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Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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45984-6382
Molex
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1 | 1.27mm, 12.00mm Pitch, EXTreme LPHPower Receptacle Header, Right-Angle, 6 Power Contacts, 40 Signal Contacts, Select Gold (Au) Plating, for 2.36mm Thick PC Board, with Press-fit Plastic Pegs | Other | 45984-6382 |
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45985-6382
Molex
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1 | EXTreme LPHPower Header, Right-Angle, 6 Power Contacts, 40 Signal Contacts, Select Gold (Au) Plating, for 2.36mm Thick PC Board, with Press-fit Plastic Pegs | Other | 45985-6382 |
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SC-06-382JH
KEMET
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1 | KEMET, SC-JH, AC Line Filters, Common Mode, 250 VAC, 3.8 mH, 6 A, 120°C, -25°C, 40 mOhms, 180, 35mm, 32.5mm, 18mm, 3.5mm, 11mm, 28mm, 29 g | Other | SC-06-382JH |
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CY7C63823-SXC
Infineon
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1 | USB Controller USB 2.0 GPIO, SPI Interface 24-SOIC | Small Outline Packages | CY7C63823-SXC |
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3-1376382-4
TE Connectivity
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1 | Configuration Features: Number of Positions 2 | Number of Rows 1 | PCB Mount Orientation Vertical | Number of Power Positions 2 | Contact Features: PCB Contact Termination Area Plating Material Thickness 78.74 MICIN | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Thickness 39.36 MICM | PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 2 MICM | Contact Underplating Material Thickness 50 MICIN | Contact Type Tab | Contact Cu | Other | 3-1376382-4 |
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74FCT163827APAG8
Renesas Electronics
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1 | The 74FCT163827 20-bit buffer provide high-performance bus interface buffering for wide data/address paths or busses carrying parity. The 74FCT163827 has series current limiting resistors reducing the need for external series terminating resistors. The inputs of the 74FCT163827 can be driven from either 3.3V or 5V devices. This feature allows the use of these devices as translators in a mixed 3.3V/5V supply system. The 74FCT163827 operates at -40C to +85C | Small Outline Packages | 74FCT163827APAG8 |
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09553663820741
HARTING
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1 | Connector, Low-profile, Reflow soldering termination (SMT), Rated current: ?5 A, Male, Size: D-Sub 3 | Other | 09553663820741 |
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XDL602A36382-Q
Torex
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1 | HiSAT-COT ® Control, 1.5A Inductor Built-in Step-Down “micro DC/DC” Converters | Other | XDL602A36382-Q |
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78446-3822
Molex
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1 | High Speed / Modular Connectors Impact Pwr5Pr VT Hdr PF 0.76AuLF 4Ckt | Other | 78446-3822 |
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63824-5
TE Connectivity
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1 | Configuration Features: Connection Capacity Single | Contact Features: PCB Contact Termination Area Plating Material Thickness 3.81 MICM | Mating Tab Thickness .8 MM | Contact Mating Area Plating Material Thickness 3.81 MICM | Terminal Size 6.35 | Terminal Plating Material Tin | Contact Underplating Material Nickel | Mating Tab Thickness .031 INCH | Contact Underplating Material Thickness 2.54 MICM | Terminal Orientation Straight | Mating Tab Width 6.35 MM | PCB Contact Termination Area Plating Material Thi | Other | 63824-5 |
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8046382
RS Pro
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1 | RS Pro Thick Film Surface Mount Resistor 0805 Case 220Ω ±1% 0.125W ±100ppm/°C | Resistor Chip | 8046382 |
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782963820
Würth Elektronik
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1 | Ferrite Beads WE-CBA Ferrite Bead EMI Suppression SMD | Ferrite Bead Chip | 782963820 |
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09554663822741
HARTING
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1 | Connector, Reflow soldering termination (SMT), Rated current: ?5 A, Male, Size: D-Sub 4, Liquid crystal polymer (LCP), Steel, nickel plated, Zamac | Other | 09554663822741 |
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09553663821741
HARTING
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1 | Connector, Reflow soldering termination (SMT), Rated current: ?5 A, Male, Size: D-Sub 3, Liquid crystal polymer (LCP), Steel, nickel plated, Zamac | Other | 09553663821741 |
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3-1376382-4
TE Connectivity
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1 | Configuration Features: Number of Positions 2 | Number of Rows 1 | PCB Mount Orientation Vertical | Number of Power Positions 2 | Contact Features: PCB Contact Termination Area Plating Material Thickness 78.74 MICIN | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Thickness 39.36 MICM | PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 2 MICM | Contact Underplating Material Thickness 50 MICIN | Contact Type Tab | Contact Cu | Other | 3-1376382-4 |
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09551663820741
HARTING
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1 | Connector, Low-profile, Reflow soldering termination (SMT), Rated current: ?5 A, Male, Size: D-Sub 1 | Other | 09551663820741 |
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1836382
Phoenix Contact
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1 | PCB header, nominal cross section: 2.5 mm?, color: black, nominal current: 12 A, rated voltage (III/2): 320 V, contact surface: Tin, type of contact: Male connector, Number of potentials: 6, Number of rows: 1, Number of positions per row: 6, number of connections: 6, product range: CCA 2,5/..-G, pitch: 5 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 2 mm, Stecksystem: CLASSIC COMBICON, Locking: without, type of packaging: packed in cardboard, User information and design recommenda | Other | 1836382 |
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74FCT163827CPAG
Renesas Electronics
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1 | The 74FCT163827 20-bit buffer provide high-performance bus interface buffering for wide data/address paths or busses carrying parity. The 74FCT163827 has series current limiting resistors reducing the need for external series terminating resistors. The inputs of the 74FCT163827 can be driven from either 3.3V or 5V devices. This feature allows the use of these devices as translators in a mixed 3.3V/5V supply system. The 74FCT163827 operates at -40C to +85C | Small Outline Packages | 74FCT163827CPAG |
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63823-1
TE Connectivity
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1 | Contact Features: PCB Contact Termination Area Plating Material Thickness 150 MICIN | Mating Tab Width 4.75 MM | PCB Terminal Type Tab | Contact Underplating Material Brass | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | Terminal Plating Material Tin | Contact Mating Area Plating Material Thickness 150 MICIN | Terminal Size 4.75 | Mating Tab Thickness .02 INCH | Contact Underplating Material Thickness 50 MICIN | Contact Mating Area Plating Material Thickness 3.81 MICM | Terminal Orient | Other | 63823-1 |
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09554663820741
HARTING
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1 | Connector, Low-profile, Reflow soldering termination (SMT), Rated current: ?5 A, Male, Size: D-Sub 4 | Other | 09554663820741 |
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2-1376382-3
TE Connectivity
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1 | Configuration Features: Number of Power Positions 2 | Number of Rows 1 | Number of Positions 2 | PCB Mount Orientation Vertical | Contact Features: PCB Contact Termination Area Plating Material Thickness 1 MICM | Contact Type Tab | Contact Mating Area Plating Material Tin | Contact Retention Within Housing Without | Mating Post Length .248 INCH | Contact Current Rating (Max) 10 AMP | PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 39.37 MICIN | Con | Other | 2-1376382-3 |
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1-1376382-2
TE Connectivity
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1 | Rectangular Power Connectors, Header, Receptacle, Wire-to-Board, 2 Position, 5 mm [.197 in] Centerline, Printed Circuit Board, UL 94V-0, Power Key 5.0 | Other | 1-1376382-2 |
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09552663820741
HARTING
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1 | Connector, Low-profile, Reflow soldering termination (SMT), Rated current: ?5 A, Male, Size: D-Sub 2 | Other | 09552663820741 |
3
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L6382DTR
STMicroelectronics
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1 | Power Management Unit for Microcontrolled Ballast | Small Outline Packages | L6382DTR |
3
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L6382D
STMicroelectronics
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1 | L6382D, Lighting Controller, 14 V, 20-Pin SO | Small Outline Packages | L6382D |
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