F211B Footprint, Symbol and 3D Model search results

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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	R5F211B4DSP#U0 Renesas Electronics	1	The R8C/1B Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using the high-performance silicon gate CMOS process, embedding the R8C/ Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high	Small Outline Packages	R5F211B4DSP#U0	3D model available Symbol and footprint available 3	1 Download Model
	R5F211B1SP#U0 Renesas Electronics	1	The R8C/1B Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using the high-performance silicon gate CMOS process, embedding the R8C/ Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high	Small Outline Packages	R5F211B1SP#U0	3D model available Symbol and footprint available 3	1 Download Model
	R5F211B4SP#U0 Renesas Electronics	1	The R8C/1B Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using the high-performance silicon gate CMOS process, embedding the R8C/ Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high	Small Outline Packages	R5F211B4SP#U0	3D model available Symbol and footprint available 3	1 Download Model
	R5F211B3SP#U0 Renesas Electronics	1	The R8C/1B Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using the high-performance silicon gate CMOS process, embedding the R8C/ Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high	Small Outline Packages	R5F211B3SP#U0	3D model available Symbol and footprint available 3	1 Download Model

	R5F211B1DSP#V0 Renesas Electronics	1	IC MCU 16BIT 4KB FLASH 20LSSOP	Small Outline Packages	R5F211B1DSP#V0	3D model available Symbol and footprint available 3	1 Download Model
	R5F211B2SP#W4 Renesas Electronics	1	The R8C/1B Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using the high-performance silicon gate CMOS process, embedding the R8C/ Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high	Small Outline Packages	R5F211B2SP#W4	3D model available Symbol and footprint available 3	1 Download Model
	R5F211B4DSP#W4 Renesas Electronics	1	The R8C/1B Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using the high-performance silicon gate CMOS process, embedding the R8C/ Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high	Small Outline Packages	R5F211B4DSP#W4	3D model available Symbol and footprint available 3	1 Download Model
	R5F211B1DD#U0 Renesas Electronics	1	The R8C/1B Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using the high-performance silicon gate CMOS process, embedding the R8C/ Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high	Dual-In-Line Packages	R5F211B1DD#U0	3D model available Symbol and footprint available 3	1 Download Model
	R5F211B1DSP#U0 Renesas Electronics	1	The R8C/1B Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using the high-performance silicon gate CMOS process, embedding the R8C/ Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high	Small Outline Packages	R5F211B1DSP#U0	3D model available Symbol and footprint available 3	1 Download Model
	R5F211B4SP#W4 Renesas Electronics	1	The R8C/1B Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using the high-performance silicon gate CMOS process, embedding the R8C/ Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high	Small Outline Packages	R5F211B4SP#W4	3D model available Symbol and footprint available 3	1 Download Model
	R5F211B4NP#U0 Renesas Electronics	1	The R8C/1B Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using the high-performance silicon gate CMOS process, embedding the R8C/ Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high	Quad Flat No-Lead	R5F211B4NP#U0	3D model available Symbol and footprint available 3	1 Download Model
	F211BJ104M400ALG5C KEMET Corporation	1	Film Capacitor, Polyphenylene Sulfide, 400V, 20% +Tol, 20% -Tol, 0.1uF, Through Hole Mount		F211BJ104M400ALG5C	3D model not available Symbol and footprint not available 0	0 Build or Request
	F211BD104K250L KEMET Corporation	1	Film Capacitor, Polyphenylene Sulfide, 250V, 10% +Tol, 10% -Tol, 0.1uF, Through Hole Mount		F211BD104K250L	3D model not available Symbol and footprint not available 0	0 Build or Request
	F211BQ275J063XLAF1 KEMET Corporation	1	Film Capacitor, Polyphenylene Sulfide, 63V, 5% +Tol, 5% -Tol, 2.7uF, Through Hole Mount		F211BQ275J063XLAF1	3D model not available Symbol and footprint not available 0	0 Build or Request
	F211BL105H100XLAF1 KEMET Corporation	1	Film Capacitor, Polyphenylene Sulphide, 100V, 2.5% +Tol, 2.5% -Tol, 1uF, 7130		F211BL105H100XLAF1	3D model not available Symbol and footprint not available 0	0 Build or Request

	F211BL154J400C KEMET Corporation	1	Film Capacitor, Polyphenylene Sulfide, 400V, 5% +Tol, 5% -Tol, 0.15uF, Through Hole Mount		F211BL154J400C	3D model not available Symbol and footprint not available 0	0 Build or Request
	F211BL274R250XLTF1 KEMET Corporation	1	Film Capacitor, Polyphenylene Sulfide, 250V, 2.5% +Tol, 2.5% -Tol, 0.27uF, Through Hole Mount		F211BL274R250XLTF1	3D model not available Symbol and footprint not available 0	0 Build or Request
	F211BM225M063P KEMET Corporation	1	Film Capacitor, Polyphenylene Sulfide, 63V, 20% +Tol, 20% -Tol, 2.2uF, Through Hole Mount		F211BM225M063P	3D model not available Symbol and footprint not available 0	0 Build or Request
	F211BJ104H400XLTF1 KEMET Corporation	1	Film Capacitor, Polyphenylene Sulphide, 400V, 2.5% +Tol, 2.5% -Tol, 0.1uF, 7126		F211BJ104H400XLTF1	3D model not available Symbol and footprint not available 0	0 Build or Request
	F211BJ155M063C KEMET Corporation	1	Film Capacitor, Polyphenylene Sulfide, 63V, 20% +Tol, 20% -Tol, 1.5uF, Through Hole Mount		F211BJ155M063C	3D model not available Symbol and footprint not available 0	0 Build or Request
	F211BL185K063P KEMET Corporation	1	Film Capacitor, Polyphenylene Sulfide, 63V, 10% +Tol, 10% -Tol, 1.8uF, Through Hole Mount		F211BL185K063P	3D model not available Symbol and footprint not available 0	0 Build or Request
	F211BM184M400XLTF1 KEMET Corporation	1	Film Capacitor, Polyphenylene Sulfide, 400V, 20% +Tol, 20% -Tol, 0.18uF, Through Hole Mount		F211BM184M400XLTF1	3D model not available Symbol and footprint not available 0	0 Build or Request
	F211BV274R400XLAF1 KEMET Corporation	1	Film Capacitor, Polyphenylene Sulfide, 400V, 2.5% +Tol, 2.5% -Tol, 0.27uF, Through Hole Mount		F211BV274R400XLAF1	3D model not available Symbol and footprint not available 0	0 Build or Request
	F211BL154K400C KEMET Corporation	1	Film Capacitor, Polyphenylene Sulfide, 400V, 10% +Tol, 10% -Tol, 0.15uF, Through Hole Mount		F211BL154K400C	3D model not available Symbol and footprint not available 0	0 Build or Request
	F211BL275K050XLTF1 KEMET Corporation	1	Film Capacitor, Polyphenylene Sulfide, 50V, 10% +Tol, 10% -Tol, 2.7uF, Through Hole Mount		F211BL275K050XLTF1	3D model not available Symbol and footprint not available 0	0 Build or Request
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