D2-45 Model Download Search Results
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D2-45057-QR-T
Renesas Electronics
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1 | The D2-4P (D2-45057 and D2-45157) devices are complete System-on-Chip (SoC) Class-D digital audio amplifiers. These devices combine high performance integrated Power Stages, an optimized Audio Processor feature set, and a PWM controller to offer a complete, powerful, and very cost effective audio solution for high volume and cost-critical products. This 4th generation Digital Audio Processor (D2-4P) device combines extensive integrated Digital Signal Processor (DSP) audio processing with amplifier control f | Quad Flat No-Lead | D2-45057-QR-T |
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D2-45057-QR
Renesas Electronics
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1 | The D2-4P (D2-45057 and D2-45157) devices are complete System-on-Chip (SoC) Class-D digital audio amplifiers. These devices combine high performance integrated Power Stages, an optimized Audio Processor feature set, and a PWM controller to offer a complete, powerful, and very cost effective audio solution for high volume and cost-critical products. This 4th generation Digital Audio Processor (D2-4P) device combines extensive integrated Digital Signal Processor (DSP) audio processing with amplifier control f | Quad Flat No-Lead | D2-45057-QR |
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D2-45157-QR
Renesas Electronics
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1 | The D2-4P (D2-45057 and D2-45157) devices are complete System-on-Chip (SoC) Class-D digital audio amplifiers. These devices combine high performance integrated Power Stages, an optimized Audio Processor feature set, and a PWM controller to offer a complete, powerful, and very cost effective audio solution for high volume and cost-critical products. This 4th generation Digital Audio Processor (D2-4P) device combines extensive integrated Digital Signal Processor (DSP) audio processing with amplifier control f | Quad Flat No-Lead | D2-45157-QR |
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D2-45157-QR-T
Renesas Electronics
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1 | The D2-4P (D2-45057 and D2-45157) devices are complete System-on-Chip (SoC) Class-D digital audio amplifiers. These devices combine high performance integrated Power Stages, an optimized Audio Processor feature set, and a PWM controller to offer a complete, powerful, and very cost effective audio solution for high volume and cost-critical products. This 4th generation Digital Audio Processor (D2-4P) device combines extensive integrated Digital Signal Processor (DSP) audio processing with amplifier control f | Quad Flat No-Lead | D2-45157-QR-T |
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THVD2450VDRCR
Texas Instruments
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1 | RS-422/RS-485 Interface IC 70-V bus-fault protected, flexible IO, 3-V to 5.5-V 50-Mbps half-duplex RS-485 transceiver | Other | THVD2450VDRCR |
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THVD2450DRBR
Texas Instruments
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1 | Texas Instruments ??70-V fault-protected 3.3-V to 5-V RS-485 transceiver with IEC ESD 8-SON -40 to 125 | Small Outline No-lead | THVD2450DRBR |
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THVD2452VDREP
Texas Instruments
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1 | Enhanced: 3V to 5.5V, 50Mbps, full-duplex RS-485 transceiver, with flexible IO and 70V bus-fault< | Small Outline Packages | THVD2452VDREP |
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MW-11-03-G-D-245-065
SAMTEC
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1 | Board to Board & Mezzanine Connectors 1.00 mm Flex Stack, Flexible Micro Board Stacker, Surface Mount | Other | MW-11-03-G-D-245-065 |
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RK73B2ATTD245J
KOA Speer
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1 | Thick Film Resistors - SMD 1/4watts 2.4Mohms 5% | Resistor Chip | RK73B2ATTD245J |
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74AVC4TD245BQ-Q10X
Nexperia
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1 | 74AVC4TD245-Q100 - 4-bit dual supply translating transceiver with configurable voltage translation; 3-state@en-us | Other | 74AVC4TD245BQ-Q10X |
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TXD2-4.5V-1
Panasonic
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1 | 6,000 V surge withstand voltage, 2 Form C and 2 A high dielectric strength relays | Other | TXD2-4.5V-1 |
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MW-12-03-G-D-245-065-A
SAMTEC
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1 | Board to Board & Mezzanine Connectors 1.00 mm Flex Stack, Flexible Micro Board Stacker, Surface Mount | Other | MW-12-03-G-D-245-065-A |
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THVD2450DGKR
Texas Instruments
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1 | RS-485 Interface IC -70-V fault-protected 3.3-V to 5-V RS-485 transceiver with IEC ESD 8-VSSOP -40 to 125 | Small Outline Packages | THVD2450DGKR |
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FD2450017
Diodes Incorporated
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1 | Standard Clock Oscillators 24.576 MHz, 3.3V LVCMOS, 50 ppm | Other | FD2450017 |
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PTHVD2452VDR
Texas Instruments
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1 | THVD24xxV ±70V Fault-Protected 3V to 5.5V RS-485 Transceivers with Flexible I/OSupply and IEC ESD | Small Outline Packages | PTHVD2452VDR |
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MTMM-109-05-L-D-245
SAMTEC
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1 | Conn Unshrouded Header HDR 18 POS 2mm Solder ST Top Entry Thru-Hole Bulk | Header, Vertical | MTMM-109-05-L-D-245 |
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RK73H1JTTD245F
KOA Speer
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1 | 2.4MΩ 0603 Thick Film Surface Mount Resistor ±1% 0.1W RK73H1JTTD245F | Resistor Chip | RK73H1JTTD245F |
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THVD2452VDR
Texas Instruments
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1 | 1/1 Transceiver Full RS422, RS485 14-SOIC | Small Outline Packages | THVD2452VDR |
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ASGTX-D-24.576MHZ-1
ABRACON
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1 | XTAL OSC XO 3.6864MHZ HCMOS SMD | Other | ASGTX-D-24.576MHZ-1 |
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CMD245C4
Qorvo
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1 | 6-18 GHz (C, X, Ku Band) Low Phase Noise Amplifier MMIC | Other | CMD245C4 |
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FXL2TD245L10X
onsemi
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1 | Fully configurable: Inputs track VCC level ; Non-preferential power-up sequencing; either VCC may be powered-up first ; Bi-directional interface between any 2 levels from 1.1V to 3.6V ; ESD protection exceeds: – 4kV HBM ESD (per JESD22-A114 & Mil Std 883e 3015.7) – 8kV HBM I/O to GND ESD (per JESD22-A114 & Mil Std 883e 3015.7) – 1kV CDM ESD (per ESD STM 5.3) – 200V MM ESD (per JESD22-A115 & ESD STM5.2); Control inputs (T/Rn, OE) levels are referenced to VCCA voltage ; Packaged in the Chipscale MicroPak10 (1 | Other | FXL2TD245L10X |
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TXD2-4.5V
Panasonic
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1 | 6,000 V surge withstand voltage, 2 Form C and 2 A high dielectric strength relays | Other | TXD2-4.5V |
3
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74AVC4TD245PW,118
Nexperia
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1 | 74AVC4TD245PW - 4-bit dual supply translating transceiver with configurable voltage translation;3-state@en-us | Small Outline Packages | 74AVC4TD245PW,118 |
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ASGTXD24576MHZ1
ABRACON
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1 | Abracon Frequency Control - ASGTX-D-24.576MHz-1 | Other | ASGTXD24576MHZ1 |
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FXL4TD245UMX
onsemi
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1 | Non-preferential power-up sequencing; either VCC may be powered-up first ; ESD Protection Exceeds: ; Outputs switch to 3-STATE if either VCC is at GND ; 200V MM ESD (per JESD22-A115 & ESD STM5.2); Outputs remain in 3-STATE until active VCC level is reached ; Power-off protection ; 1kV CDM ESD (per ESD STM 5.3); 4kV HBM ESD(per JESD22-A114 & Mil Std 883e 3015.7); Fully configurable: Inputs track VCC level ; 8kV HBM I/O to GND ESD (per JESD22-A114 & Mil Std 883e 3015.7); Packaged in 16-terminal DQFN (2.5mm x | Other | FXL4TD245UMX |
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![Part Image](["https://componentsearchengine.com/Images/1/D2-45057-QR-T.jpg",null,null])
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