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HDSP-0761
Avago Technologies
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1 | Displays Dot Matrix Module 1DIGIT 20LED Hi-Eff. Red 8-Pin DIP - Trays | Dual-In-Line Packages | HDSP-0761 |
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DSP03-003-432G
KEL CORPORATION
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1 | Board Connector, 3 Contact(s), 1 Row(s), Male, Straight, 0.1 inch Pitch, Press Fit Terminal, Black Insulator, Plug | Header, Vertical | DSP03-003-432G |
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RJK0202DSP-00#J0
Renesas Electronics
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1 | The RJK0202DSP is a Nch Single Power Mosfet 20V 16A 6.3Mohm Sop8. | Small Outline Packages | RJK0202DSP-00#J0 |
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EDSP08SGLNNTR04
TE Connectivity
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1 | Body Features: Product Orientation Vertical | Case Color Black | Case Material High Temperature Nylon | Actuator Color White | Configuration Features: Number of Positions 8 | Configuration (Pole-Throw) Single Pole - Single Throw | Number of Switches 8 | Contact Features: Contact Current Rating .025 AMP | PCB Contact Termination Area Plating Material Gold Flash | Contact Base Material Copper Alloy | Contact Underplating Material Nickel | Switch Contact Plating Material Gold Flash | Dimensions: Product Height | Other | EDSP08SGLNNTR04 |
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RJK0349DSP-01#J0
Renesas Electronics
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1 | MOSFETs suitable for switching (motor drive, etc.) and load switch applications. Low on-resistance, high-speed switching, and high-robustness. | Small Outline Packages | RJK0349DSP-01#J0 |
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RJK0354DSP-00#J0
Renesas Electronics
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1 | MOSFETs suitable for switching (motor drive, etc.) and load switch applications. Low on-resistance, high-speed switching, and high-robustness. | Small Outline Packages | RJK0354DSP-00#J0 |
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RJF0610DSP-00#J0
Renesas Electronics
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1 | This FET has the over temperature shut-down capability sensing to the junction temperature. This FET has the built-in over temperature shut-down circuit in the gate area. And this circuit operation to shut-down the gate voltage in case of high junction temperature like applying over power consumption, over current etc. . | Small Outline Packages | RJF0610DSP-00#J0 |
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EDSP04SGLNNTU04
TE Connectivity
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1 | DIP Switch, Gold Flash Contact Plating, Black, High Temperature Nylon, 4 Switch, -20 – 85 °C [-4 – 185 °F], Piano (Side Actuated), ALCOSWITCH DIP EDSP | Other | EDSP04SGLNNTU04 |
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HDSP-0772
Avago Technologies
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1 | Display Modules - LED Character and Numeric Red 7-Segment, Hexadecimal 1 Character Common Anode 10mA 0.531" H x 0.402" W x 0.169" D (13.50mm x 10.20mm x 4.30mm) 8-DIP (0.600", 15.20mm) | Other | HDSP-0772 |
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RJK0354DSP-01#J0
Renesas Electronics
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1 | MOSFETs suitable for switching (motor drive, etc.) and load switch applications. Low on-resistance, high-speed switching, and high-robustness. | Small Outline Packages | RJK0354DSP-01#J0 |
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RJK0349DSP-00#J0
Renesas Electronics
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1 | MOSFETs suitable for switching (motor drive, etc.) and load switch applications. Low on-resistance, high-speed switching, and high-robustness. | Small Outline Packages | RJK0349DSP-00#J0 |
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EDSP02SGRNNTU04
TE Connectivity
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1 | Body Features: Case Material High Temperature Nylon | Case Color Black | Actuator Color White | Product Orientation Vertical | Configuration Features: Number of Switches 2 | Number of Positions 2 | Configuration (Pole-Throw) Single Pole - Single Throw | Contact Features: PCB Contact Termination Area Plating Material Gold Flash | Switch Contact Plating Material Gold Flash | Contact Underplating Material Nickel | Contact Base Material Copper Alloy | Contact Current Rating .025 AMP | Dimensions: Product Height | Other | EDSP02SGRNNTU04 |
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RJK0355DSP-01#J0
Renesas Electronics
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1 | MOSFETs suitable for switching (motor drive, etc.) and load switch applications. Low on-resistance, high-speed switching, and high-robustness. | Small Outline Packages | RJK0355DSP-01#J0 |
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EDSP08SGLNNTU04
TE Connectivity
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1 | DIP Switch, Gold Flash Contact Plating, Black, High Temperature Nylon, 8 Switch, -20 – 85 °C [-4 – 185 °F], Piano (Side Actuated), ALCOSWITCH DIP EDSP | Other | EDSP08SGLNNTU04 |
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EDSP06SGLNNTU04
TE Connectivity
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1 | Dip Switch SPST 6 Position Surface Mount, Right Angle Piano Actuator 25mA 24VDC | Other | EDSP06SGLNNTU04 |
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EDSP02SGLFNTU04
TE Connectivity
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1 | Body Features: Actuator Color White | Case Color Black | Product Orientation Vertical | Case Material High Temperature Nylon | Configuration Features: Number of Switches 2 | Number of Positions 2 | Configuration (Pole-Throw) Single Pole - Single Throw | Contact Features: Contact Base Material Copper Alloy | Contact Current Rating .025 AMP | Switch Contact Plating Material Gold Flash | PCB Contact Termination Area Plating Material Gold Flash | Contact Underplating Material Nickel | Dimensions: Product Height | Other | EDSP02SGLFNTU04 |
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RJK0355DSP-00#J0
Renesas Electronics
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1 | MOSFETs suitable for switching (motor drive, etc.) and load switch applications. Low on-resistance, high-speed switching, and high-robustness. | Small Outline Packages | RJK0355DSP-00#J0 |
3
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RJF0614DSP-00#J0
Renesas Electronics
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1 | • Logic level operation (5 to 6 V Gate drive).• Built-in the over temperature shut-down circuit.• High endurance capability against to the short circuit.• Temperature hysteresis type.• High density mounting• Power supply voltage applies 12 V and 24 V. | Small Outline Packages | RJF0614DSP-00#J0 |
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MJM-D1DS-P-005
Methode Electronics Inc
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1 | Interconnection Device | MJM-D1DS-P-005 |
0
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SLX5-17DS-P-002
Methode Electronics Inc
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1 | Interconnection Device | SLX5-17DS-P-002 |
0
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SDIN-28DS-P-003
Methode Electronics Inc
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1 | Interconnection Device | SDIN-28DS-P-003 |
0
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MXAN-LN-10-PD-S-P-00-FA
Laser Components USA Inc
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1 | External Modulator | MXAN-LN-10-PD-S-P-00-FA |
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NE2P1-20DS-P-003
Methode Electronics Inc
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1 | Fiber Optic Connector, 1 Contact(s), Single Mode, Simplex, Wire Terminal | NE2P1-20DS-P-003 |
0
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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NPC215-09DS-P-003
Methode Electronics Inc
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1 | Fiber Optic FC Connector, 1 Contact(s), Male, Single Mode, Simplex, Wire Terminal | NPC215-09DS-P-003 |
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NDIN-RCDS-P-003
Methode Electronics Inc
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1 | Interconnection Device | NDIN-RCDS-P-003 |
0
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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