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| Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action |
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| Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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LBSS138LT1G
LRC
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1 | Power MOSFET 200 mAmps, 50 Volts N-hannel SOT-3 | SOT23 (3-Pin) | LBSS138LT1G |
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LN2308LT1G
LRC Leshan Radio Co Ltd
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1 | VDS= 60V● RDS(ON) ≤100mΩ@VGS =10V● RDS(ON) ≤130mΩ@VGS =4.5V● Super high density cell design for extremely low RDS(ON).● Exceptional on-resistance and maximum DC current capability.● We declare that the material of product compliance with RoHS requirements and Halogen F | SOT23 (3-Pin) | LN2308LT1G |
3
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NVMFWS9D6P04M8LT1G
onsemi
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1 | AEC−Q101 Qualified and PPAP Capable; These Devices are Pb−Free, Halogen Free/BFR−Free and are RoHS Compliant; Low RDS(on); Low Capacitance; NVMFWS9D6P04M8L − Wettable Flanks Product | Other | NVMFWS9D6P04M8LT1G |
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SZBZX84C6V8LT1G
onsemi
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1 | 250 mW Rating on FR-4 or FR-5 Board; Zener Breakdown Voltage Range - 2.4 V to 75 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model; Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMAB | SOT23 (3-Pin) | SZBZX84C6V8LT1G |
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MMBT918LT1G
onsemi
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1 | SOT-23 Surface Mount Package Saves Board Space; These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant | SOT23 (3-Pin) | MMBT918LT1G |
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BZX84C6V8LT1G
onsemi
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1 | 250 mW Rating on FR-4 or FR-5 Board; Zener Breakdown Voltage Range - 2.4 V to 75 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model; Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMAB | SOT23 (3-Pin) | BZX84C6V8LT1G |
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NVMFS3D0P04M8LT1G
onsemi
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1 | Small Footprint (5x6 mm); Low RDS(on); Low QG and Capacitance; SO8FL package, Industry Standard; AEC−Q101 Qualified and PPAP Capable; These Devices are Pb−Free and are RoHS Compliant | Other | NVMFS3D0P04M8LT1G |
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MMUN2238LT1G
onsemi
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1 | Simplifies Circuit Design; Reduces Board Space; Reduces Component Count; S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable; These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant | SOT23 (3-Pin) | MMUN2238LT1G |
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PHP79NQ08LT,127
Nexperia
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1 | MOSFET PHP79NQ08LT/SOT78/SIL3P | Transistor Outline, Vertical | PHP79NQ08LT,127 |
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BZX84C18LT1G
onsemi
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1 | 250 mW Rating on FR-4 or FR-5 Board; Zener Breakdown Voltage Range - 2.4 V to 75 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model; Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMAB | SOT23 (3-Pin) | BZX84C18LT1G |
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MMBT5088LT1G
onsemi
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1 | Miniature SOT-23 Surface Mount Package Saves Board Space; Low rDS(on) Provides Higher Efficiency and Extends Battery Life; Pb-Free Packages are Available; S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable | SOT23 (3-Pin) | MMBT5088LT1G |
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BZX84B6V8LT1G
onsemi
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1 | 250 mW Rating on FR-4 or FR-5 Board; Zener Breakdown Voltage Range - 2.4 V to 75 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model; Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMAB | SOT23 (3-Pin) | BZX84B6V8LT1G |
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BZX84C68LT1G
onsemi
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1 | 250 mW Rating on FR-4 or FR-5 Board; Zener Breakdown Voltage Range - 2.4 V to 75 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model; Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMAB | SOT23 (3-Pin) | BZX84C68LT1G |
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NVMFWS2D3P04M8LT1G
onsemi
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1 | Low RDS (on) ; High Current Capability; Avalanche Energy Specified; NVMFWS2D3P04M8LT1G − Wettable Flanks Product; NVM Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; EC−Q101Qualified and PPAP Capable; These Devices are Pb−Free, Halogen Free/BFR Free and are RoHSCompliant | Other | NVMFWS2D3P04M8LT1G |
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BZX84C18LT1
onsemi
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1 | Obsolete - 250 mW 24 V ±5%Zener Diode Voltage Regulator | SOT23 (3-Pin) | BZX84C18LT1 |
3
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BSS138LT1G
onsemi
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1 | Low Threshold Voltage; Miniature SOT-23 Surface Mount Package; RoHS Compliant | SOT23 (3-Pin) | BSS138LT1G |
3
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NVMFS014P04M8LT1G
onsemi
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1 | Small Footprint (3x3 mm); Low RDS (on); Low Capacitance; AEC−Q101 Qualified and PPAP Capable; These Devices are Pb−Free, Halogen Free/BFR−Free and are RoHS Compliant | Other | NVMFS014P04M8LT1G |
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NSVMMUN2138LT1G
onsemi
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1 | Simplifies Circuit Design; Reduces Board Space; Reduces Component Count; S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable; These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant | SOT23 (3-Pin) | NSVMMUN2138LT1G |
3
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SMMBT5088LT1G
onsemi
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1 | Miniature SOT-23 Surface Mount Package Saves Board Space; Low rDS(on) Provides Higher Efficiency and Extends Battery Life; Pb-Free Packages are Available; S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable | SOT23 (3-Pin) | SMMBT5088LT1G |
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MMBT6428LT1G
onsemi
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1 | Pb-Free Packages are Available | SOT23 (3-Pin) | MMBT6428LT1G |
3
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NVMFS9D6P04M8LT1G
onsemi
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1 | AEC−Q101 Qualified and PPAP Capable; These Devices are Pb−Free, Halogen Free/BFR−Free and are RoHS Compliant; Low RDS(on); Low Capacitance; NVMFWS9D6P04M8L − Wettable Flanks Product | Other | NVMFS9D6P04M8LT1G |
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NVMFWS3D0P04M8LT1G
onsemi
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1 | Small Footprint (5x6 mm); Low RDS(on); Low QG and Capacitance; SO8FL package, Industry Standard; AEC−Q101 Qualified and PPAP Capable; These Devices are Pb−Free and are RoHS Compliant | Other | NVMFWS3D0P04M8LT1G |
3
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BVSS138LT1G
onsemi
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1 | Low Threshold Voltage (VGS(th): 0.5 V−1.5 V).; Miniature Surface Mount Package | SOT23 (3-Pin) | BVSS138LT1G |
3
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DMN33D8LT-13
Diodes Incorporated
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1 | N-Channel 30 V 115mA (Ta) 240mW (Ta) Surface Mount SOT-523 | SOT23 (3-Pin) | DMN33D8LT-13 |
3
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SZBZX84C18LT1G
onsemi
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1 | 250 mW Rating on FR-4 or FR-5 Board; Zener Breakdown Voltage Range - 2.4 V to 75 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model; Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMAB | SOT23 (3-Pin) | SZBZX84C18LT1G |
3
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