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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	W29N01HVDINF Winbond	1	1Gb SLC NAND Flash MHz VFBGA48	BGA	W29N01HVDINF	3D model available Symbol and footprint available 3	1 Download Model
	W634GG6NB11I Winbond	1	4Gb DDR3 SDRAM 1866MHz VFBGA96	BGA	W634GG6NB11I	3D model available Symbol and footprint available 3	1 Download Model
	W971GG6NB-18 Winbond	1	SDRAM - DDR2 Memory IC 1Gbit SSTL_18 533 MHz 58.125 ns 84-TFBGA (8x12.5)	BGA	W971GG6NB-18	3D model available Symbol and footprint available 3	1 Download Model
	W25Q16JLZPIG Winbond	1	16Mb Serial NOR Flash 104MHz SON8	Small Outline No-lead	W25Q16JLZPIG	3D model available Symbol and footprint available 3	1 Download Model
	W9751G6NB-3I Winbond	1	DDR2 SDRAM 667MHz	BGA	W9751G6NB-3I	3D model available Symbol and footprint available 3	1 Download Model
	W9751G8NB-3I Winbond	1	 Power Supply: VDD, VDDQ = 1.8 V ± 0.1V Double Data Rate architecture: two data transfers per clock cycle CAS Latency: 3, 4, 5, 6 and 7 Burst Length: 4 and 8 Bi-directional, differential data strobes (DQS andDQS) are transmitted / received with data Edge-aligned with Read data and center-aligned with Write data DLL aligns DQ and DQS transitions with clock Differential clock inputs (CLK andCLK) Data masks (DM) for write data Commands entered on each positive CLK edge, data	BGA	W9751G8NB-3I	3D model available Symbol and footprint available 3	1 Download Model
	W25Q16JVZPJM Winbond	1	16Mb Serial NOR Flash 133MHz SON8	Small Outline No-lead	W25Q16JVZPJM	3D model available Symbol and footprint available 3	1 Download Model
	W25Q512JVBIM Winbond	1	512Mb Serial NOR Flash 133MHz TFBGA (5X5)24	BGA	W25Q512JVBIM	3D model available Symbol and footprint available 3	1 Download Model
	W948V6KBHX6I Winbond	1	256Mb Low Power DDR SDRAM 333MHz VFBGA60	BGA	W948V6KBHX6I	3D model available Symbol and footprint available 3	1 Download Model
	W25X40CLSNIG Winbond	1	4Mb Serial NOR Flash 104MHz SOP8	Small Outline Packages	W25X40CLSNIG	3D model available Symbol and footprint available 3	1 Download Model
	W29N02GVBIAA Winbond	1	2Gb SLC NAND Flash MHz VFBGA63	BGA	W29N02GVBIAA	3D model available Symbol and footprint available 3	1 Download Model
	W25Q16JVZPJQ Winbond	1	New Family of SpiFlash Memories– W25Q16JV: 16M-bit / 2M-byte (2,097,152)– Standard SPI: CLK, /CS, DI, DO– Dual SPI: CLK, /CS, IO0, IO1– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Single, Dual/Quad SPI clocks– 266/532MHz equivalent Dual/Quad SPI– 66MB/S continuous data transfer rate– Min. 100K Program-Erase cycles per sector– More than 20-year data retention Efficient “Continuous Read”– Continuous Read with 8/16/32	Small Outline No-lead	W25Q16JVZPJQ	3D model available Symbol and footprint available 3	1 Download Model
	W25Q01NWSFJQ Winbond	1	 New Family of SpiFlash Memories– W25Q01NW: two 512M-bit / 128M-byte– Standard SPI: CLK, /CS, DI, DO– Dual SPI: CLK, /CS, IO0, IO1,– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– 3 or 4-Byte Addressing Mode– Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Standard/Dual/Quad SPI clocks– 266/532MHz equivalent Dual/Quad SPI– 66MB/S continuous data transfer rate– Min. 100K Program-Erase cycles– More than 20-year data retention Efficient “Continuous Read”– Quad Peri	Small Outline Packages	W25Q01NWSFJQ	3D model available Symbol and footprint available 3	1 Download Model
	W25N02KWTBJU Winbond	1	 New W25N Family of QspiNANDMemories– W25N02KW: 2G-bit / 256M-Byte– Standard SPI: CLK, /CS, DI, DO, /WP,/Hold– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– Compatible SPI serial flash commands Highest Performance Serial NAND Flash– 104MHz Standard/Dual/Quad SPI clocks– 208/416MHz equivalent Dual/Quad SPI– 50MB/S sequential data transfer rate– Fast Program/Erase performance– 100,000 erase/program cycles(5) (6)– 10-year data retention Low P	BGA	W25N02KWTBJU	3D model available Symbol and footprint available 3	1 Download Model
	W29N01HZSINA Winbond	1	Basic Features– Density: 1Gbit (Single chip solution)– Vcc: 1.7V to 1.95V– Bus width: x8, x16– Operating temperature Industrial: -40°C to 85°C Industrial Plus: -40°C to 105°C Single-Level Cell (SLC) technology. Organization– Density: 1G-bit/128M-byte– Page size 2,112 bytes (2048 + 64 bytes) 1,056 words (1024 + 32 words)– Block size 64 pages (128K + 4K bytes) 64 pages (64K + 2K words) Highest Performance– Read performance (Max.) Random read: 25us Sequential re	Small Outline Packages	W29N01HZSINA	3D model available Symbol and footprint available 3	1 Download Model
	W25Q64JVTBSQ Winbond	1	64Mb Serial NOR Flash 133MHz TFBGA (5X5)24	BGA	W25Q64JVTBSQ	3D model available Symbol and footprint available 3	1 Download Model
	W29N01HZBINF Winbond	1	1Gb SLC NAND Flash MHz VFBGA63	BGA	W29N01HZBINF	3D model available Symbol and footprint available 3	1 Download Model
	W66AQ6NBHAHK Winbond	1	VFBGA100	BGA	W66AQ6NBHAHK	3D model available Symbol and footprint available 3	1 Download Model
	W9725G6KB25K Winbond	1	256Mb DDR2 SDRAM 800MHz WBGA84	BGA	W9725G6KB25K	3D model available Symbol and footprint available 3	1 Download Model
	W632GG6MB12K Winbond	1	Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received wit	BGA	W632GG6MB12K	3D model available Symbol and footprint available 3	1 Download Model
	W25Q512NWBJM Winbond	1	 New Family of SpiFlash Memories– W25Q512NW: 512M-bit / 64M-byte– Standard SPI: CLK, /CS, DI, DO, /WP, /Hold– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– SPI/QPI DTR (Double Transfer Rate) Read– 3 or 4-Byte Addressing Mode– Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Standard/Dual/Quad SPI clocks– 266/532MHz equivalent Dual/Quad SPI– 66MB/S continuous data transfer rate– Min. 100K Program-Erase cycles– More than 20-y	BGA	W25Q512NWBJM	3D model available Symbol and footprint available 3	1 Download Model
	W25Q32JWUUSM Winbond	1	FLASH - NOR Memory IC 32Mbit SPI - Quad I/O 133 MHz 8-USON (4x3)	Other	W25Q32JWUUSM	3D model available Symbol and footprint available 3	1 Download Model
	W9751G6KB18W Winbond	1	DDR2 SDRAM 1066MHz	BGA	W9751G6KB18W	3D model available Symbol and footprint available 3	1 Download Model
	W632GU6RB11S Winbond	1	2Gb DDR3 SDRAM 1866MHz VFBGA96	BGA	W632GU6RB11S	3D model available Symbol and footprint available 3	1 Download Model
	W25N02KWTBJR Winbond	1	 New W25N Family of QspiNANDMemories– W25N02KW: 2G-bit / 256M-Byte– Standard SPI: CLK, /CS, DI, DO, /WP,/Hold– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– Compatible SPI serial flash commands Highest Performance Serial NAND Flash– 104MHz Standard/Dual/Quad SPI clocks– 208/416MHz equivalent Dual/Quad SPI– 50MB/S sequential data transfer rate– Fast Program/Erase performance– 100,000 erase/program cycles(5) (6)– 10-year data retention Low P	BGA	W25N02KWTBJR	3D model available Symbol and footprint available 3	1 Download Model
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