266-2 Model Download Search Results
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TLP2662
Toshiba
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1 | Toshiba TLP2662 AC Input Infrared LED Output Dual Optocoupler, Through Hole, 8-Pin DIP | Dual-In-Line Packages | TLP2662 |
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LTC2662CUH-16#PBF
Analog Devices
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1 | Digital to Analog Converters - DAC 5 Chnl 16/12 bit current source DAC | Quad Flat No-Lead | LTC2662CUH-16#PBF |
3
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MAX32662GTJ+T
Analog Devices
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1 | Arm Cortex-M4 Processor with FPUBased Microcontroller (MCU) with 256KB Flash and 80KB SRAM | Quad Flat No-Lead | MAX32662GTJ+T |
3
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10226-6212PL
3M
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1 | 26 Position Receptacle Connector Panel Mount, Through Hole Solder | Other | 10226-6212PL |
3
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LTC2662IUH-16#TRPBF
Analog Devices
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1 | Digital to Analog Converters - DAC 5 Chnl 16/12 bit current source DAC | Quad Flat No-Lead | LTC2662IUH-16#TRPBF |
3
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1 | D-Sub Micro-D Connectors 26P BDMNT RECEP VERT SHLDED THRU-HOLE | Other | N10226-6212PC |
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TLP2662(TP1,F)
Toshiba
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1 | High Speed Optocouplers Photocoupler, Photo IC Output | Dual-In-Line Packages | TLP2662(TP1,F) |
3
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TLE4266-2G
Infineon
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1 | Infineon TLE4266-2G, LDO Voltage Regulator, 150mA, 5 V ±3%, 5.5 → 45 Vin, 3+Tab-Pin SOT-223 | SOT223 (3-Pin) | TLE4266-2G |
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10226-6212PC
3M
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1 | 3M MDR 102 Series 1.27mm Pitch 26 Way Straight Through Hole Mount Micro-D PCB Connector, Socket | Other | 10226-6212PC |
3
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LM2662M/NOPB
Texas Instruments
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1 | 200mA switched capacitor voltage converter | Small Outline Packages | LM2662M/NOPB |
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2-826629-0
TE Connectivity
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1 | Body Features: Primary Product Color Green | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 20 | Connector Contact Load Condition Fully Loaded | Board-to-Board Configuration Parallel | Number of Rows 1 | Contact Features: Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 31.5 MICIN | Contact Shape & Form Square | Contact Type Pin | Contact Mating Area Plating Material Gold or Gold Flash over P | Header, Vertical | 2-826629-0 |
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1426620000
Weidmüller
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1 | PCB terminal, 320 V, 24 A, Pitch in mm: 5.08, 2.5 mm², Number of poles: 6, PUSH IN, THT solder connection, 180°, Box | Other | 1426620000 |
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NCV4266-2CST50T3G
onsemi
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1 | Linear Voltage Regulator IC Positive Fixed 1 Output 150mA SOT-223 (TO-261) | Other | NCV4266-2CST50T3G |
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826629-6
TE Connectivity
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1 | Body Features: Primary Product Color Green | Configuration Features: Number of Positions 6 | Number of Rows 1 | PCB Mount Orientation Vertical | Connector Contact Load Condition Fully Loaded | Board-to-Board Configuration Parallel | Contact Features: Mating Square Post Dimension .63 MM | Contact Shape & Form Square | Contact Mating Area Plating Material Thickness .8 MICM | Contact Current Rating (Max) 5 AMP | Contact Base Material Phosphor Bronze | PCB Contact Termination Area Plating Material Tin | Contact | Header, Vertical | 826629-6 |
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826629-9
TE Connectivity
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1 | Body Features: Primary Product Color Green | Configuration Features: Number of Rows 1 | Board-to-Board Configuration Parallel | Number of Positions 9 | PCB Mount Orientation Vertical | Connector Contact Load Condition Fully Loaded | Contact Features: Mating Square Post Dimension .63 MM | Contact Shape & Form Square | Contact Mating Area Plating Material Thickness .8 MICM | PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 3 MICM | Contact Mating Area | Header, Vertical | 826629-9 |
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TLP2662F
Toshiba
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1 | Photocoupler (photo-IC output), High-speed, 15 Mbps, 5000 Vrms, DIP8(F type) | Dual-In-Line Packages | TLP2662F |
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826629-8
TE Connectivity
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1 | Body Features: Primary Product Color Green | Configuration Features: Number of Positions 8 | Board-to-Board Configuration Parallel | PCB Mount Orientation Vertical | Number of Rows 1 | Connector Contact Load Condition Fully Loaded | Contact Features: Mating Square Post Dimension .025 INCH | Contact Type Pin | Contact Underplating Material Nickel | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Mating Square Post Dimension .63 MM | Contact Shape & Form Square | Contact Mating | Header, Vertical | 826629-8 |
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1-826629-2
TE Connectivity
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1 | PCB Mount Header, Vertical, Board-to-Board, 12 Position, 2.54 mm [.1 in] Centerline, Breakaway, AMPMODU Headers | Header, Vertical | 1-826629-2 |
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5-826629-0
TE Connectivity
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1 | Body Features: Primary Product Color Green | Configuration Features: Number of Rows 1 | Number of Positions 50 | Board-to-Board Configuration Parallel | PCB Mount Orientation Vertical | Connector Contact Load Condition Fully Loaded | Contact Features: Contact Underplating Material Nickel | Mating Square Post Dimension .025 INCH | Contact Shape & Form Square | Mating Square Post Dimension .63 MM | Contact Base Material Phosphor Bronze | PCB Contact Termination Area Plating Material Thickness 3 MICM | Contact | Header, Vertical | 5-826629-0 |
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1-826629-9
TE Connectivity
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1 | 19P AMPMODU II STIFT LEI | Header, Vertical | 1-826629-9 |
3
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302662
Honeywell
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1 | Industrial VRS Magnetic Speed Sensors , 85 mH , -55 ºC to 120 ºC , 100 kOhm | Other | 302662 |
3
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S2662A-3ED
ECT
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1 | Contact, Connector, Test Spring Socket, PCB, Test Receptacle, 3 A, 17.53 mm | Other | S2662A-3ED |
3
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LTC2662IUH-16#PBF
Analog Devices
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1 | Digital to Analog Converters - DAC 16-Bit 5-Channel 300mA Current Source DAC | Quad Flat No-Lead | LTC2662IUH-16#PBF |
3
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1-826629-0
TE Connectivity
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1 | 10w Single row straight header gold | Header, Vertical | 1-826629-0 |
3
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CC2662R1FTWRGZRQ1
Texas Instruments
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1 | Automotive qualified SimpleLink™ wireless MCU for use in wireless battery management systems | Quad Flat No-Lead | CC2662R1FTWRGZRQ1 |
3
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