F211B Footprint, Symbol and 3D Model search results

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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	R5F211B4DSP#U0 Renesas Electronics	1	The R8C/1B Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using the high-performance silicon gate CMOS process, embedding the R8C/ Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high	Small Outline Packages	R5F211B4DSP#U0	3D model available Symbol and footprint available 3	1 Download Model
	R5F211B1SP#U0 Renesas Electronics	1	The R8C/1B Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using the high-performance silicon gate CMOS process, embedding the R8C/ Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high	Small Outline Packages	R5F211B1SP#U0	3D model available Symbol and footprint available 3	1 Download Model
	R5F211B4SP#U0 Renesas Electronics	1	The R8C/1B Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using the high-performance silicon gate CMOS process, embedding the R8C/ Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high	Small Outline Packages	R5F211B4SP#U0	3D model available Symbol and footprint available 3	1 Download Model
	R5F211B3SP#U0 Renesas Electronics	1	The R8C/1B Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using the high-performance silicon gate CMOS process, embedding the R8C/ Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high	Small Outline Packages	R5F211B3SP#U0	3D model available Symbol and footprint available 3	1 Download Model

	R5F211B1DSP#V0 Renesas Electronics	1	IC MCU 16BIT 4KB FLASH 20LSSOP	Small Outline Packages	R5F211B1DSP#V0	3D model available Symbol and footprint available 3	1 Download Model
	R5F211B2SP#W4 Renesas Electronics	1	The R8C/1B Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using the high-performance silicon gate CMOS process, embedding the R8C/ Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high	Small Outline Packages	R5F211B2SP#W4	3D model available Symbol and footprint available 3	1 Download Model
	R5F211B4DSP#W4 Renesas Electronics	1	The R8C/1B Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using the high-performance silicon gate CMOS process, embedding the R8C/ Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high	Small Outline Packages	R5F211B4DSP#W4	3D model available Symbol and footprint available 3	1 Download Model
	R5F211B1DD#U0 Renesas Electronics	1	The R8C/1B Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using the high-performance silicon gate CMOS process, embedding the R8C/ Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high	Dual-In-Line Packages	R5F211B1DD#U0	3D model available Symbol and footprint available 3	1 Download Model
	R5F211B1DSP#U0 Renesas Electronics	1	The R8C/1B Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using the high-performance silicon gate CMOS process, embedding the R8C/ Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high	Small Outline Packages	R5F211B1DSP#U0	3D model available Symbol and footprint available 3	1 Download Model
	R5F211B4SP#W4 Renesas Electronics	1	The R8C/1B Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using the high-performance silicon gate CMOS process, embedding the R8C/ Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high	Small Outline Packages	R5F211B4SP#W4	3D model available Symbol and footprint available 3	1 Download Model
	R5F211B4NP#U0 Renesas Electronics	1	The R8C/1B Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using the high-performance silicon gate CMOS process, embedding the R8C/ Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high	Quad Flat No-Lead	R5F211B4NP#U0	3D model available Symbol and footprint available 3	1 Download Model
	F211BE105M063XLTF1 KEMET Corporation	1	Film Capacitor, Polyphenylene Sulfide, 63V, 20% +Tol, 20% -Tol, 1uF, Through Hole Mount		F211BE105M063XLTF1	3D model not available Symbol and footprint not available 0	0 Build or Request
	F211BL105R100XLTF1 KEMET Corporation	1	Film Capacitor, Polyphenylene Sulfide, 100V, 2.5% +Tol, 2.5% -Tol, 1uF, Through Hole Mount		F211BL105R100XLTF1	3D model not available Symbol and footprint not available 0	0 Build or Request
	F211BE564M100L KEMET Corporation	1	Film Capacitor, Polyphenylene Sulfide, 100V, 20% +Tol, 20% -Tol, 0.56uF, Through Hole Mount		F211BE564M100L	3D model not available Symbol and footprint not available 0	0 Build or Request
	F211BV185M100ALG5C KEMET Corporation	1	Film Capacitor, Polyphenylene Sulfide, 100V, 20% +Tol, 20% -Tol, 1.8uF, Through Hole Mount		F211BV185M100ALG5C	3D model not available Symbol and footprint not available 0	0 Build or Request

	F211BJ155J063ALG5C KEMET Corporation	1	Film Capacitor, Polyphenylene Sulfide, 63V, 5% +Tol, 5% -Tol, 1.5uF, Through Hole Mount		F211BJ155J063ALG5C	3D model not available Symbol and footprint not available 0	0 Build or Request
	F211BV185R100XLAF1 KEMET Corporation	1	Film Capacitor, Polyphenylene Sulfide, 100V, 2.5% +Tol, 2.5% -Tol, 1.8uF, Through Hole Mount		F211BV185R100XLAF1	3D model not available Symbol and footprint not available 0	0 Build or Request
	F211BQ224K400XLAF1 KEMET Corporation	1	Film Capacitor, Polyphenylene Sulfide, 400V, 10% +Tol, 10% -Tol, 0.22uF, Through Hole Mount		F211BQ224K400XLAF1	3D model not available Symbol and footprint not available 0	0 Build or Request
	F211BD154H250XLTF1 KEMET Corporation	1	Film Capacitor, Polyphenylene Sulphide, 250V, 2.5% +Tol, 2.5% -Tol, 0.15uF, 7122		F211BD154H250XLTF1	3D model not available Symbol and footprint not available 0	0 Build or Request
	F211BD684J063P KEMET Corporation	1	Film Capacitor, Polyphenylene Sulfide, 63V, 5% +Tol, 5% -Tol, 0.68uF, Through Hole Mount		F211BD684J063P	3D model not available Symbol and footprint not available 0	0 Build or Request
	F211BE105R063C KEMET Corporation	1	Film Capacitor, Polyphenylene Sulfide, 63V, 2.5% +Tol, 2.5% -Tol, 1uF, Through Hole Mount		F211BE105R063C	3D model not available Symbol and footprint not available 0	0 Build or Request
	F211BV475R050C KEMET Corporation	1	Film Capacitor, Polyphenylene Sulfide, 50V, 2.5% +Tol, 2.5% -Tol, 4.7uF, Through Hole Mount		F211BV475R050C	3D model not available Symbol and footprint not available 0	0 Build or Request
	F211BD154K250XLAF1 KEMET Corporation	1	Film Capacitor, Polyphenylene Sulfide, 250V, 10% +Tol, 10% -Tol, 0.15uF, Through Hole Mount		F211BD154K250XLAF1	3D model not available Symbol and footprint not available 0	0 Build or Request
	F211BD563M400XLTF1 KEMET Corporation	1	Film Capacitor, Polyphenylene Sulfide, 400V, 20% +Tol, 20% -Tol, 0.056uF, Through Hole Mount		F211BD563M400XLTF1	3D model not available Symbol and footprint not available 0	0 Build or Request
	F211BJ224M250XLTF1 KEMET Corporation	1	Film Capacitor, Polyphenylene Sulfide, 250V, 20% +Tol, 20% -Tol, 0.22uF, Through Hole Mount		F211BJ224M250XLTF1	3D model not available Symbol and footprint not available 0	0 Build or Request
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