Showing 25 of 10385 results
| Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action |
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| Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action |
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W29N01HVBKNF
Winbond
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1 | 1Gb SLC NAND Flash MHz VFBGA63 | BGA | W29N01HVBKNF |
3
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W25Q64JWUUSQ
Winbond
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1 | 64Mb Serial NOR Flash 104MHz SON8 | Other | W25Q64JWUUSQ |
3
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W632GG8MB15S
Winbond
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1 | SDRAM - DDR3 Memory IC 1Gbit Parallel 667 MHz 20 ns 78-VFBGA (10.5x8) | BGA | W632GG8MB15S |
3
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W631GG8NB15S
Winbond
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1 | Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received w | BGA | W631GG8NB15S |
3
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W25N02JWZEIF
Winbond
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1 | 2Gb QspiNAND Flash 166MHz SON8 | Small Outline No-lead | W25N02JWZEIF |
3
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W958D8NBYA5I
Winbond
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1 | 256Mb HYPERRAM 400MHz TFBGA (5X5)24 | BGA | W958D8NBYA5I |
3
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W25Q16JWZPSM
Winbond
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1 | New Family of SpiFlash Memories– W25Q16JW: 16M-bit / 2M-byte– Standard SPI: CLK, /CS, DI, DO– Dual SPI: CLK, /CS, IO0, IO1,– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Quad I/O SPI clocks– 66MB/S continuous data transfer rate– Min. 100K Program-Erase cycles– More than 20-year data retention Low Power, Wide Temperature Range– Single 1.65V to 1.95V supply– <0.1µA Power-down (typ.)– -40°C to +85°C operating range | Small Outline No-lead | W25Q16JWZPSM |
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W25Q16JWSSAQ
Winbond
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1 | New Family of SpiFlash Memories– W25Q16JW: 16M-bit / 2M-byte– Standard SPI: CLK, /CS, DI, DO– Dual SPI: CLK, /CS, IO0, IO1,– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Quad I/O SPI clocks– 66MB/S continuous data transfer rate– Min. 100K Program-Erase cycles– More than 20-year data retention Low Power, Wide Temperature Range– Single 1.65V to 1.95V supply– <0.1µA Power-down (typ.)– -40°C to +85°C operating range | Small Outline Packages | W25Q16JWSSAQ |
3
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W97AH2KBVX2E
Winbond
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1 | VFBGA134 | BGA | W97AH2KBVX2E |
3
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Download Model |
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W9751G6NB-3J
Winbond
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1 | DDR2 SDRAM 667MHz | BGA | W9751G6NB-3J |
3
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W25Q32JVSNJQ
Winbond
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1 | 32Mb Serial NOR Flash 133MHz SOP8 | Small Outline Packages | W25Q32JVSNJQ |
3
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W634GU6RB09A
Winbond
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1 | DDR3 SDRAM 2133MHz | BGA | W634GU6RB09A |
3
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W9816G6JH-6
Winbond
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1 | SDRAM 166MHz TSOPII50 | Small Outline Packages | W9816G6JH-6 |
3
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W25Q01JVSFJQ
Winbond
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1 | 1Gb Serial NOR Flash 133MHz SOP16 | Small Outline Packages | W25Q01JVSFJQ |
3
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W634GU8NB15A
Winbond
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1 | DDR3 SDRAM 1333MHz | BGA | W634GU8NB15A |
3
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Download Model |
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W631GU6NB15A
Winbond
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1 | 1Gb DDR3 SDRAM 1333MHz VFBGA96 | BGA | W631GU6NB15A |
3
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Download Model |
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W97AH2KBVA1W
Winbond
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1 | PACKAGE-134BGA | BGA | W97AH2KBVA1W |
3
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Download Model |
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W9712G6KB25A
Winbond
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1 | 128Mb DDR2 SDRAM 800MHz TFBGA 84 | BGA | W9712G6KB25A |
3
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W989D2DBJX6E
Winbond
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1 | 512Mb Low Power SDR SDRAM 166MHz VFBGA90 1.8V/1.8V | BGA | W989D2DBJX6E |
3
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Download Model |
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W9751G8NB25W
Winbond
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1 | Power Supply: VDD, VDDQ = 1.8 V ± 0.1V Double Data Rate architecture: two data transfers per clock cycle CAS Latency: 3, 4, 5, 6 and 7 Burst Length: 4 and 8 Bi-directional, differential data strobes (DQS andDQS) are transmitted / received with data Edge-aligned with Read data and center-aligned with Write data DLL aligns DQ and DQS transitions with clock Differential clock inputs (CLK andCLK) Data masks (DM) for write data Commands entered on each positive CLK edge, data | BGA | W9751G8NB25W |
3
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W632GU6RB09A
Winbond
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1 | 2Gb DDR3 SDRAM 2133MHz VFBGA96 | BGA | W632GU6RB09A |
3
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Download Model |
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W25Q512JVEJQ
Winbond
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1 | SON8 | Small Outline No-lead | W25Q512JVEJQ |
3
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Download Model |
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W631GG8MB12K
Winbond
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1 | Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received wit | BGA | W631GG8MB12K |
3
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Download Model |
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W631GU8NB09A
Winbond
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1 | DDR3 SDRAM 2133MHz | BGA | W631GU8NB09A |
3
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Download Model |
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W25Q16JVUXAM
Winbond
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1 | New Family of SpiFlash Memories– W25Q16JV: 16M-bit / 2M-byte (2,097,152)– Standard SPI: CLK, /CS, DI, DO– Dual SPI: CLK, /CS, IO0, IO1– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Single, Dual/Quad SPI clocks– 266/532MHz equivalent Dual/Quad SPI– 66MB/S continuous data transfer rate– Min. 100K Program-Erase cycles per sector– More than 20-year data retention Efficient “Continuous Read”– Continuous Read with 8/16/ | Small Outline No-lead | W25Q16JVUXAM |
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