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R5F211B2SP#W4
Renesas Electronics
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1 | The R8C/1B Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using the high-performance silicon gate CMOS process, embedding the R8C/ Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high | Small Outline Packages | R5F211B2SP#W4 |
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R5F211B1DSP#V0
Renesas Electronics
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1 | IC MCU 16BIT 4KB FLASH 20LSSOP | Small Outline Packages | R5F211B1DSP#V0 |
3
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R5F211B4DSP#U0
Renesas Electronics
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1 | The R8C/1B Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using the high-performance silicon gate CMOS process, embedding the R8C/ Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high | Small Outline Packages | R5F211B4DSP#U0 |
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R5F211B1SP#U0
Renesas Electronics
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1 | The R8C/1B Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using the high-performance silicon gate CMOS process, embedding the R8C/ Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high | Small Outline Packages | R5F211B1SP#U0 |
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R5F211B4SP#U0
Renesas Electronics
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1 | The R8C/1B Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using the high-performance silicon gate CMOS process, embedding the R8C/ Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high | Small Outline Packages | R5F211B4SP#U0 |
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R5F211B3SP#U0
Renesas Electronics
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1 | The R8C/1B Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using the high-performance silicon gate CMOS process, embedding the R8C/ Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high | Small Outline Packages | R5F211B3SP#U0 |
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R5F211B4SP#W4
Renesas Electronics
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1 | The R8C/1B Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using the high-performance silicon gate CMOS process, embedding the R8C/ Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high | Small Outline Packages | R5F211B4SP#W4 |
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R5F211B4NP#U0
Renesas Electronics
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1 | The R8C/1B Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using the high-performance silicon gate CMOS process, embedding the R8C/ Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high | Quad Flat No-Lead | R5F211B4NP#U0 |
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R5F211B4DSP#W4
Renesas Electronics
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1 | The R8C/1B Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using the high-performance silicon gate CMOS process, embedding the R8C/ Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high | Small Outline Packages | R5F211B4DSP#W4 |
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R5F211B1DD#U0
Renesas Electronics
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1 | The R8C/1B Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using the high-performance silicon gate CMOS process, embedding the R8C/ Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high | Dual-In-Line Packages | R5F211B1DD#U0 |
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R5F211B1DSP#U0
Renesas Electronics
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1 | The R8C/1B Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using the high-performance silicon gate CMOS process, embedding the R8C/ Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high | Small Outline Packages | R5F211B1DSP#U0 |
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F211BD274K100ALG5C
KEMET Corporation
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1 | Film Capacitor, | F211BD274K100ALG5C |
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F211BE564R100P
KEMET Corporation
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1 | Film Capacitor, Polyphenylene Sulphide, 100V, 2.5% +Tol, 2.5% -Tol, 0.56uF, Through Hole Mount, 7122, RADIAL LEADED | F211BE564R100P |
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F211BD334M100XLTF1
KEMET Corporation
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1 | Film Capacitor, Polyphenylene Sulphide, 100V, 20% +Tol, 20% -Tol, 0.33uF, Through Hole Mount, 7122, RADIAL LEADED | F211BD334M100XLTF1 |
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F211BJ224J250XLTF1
KEMET Corporation
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1 | Film Capacitor, Polyphenylene Sulphide, 250V, 5% +Tol, 5% -Tol, 0.22uF, Through Hole Mount, 7126, RADIAL LEADED | F211BJ224J250XLTF1 |
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F211BL275M050ALG5C
KEMET Corporation
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1 | Film Capacitor, | F211BL275M050ALG5C |
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F211BD563M400XLTF1
KEMET Corporation
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1 | Film Capacitor, Polyphenylene Sulphide, 400V, 20% +Tol, 20% -Tol, 0.056uF, Through Hole Mount, 7122, RADIAL LEADED | F211BD563M400XLTF1 |
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F211BJ684H100XLTF1
KEMET Corporation
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1 | Film Capacitor, Polyphenylene Sulphide, 100V, 2.5% +Tol, 2.5% -Tol, 0.68uF, 7126, | F211BJ684H100XLTF1 |
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F211BQ155H100XLTF1
KEMET Corporation
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1 | Film Capacitor, Polyphenylene Sulphide, 100V, 2.5% +Tol, 2.5% -Tol, 1.5uF, 7133, | F211BQ155H100XLTF1 |
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F211BM184M400C
KEMET Corporation
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1 | Film Capacitor, Polyphenylene Sulphide, 400V, 20% +Tol, 20% -Tol, 0.18uF, Through Hole Mount, 7132, RADIAL LEADED | F211BM184M400C |
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F211BQ224J400ALG5C
KEMET Corporation
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1 | Film Capacitor, | F211BQ224J400ALG5C |
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F211BD474R100P
KEMET Corporation
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1 | Film Capacitor, Polyphenylene Sulphide, 100V, 2.5% +Tol, 2.5% -Tol, 0.47uF, Through Hole Mount, 7122, RADIAL LEADED | F211BD474R100P |
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F211BJ125R063XLAF1
KEMET Corporation
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1 | Film Capacitor, Polyphenylene Sulphide, 63V, 2.5% +Tol, 2.5% -Tol, 1.2uF, Through Hole Mount, 7126, RADIAL LEADED | F211BJ125R063XLAF1 |
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F211BQ474H250XLTF1
KEMET Corporation
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1 | Film Capacitor, Polyphenylene Sulphide, 250V, 2.5% +Tol, 2.5% -Tol, 0.47uF, 7133, | F211BQ474H250XLTF1 |
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F211BM184R400XLTF1
KEMET Corporation
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1 | Film Capacitor, Polyphenylene Sulphide, 400V, 2.5% +Tol, 2.5% -Tol, 0.18uF, Through Hole Mount, 7132, RADIAL LEADED | F211BM184R400XLTF1 |
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