 | Texas Instruments MSP430F4783IPZ, 16bit MSP430 Microcontroller, 16MHz, 48 kB Flash, 100-Pin LQFP | Quad Flat Packages | MSP430F4783IPZ |
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MAX14783EATA+
Analog Devices
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1 | RS-422/RS-485 Interface IC High-Speed 3.3V/5V RS-485/RS-422 Transceiver with +/-35kV HBM ESD Protection | Small Outline No-lead | MAX14783EATA+ |
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5747836-6
TE Connectivity
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1 | Body Features: Connector Profile Standard | Primary Product Color Black | Mating Feature Material Zinc | Mating Feature Plating Material Clear Chromate | Assembly Process Feature Material Copper Alloy | Insert Material Zinc | Shell Plating Material Tin | Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 2 | Number of Positions 9 | Contact Features: Contact Shape & Form Round | Contact Base Material Phosphor Bronze | Contact Mating Area Plating Material Gold | PCB Contact Termination | Other | 5747836-6 |
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MAX14783EASA+
Analog Devices
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1 | MAXIM INTEGRATED PRODUCTS - MAX14783EASA+ - RS422/RS485 TXRX, 42MBPS, 5.5V, NSOIC-8 | Small Outline Packages | MAX14783EASA+ |
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MSP430F4783IPZR
Texas Instruments
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1 | 16-Bit Ultra-Low-Power Microcontroller, 48KB Flash, 2KB RAM, 3 Sigma-Delta ADCs, LCD Driver | Quad Flat Packages | MSP430F4783IPZR |
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MAX14783EGUA+T
Analog Devices
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1 | RS-422/RS-485 Interface IC Half duplex, dual voltage (3V to 5.5V), high ESD HBM (+/-35kV), high speed (42Mbps), high temperature ( | Small Outline Packages | MAX14783EGUA+T |
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1847835
Phoenix Contact
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1 | MCDV 1,5/12-G1-3,81 - PCB headers, nominal cross section: 1.5 mm2, color: green, nominal current: 8 A, rated voltage (III/2): 160 V, contact surface: Sn, contact connection type: Pin, number of potentials: 24, number of rows: 2, number of positions: 12, number of connections: 24, product range: MCDV 1,5/..-G1, pitch: 3.81 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 3.4 mm, number of solder pins per potential: 1, plug-in system: COMBICON MC 1,5, Pin connector pattern | Other | 1847835 |
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5747833-4
TE Connectivity
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1 | Body Features: Connector Profile Standard | Assembly Process Feature Material Copper Alloy | Primary Product Color Black | Insert Material Zinc | Mating Retention Feature Material Zinc | Shell Plating Material Tin | Configuration Features: Number of Rows 2 | Number of Positions 15 | PCB Mount Orientation Right Angle | Contact Features: Contact Underplating Material Nickel | Contact Shape & Form Round | Contact Base Material Brass | Contact Underplating Material Palladium Nickel | PCB Contact Termination Are | Other | 5747833-4 |
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5747832-4
TE Connectivity
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1 | Body Features: Primary Product Color Black | Assembly Process Feature Material Copper Alloy | Insert Material Zinc | Connector Profile Standard | Shell Plating Material Tin | Mating Retention Feature Material Zinc | Configuration Features: Number of Positions 9 | PCB Mount Orientation Right Angle | Number of Rows 2 | Contact Features: Contact Shape & Form Round | PCB Contact Termination Area Plating Material Tin | Contact Base Material Brass | Contact Mating Area Plating Material Thickness 30 MICIN | Contac | Other | 5747832-4 |
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214783
TE Connectivity
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1 | 10-pin, 8-32 UNC, solder | Other | 214783 |
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MAX14783EESA+T
Analog Devices
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1 | RS-422/RS-485 Interface IC Half duplex, dual voltage (3V to 5.5V), high ESD HBM (+/-35kV), high speed (40Mbps), industrial temp range (-40C to +85C) | Small Outline Packages | MAX14783EESA+T |
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![Part Image](["https://www.te.com/content/dam/te-com/catalog/part/057/478/346/5747834-6-t1.jpg/jcr:content/renditions/product-details.png","https://www.te.com/content/dam/te-com/catalog/part/057/478/346/5747834-6-t1.jpg/jcr:content/renditions/product-details.png",null])
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