57471 Model Download Search Results
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| Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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5747150-7
TE Connectivity
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1 | Body Features: Shell Plating Material Tin | Mating Retention Feature Material Brass | Insert Material Brass | Primary Product Color Black | Connector Profile Standard | Configuration Features: Number of Rows 2 | PCB Mount Orientation Vertical | Number of Positions 9 | Contact Features: Contact Shape & Form Round | Contact Current Rating (Max) 6 AMP | Contact Mating Area Plating Material Gold Flash | Contact Underplating Material Nickel | PCB Contact Termination Area Plating Material Tin | Contact Base Mater | Other | 5747150-7 |
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5747140-2
TE Connectivity
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1 | Body Features: Primary Product Color Black | Connector Profile Standard | Shell Plating Material Tin | Configuration Features: Number of Positions 15 | Number of Rows 2 | PCB Mount Orientation Vertical | Contact Features: Contact Underplating Material Nickel | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Underplating Material Palladium Nickel | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Tin | Contact Base Material Copper Alloy | Dimensions: | Other | 5747140-2 |
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5747193-2
TE Connectivity
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1 | Body Features: Primary Product Color Black | Connector Profile High | Mating Feature Plating Material Zinc | Shell Plating Material Tin | Insert Material Thermoplastic | Mating Feature Material Steel | Configuration Features: PCB Mount Orientation Right Angle | Number of Positions 50 | Number of Rows 3 | Contact Features: Contact Shape & Form Square | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | Contact Mating Area Plating Materi | Other | 5747193-2 |
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5747150-8
TE Connectivity
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1 | Body Features: Mating Retention Feature Material Brass | Insert Material Brass | Shell Plating Material Tin | Connector Profile Standard | Primary Product Color Black | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 9 | Number of Rows 2 | Contact Features: Contact Base Material Phosphor Bronze | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 6 | Other | 5747150-8 |
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5747150-2
TE Connectivity
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1 | Body Features: Connector Profile Standard | Insert Material Brass | Primary Product Color Black | Shell Plating Material Tin | Configuration Features: PCB Mount Orientation Vertical | Number of Rows 2 | Number of Positions 9 | Contact Features: Contact Shape & Form Round | Contact Base Material Phosphor Bronze | Contact Current Rating (Max) 6 AMP | PCB Contact Termination Area Plating Material Tin | Contact Underplating Material Nickel | Contact Mating Area Plating Material Gold | Contact Mating Area Platin | Other | 5747150-2 |
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5747193-1
TE Connectivity
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1 | Body Features: Mating Feature Material Steel | Primary Product Color Black | Insert Material Thermoplastic | Connector Profile High | Mating Feature Plating Material Zinc | Shell Plating Material Tin | Configuration Features: Number of Positions 50 | PCB Mount Orientation Right Angle | Number of Rows 3 | Contact Features: Contact Shape & Form Square | Contact Mating Area Plating Material Gold Flash | Contact Base Material Phosphor Bronze | Contact Current Rating (Max) 6 AMP | Contact Underplating Material N | Other | 5747193-1 |
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5747190-2
TE Connectivity
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1 | Body Features: Connector Profile High | Primary Product Color Black | Insert Material Thermoplastic | Shell Plating Material Tin | Configuration Features: Number of Rows 2 | Number of Positions 9 | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | PCB Contact Termination Area Plating Material Tin | Contact Underplating Material Nickel | Contact Current Rating (Max) 6 AMP | Conta | Other | 5747190-2 |
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5747150-4
TE Connectivity
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1 | Receptacle, Board-to-Board, 9 Position, 2.74 mm [.108 in] Centerline, 2 Row, 1 Connector Shell Size, Round, AMPLIMITE HD-20, PCB D-Sub Connectors | Other | 5747150-4 |
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MAL225957471E3
Vishay
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1 | Aluminum Electrolytic Capacitors - Snap In 470uF 450V 20% 105C 3000H 35x45mm | Capacitor, Polarized Radial Diameter | MAL225957471E3 |
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1-5747150-3
TE Connectivity
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1 | PCB D-Sub Connectors, Receptacle, Board-to-Board, 9 Position, 2.74 mm [.108 in] Centerline, 2 Row, Size 1, Round, Standard Profile, AMPLIMITE HD-20 | Other | 1-5747150-3 |
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B57471V2333H062
TDK
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1 | Chip NTC Thermistors (Sensor), Resistance (at 25?C)=33k?, Resistance Tolerance (at 25?C)=?5% | Thermistors Chip | B57471V2333H062 |
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SKY85747-11
Skyworks
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1 | Skyworks 5 GHz High-Power WLAN LGA, 24-pin | Other | SKY85747-11 |
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B57471V2333J062
TDK
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1 | Chip NTC Thermistors (Sensor), Resistance (at 25?C)=33k?, Resistance Tolerance (at 25?C)=?3% | Thermistors Chip | B57471V2333J062 |
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MAL215957471E3
Vishay
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1 | Vishay 470μF ±20% 210mΩ 450 V dc Through Hole Snap-In Aluminium Electrolytic Capacitor | Other | MAL215957471E3 |
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B57471V2474H062
TDK
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1 | Chip NTC Thermistors (Sensor), Resistance (at 25?C)=470k?, Resistance Tolerance (at 25?C)=?5% | Thermistors Chip | B57471V2474H062 |
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B57471V2223H062
TDK
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1 | Chip NTC Thermistors (Sensor), Resistance (at 25?C)=22k?, Resistance Tolerance (at 25?C)=?5% | Thermistors Chip | B57471V2223H062 |
3
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B57471V2682J062
TDK
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1 | Chip NTC Thermistors (Sensor), Resistance (at 25?C)=6.8k?, Resistance Tolerance (at 25?C)=?3% | Thermistors Chip | B57471V2682J062 |
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B57471V2104J062
TDK
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1 | Chip NTC Thermistors (Sensor), Resistance (at 25?C)=100k?, Resistance Tolerance (at 25?C)=?3% | Thermistors Chip | B57471V2104J062 |
3
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Download Model | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MAL219357471E3
Vishay
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1 | 470 µF 450 V Aluminum Electrolytic Capacitors Radial, Can - Snap-In 180mOhm @ 100Hz 5000 Hrs , -40°C ~ 105°C | Other | MAL219357471E3 |
3
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B57471V2103J62
TDK
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1 | NTC (Negative Temperature Coefficient) Thermistors NEW MFG PN 871-B57471V2103J062 | Thermistors Chip | B57471V2103J62 |
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B57471V2472J062
TDK
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1 | Chip NTC Thermistors (Sensor), Resistance (at 25?C)=4.7k?, Resistance Tolerance (at 25?C)=?3% | Thermistors Chip | B57471V2472J062 |
3
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1-5747150-4
TE Connectivity
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1 | Receptacle, Board-to-Board, 9 Position, 2.74 mm [.108 in] Centerline, 2 Row, 1 Connector Shell Size, Round, AMPLIMITE HD-20, PCB D-Sub Connectors | Other | 1-5747150-4 |
3
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Download Model | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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B57471V2473J062
TDK
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1 | Chip NTC Thermistors (Sensor), Resistance (at 25?C)=47k?, Resistance Tolerance (at 25?C)=?3% | Thermistors Chip | B57471V2473J062 |
3
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Download Model | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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B57471V2103J062
TDK
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1 | Chip NTC Thermistors (Sensor), Resistance (at 25?C)=10k?, Resistance Tolerance (at 25?C)=?3% | Thermistors Chip | B57471V2103J062 |
3
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1-5747150-6
TE Connectivity
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1 | Receptacle, Board-to-Board, 9 Position, 2.74 mm [.108 in] Centerline, 2 Row, 1 Shell Size, Round, AMPLIMITE HD-20, PCB D-Sub Connectors | Other | 1-5747150-6 |
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