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R9A07G075M24GBA#AC0
Renesas Electronics
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1 | RZ/T2M is an industry-leading high-performance multi-function MPU that realizes high-speed processing, high precision control, and functional safety required for industrial equipment such as AC servos and industrial motors. Powered by dual Arm® Cortex®-R52 cores with a maximum frequency of 800MHz for real-time control and embedded with a large tightly coupled memory (576KB) directly connected to the CPU to realize high-performance real-time processing, RZ/T2M enables low latency access by arranging the peri | BGA | R9A07G075M24GBA#AC0 |
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STM32MP257DAL3
STMicroelectronics
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1 | Arm® based dual Cortex®-A35 1.5 GHz + Cortex®-M33 MPU with AI, 3D GPU, video encoder/decoder, TFT/DSI/LVDS, USB 3.0, PCIe® | BGA | STM32MP257DAL3 |
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R9A07G075M01GFP#AA0
Renesas Electronics
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1 | RZ/T2M is an industry-leading high-performance multi-function MPU that realizes high-speed processing, high precision control, and functional safety required for industrial equipment such as AC servos and industrial motors. Powered by dual Arm® Cortex®-R52 cores with a maximum frequency of 800MHz for real-time control and embedded with a large tightly coupled memory (576KB) directly connected to the CPU to realize high-performance real-time processing, RZ/T2M enables low latency access by arranging the peri | Quad Flat Packages | R9A07G075M01GFP#AA0 |
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R9A07G075M29GBG#AC0
Renesas Electronics
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1 | RZ/T2ME is an industry-leading high-performance multi-function MPU that realizes high-speed processing, high precision control industrial equipment such as AC servos and industrial motors. Powered by dual Arm® Cortex®-R52 cores with a maximum frequency of 800MHz for real-time control and embedded with a large tightly coupled memory (576KB) directly connected to the CPU to realize high-performance real-time processing, RZ/T2ME enables low latency access by arranging the peripherals for motor control to the L | BGA | R9A07G075M29GBG#AC0 |
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STM32MP233DAJ3
STMicroelectronics
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1 | Includes ST state-of-the-art patented technology.Cores• Up to 64-bit dual-core Arm® Cortex®-A35– Up to 1.5 GHz– 32-Kbyte I + 32-Kbyte D level 1 cache for each core– 512-Kbyte unified level 2 cache– Arm® NEON™ and Arm® TrustZone®• 32-bit Arm® Cortex®-M33 with FPU/MPU– Up to 400 MHz– L1 16-Kbyte I / 16-Kbyte D– Arm® TrustZone® | BGA | STM32MP233DAJ3 |
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MAX32690GWE+
Analog Devices
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1 | Arm Cortex-M4 with FPU Microcontroller and Bluetooth LE 5 for Industrial and Wearables,1.8V and 3.3V -65°C to +125°C | BGA | MAX32690GWE+ |
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STM32MP157AAA3T
STMicroelectronics
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1 | Arm® dual Cortex®-A7 800 MHz + Cortex®-M4 MPU, 3D GPU, TFT/DSI, 37 comm. interfaces, 29 timers, adv. analog | BGA | STM32MP157AAA3T |
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R9A07G044L27GBG#BC0
Renesas Electronics
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1 | The RZ/G2L microprocessor includes a Cortex®-A55 (1.2 GHz) CPU, 16-bit DDR3L / DDR4 interface, 3D graphics engine with Arm Mali-G31 and video codec (H.264). It also has many interfaces such as camera input, display output, USB 2.0, and Gbit-Ether, making it ideal for applications such as entry-class industrial human-machine interfaces (HMIs) and embedded devices with video capabilities.As a software platform for this product, Renesas provides the Verified Linux Package, which includes the Linux Kernel, midd | BGA | R9A07G044L27GBG#BC0 |
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STM32MP157AAA3
STMicroelectronics
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1 | Arm® dual Cortex®-A7 800 MHz + Cortex®-M4 MPU, 3D GPU, TFT/DSI, 37 comm. interfaces, 29 timers, adv. analog | BGA | STM32MP157AAA3 |
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STM32MP253FAL3
STMicroelectronics
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1 | Arm® based dual Cortex®-A35 1.5 GHz + Cortex®-M33 MPU with AI, 3D GPU, video encoder/decoder, TFT/DSI/LVDS, USB 3.0, PCIe®, crypto | BGA | STM32MP253FAL3 |
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R9A07G054L27GBG#AC0
Renesas Electronics
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1 | RZ/V2L is equipped with a Cortex®-A55 (1.2GHz) CPU and built-in AI accelerator "DRP-AI" for vision, which is Renesas' original technology. "DRP-AI" is configured with DRP and AI-MAC. It also has a 16-bit DDR3L/DDR4 interface and a built-in 3D graphics engine with Arm Mali-G31 and video codec (H.264).DRP-AI’s excellent power efficiency eliminates the need for heat dissipation measures such as heat sinks or cooling fans. AI can be implemented cost efficiently not only in consumer electronics and industrial eq | BGA | R9A07G054L27GBG#AC0 |
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R9A08G045S17GBG#BC0
Renesas Electronics
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1 | The RZ/G3S microprocessor includes a Cortex®-A55 (1.1GHz) CPU, 16-bit LPDDR4 or DDR4 interface and low-power mode. It also has many interfaces such as PCIe, CAN FD, and 12-bit ADC, making it ideal for applications such as IoT edge applications.As a software platform for this product, Renesas provides the Verified Linux package, which includes the Linux Kernel, middleware drivers, and basic software for this product. The Verified Linux package is verified and provided by Renesas. | BGA | R9A08G045S17GBG#BC0 |
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STM32MP157AAC3
STMicroelectronics
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1 | Arm® dual Cortex®-A7 800 MHz + Cortex®-M4 MPU, 3D GPU, TFT/DSI, 37 comm. interfaces, 29 timers, adv. analog | Other | STM32MP157AAC3 |
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79RC32K438-200BB
Renesas Electronics
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1 | 32-bit MIPS CPU core with dual on-chip 10/100 Mbps Ethernet interface, DDR controller, 32-bit PCI interface, I2C controller, DMA controller, Serial Peripheral interface | BGA | 79RC32K438-200BB |
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MC7448VU1267ND
NXP
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1 | IC MPU MPC74XX 1.267GHZ 360BGA | BGA | MC7448VU1267ND |
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SBP9989DNJ
Texas Instruments
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1 | Microprocessor, 16-Bit, 4.4MHz, Bipolar, CDIP64 | Ceramic Dual-In-Line Packages | SBP9989DNJ |
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MC7447AHX1000NB
NXP
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1 | MPU PowerPC MPC74xx Processor RISC 32-Bit 0.13um 1GHz 1.8V/2.5V 360-Pin FCCBGA Tray | BGA | MC7447AHX1000NB |
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Z84C0020VEC
LITTELFUSE
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1 | Z84C0020VEC | Plastic Leaded Chip Carrier | Z84C0020VEC |
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AM3352ZCE50
Texas Instruments
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1 | TEXAS INSTRUMENTS - AM3352ZCE50 - \u82AF\u7247, \u5FAE\u5904\u7406\u5668, SITARA, CORTEX A8, 298NFBGA | BGA | AM3352ZCE50 |
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MCF5206ECAB40
NXP
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1 | Microprocessors - MPU MCF5206E V2CORE | Quad Flat Packages | MCF5206ECAB40 |
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SAMA7G54-V/4HB
Microchip
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1 | • Arm Cortex-A7 Core– Arm TrustZone®– NEON multimedia architecture– Floating Point Unit– Embedded Trace module with instruction trace stream, including 16 Kbytes of CoreSight™ EmbeddedTrace buffer– 32 Kbytes of L1 data cache, 32 Kbytes of L1 instruction cache– 256 Kbytes of L2 cache– Up to 1 GHz operational frequency– Voltage and frequency scaling support– 64-bit generic timers• Internal Memory Architecture– 128 Kbytes of internal SRAM and 5 Kbytes of secure backup RAM– 80 Kbytes o | BGA | SAMA7G54-V/4HB |
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MC7448TVU1267ND
NXP
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1 | PowerPC G4 Microprocessor IC MPC74xx 1 Core, 32-Bit 1.267GHz 360-FCCBGA (25x25) | BGA | MC7448TVU1267ND |
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SAM9X75-V/4PB
Microchip
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1 | ARM926EJ-S Microprocessor IC SAM9X7 1 Core, 32-Bit 800MHz 240-TFBGA (11x11) 1.8V, 2.5V, 3.3V, -40°C ~ 105°C (TA) | BGA | SAM9X75-V/4PB |
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SMOMAPL138BGWTA3R
Texas Instruments
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1 | Low-Power Applications Processor | BGA | SMOMAPL138BGWTA3R |
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MCF5272CVF66
NXP
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1 | Coldfire V2 MCF527x Microcontroller IC 32-Bit 66MHz 16KB (4K x 32) ROM 196-LBGA (15x15) 3V ~ 3.6V,-40°C ~ 85°C (TA) | BGA | MCF5272CVF66 |
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![Part Image](["https://www.renesas.com/sites/default/files/rzt2m_blockdiagram-en_0.png","https://www.renesas.com/sites/default/files/rzt2m_blockdiagram-en_0.png",null])
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